Abstract: The present invention discloses an integral LED component which integrates LED epitaxial structures electrodes and interconnect with a package substrate together and an integral manufacturing process thereof. The integral LED component can be made with multiple epitaxial structures or with just a single epitaxial structure. The integral LED component can be mounted into a hollow carrier. And by having support by the hollow carrier, the package substrate can be mounted and contacted with a heat conductive or a dissipation device. The integral LED component is fabricated by wafer level process and cut from the wafer as an independent component. By different manufacturing process, the integral LED component can be made as Vertical LED structure or Lateral LED structure.

Abstract: The invention discloses a LED light source, comprising a control circuit module, a shell, an energy conversion component, a heat pipe, and a cooling component. The shell comprises a dome and a side wall, and the shell contains the control circuit module. The energy conversion component comprises a substrate, a substrate holder, and at least a LED, wherein the LED is disposed on the substrate, the substrate is connected to the substrate holder, and the substrate holder is coupled to the control circuit module to drive the energy conversion component. The heat pipe comprises a flat part, an extension part, and a contact part, wherein the substrate and the substrate holder of the energy conversion component are disposed on the flat part; the extension part, disposed inside the shell, extends toward a direction. The cooling component comprises a plurality of fins, wherein the fins contacts the contact part respectively.

Abstract: The invention relates to a light-emitting apparatus. The light-emitting apparatus includes a heat-conducting/dissipating module and at least one semiconductor light-emitting module. The heat-conducting/dissipating module includes a substantially cylindrical heat-conducting device having at least one flat portion and at least one heat-dissipating fin mounted on the circumference of the heat-conducting device. The at least one semiconductor light-emitting module includes a carrier, a plurality of exterior electrodes, at least one semiconductor light-emitting die, and at least two conducting wires. The carrier is flatly mounted on the flat portion of the heat-conducting device. The plurality of exterior electrodes is disposed on the carrier. The at least one semiconductor light-emitting die is mounted on the carrier and respectively connected to the plurality of exterior electrodes.

Abstract: The invention provides a light-emitting diode illumination apparatus. The light-emitting diode illumination apparatus includes a tube, a chamber, a porous capillary diversion layer, at least one heat-dissipating fin, and a diode light-emitting module. The tube has a first opening. The chamber has a second opening and a flat end. The second opening is engaged to the first opening. The porous capillary diversion layer is formed in the tube and the chamber. The tube and the chamber form a sealed space. The sealed space accommodates a working fluid. A section area of the chamber is larger than a section area of the tube. The at least one heat-dissipating fin is disposed on a circumference of the tube. The diode light-emitting module is disposed on the flat end.

Abstract: The invention provides a packaged system that is suitable for a LED package of high power. The packaged system further includes a heat-conducting device surrounded by at least one heat-dissipating fin to effectively dissipate the heat generated by the high power LED package. The packaged system with high efficiency of heat dissipation can be incorporated into various projecting illuminating equipments, such as a flashlight or floodlight, by simply installing the present invention into a housing and providing power connection thereto.

Abstract: The invention provides a LED illuminating equipment with high power and high heat-dissipating efficiency. The LED illuminating equipment of the invention includes a plurality of diode light-emitting apparatuses. Particularly, the heat generated by the diode light-emitting apparatuses in operation is conducted to a heat-dissipating plate device and the heat-dissipating fins. Besides, the heat is uniformly distributed over the heat-dissipating plate device and further dissipated by the heat-dissipating plate device and the heat-dissipating fins extending thereon.

Abstract: The invention provides a semiconductor high-power light-emitting module including a heat-dissipating member, a heat-conducting device, and a diode light-emitting device. The heat-dissipating member includes an isolator member coupled to a first side of the heat-dissipating member. The heat-dissipating member has a second side opposite to the first side. The isolator member has a third side opposite to the first side. The environment temperature at the third side is higher than that at the second side. The heat-conducting device has a flat end and a contact portion tightly mounted on the heat-dissipating member. The diode light-emitting device is disposed on the flat end of the heat-conducting device. The semiconductor light-emitting module of the invention, applied to a headlamp of an automobile, has properties of saving electricity and long life, and furthermore the capability of integrating the heat-dissipating member into a shell of the automobile is both artistic and practical.

Abstract: A flip chip type LED lighting device manufacturing method includes the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cutting the structure thus obtained into individual flip chip type LED lighting devices.

Abstract: The invention relates to a light-emitting diode cluster lamp. The light-emitting diode cluster lamp includes a plurality of light-emitting diode lamp packages, a control circuit, and a casing. Each of the light-emitting diode lamp packages includes a heat-conducting/dissipating module and a light-emitting diode module. The control circuit module is used for controlling the light-emitting diode lamp packages. The casing is adapted to accommodate the light-emitting diode lamp packages and the control circuit module. When the light-emitting diode cluster lamp is connected to a power source, the control circuit module selectively makes the light-emitting diode modules emit light. The heat generated during the light emission of each of the light-emitting diode modules is conducted and dissipated by the corresponding heat-conducting/dissipating module of each of the light-emitting diode modules.

Abstract: A system in package, high power, and highly efficient diode lamp is provided. The diode lamp includes a heat-conducting/heat-dissipating module, a LED light module, an optical module, and a control circuit module. The heat-conducting/heat-dissipating module includes a heat-conducting device and at least one heat-dissipating fin. The LED light module is disposed on a flat portion of the heat-conducting device. The optical module focuses the light emitted by the LED light module. The control circuit module is used to control the LED light module. When the diode lamp is electrically connected to a power supply, the control circuit module selectively controls the LED light module to emit the light. The heat generated during the operation of the LED light module is conducted from the flat portion of the heat-conducting device to the at least one heat-dissipating fin, and then it is dissipated by the at least one heat-dissipating fin.

Abstract: The invention relates to a light-emitting display including a front plate, N heat-conducting/dissipating apparatuses, and N light-emitting apparatuses, wherein N is a natural number. The front plate has N formed-through apertures thereon. Each of the N heat-conducting/dissipating apparatuses, corresponding to one of the N formed-through apertures and one of the N light-emitting apparatuses, is inserted into the corresponding aperture via a neck portion thereof. Each of the N light-emitting apparatuses is mounted on the flat portion of the corresponding heat-conducting/dissipating apparatus. Thereby, the heat generated during the operation of each of the N light-emitting apparatuses is conducted by the corresponding heat-conducting/dissipating apparatus to the back side of the front plate, and then it is dissipated by the corresponding heat-conducting/dissipating apparatus.

Abstract: The invention provides a light-emitting diode illuminating equipment. The light-emitting diode illuminating equipment of the invention includes a heat-dissipating plate device, a plurality of heat-dissipating fins, a diode light-emitting apparatus, a plurality of heat-conducting devices, and a shield device. The heat-dissipating fins extend from a surface of the heat-dissipating plate device. By tightly mounting the heat-conducting devices on the surface of the heat-dissipating plate device and disposing between the heat-dissipating fins, heat generated during the operation of the diode light-emitting apparatus is distributed uniformly on the heat-dissipating plate device and the heat-dissipating fins due to the high efficiency heat-conducting of the heat-conducting devices, and then is dissipated. Besides, the shield device has a waterproof passage for a power cord passing through to power a control circuit, such that the light-emitting diode illuminating equipment is adapted to be installed outdoors.

Abstract: The invention provides a semiconductor light-emitting device package structure. The semiconductor light-emitting device package structure includes a substrate, N sub-mounts, and N semiconductor light-emitting die modules, wherein N is a positive integer lager than or equal to 1. Each of the sub-mounts is embedded on the substrate and exposed partially. Each of the semiconductor light-emitting die modules is mounted on the exposed surface of one of the sub-mounts.

Abstract: The invention provides a LED illuminating equipment with high power and high heat-dissipating efficiency. The LED illuminating equipment of the invention includes a plurality of diode light-emitting apparatuses. Particularly, the heat generated by the diode light-emitting apparatuses in operation is conducted to a heat-dissipating plate device and the heat-dissipating fins. Besides, the heat is uniformly distributed over the heat-dissipating plate device and further dissipated by the heat-dissipating plate device and the heat-dissipating fins extending thereon.

Abstract: The invention relates to a light-emitting apparatus. The light-emitting apparatus includes a heat-conducting/dissipating module and at least one semiconductor light-emitting module. The heat-conducting/dissipating module includes a substantially cylindrical heat-conducting device having at least one flat portion and at least one heat-dissipating fin mounted on the circumference of the heat-conducting device. The at least one semiconductor light-emitting module includes a carrier, a plurality of exterior electrodes, at least one semiconductor light-emitting die, and at least two conducting wires. The carrier is flatly mounted on the flat portion of the heat-conducting device. The plurality of exterior electrodes is disposed on the carrier. The at least one semiconductor light-emitting die is mounted on the carrier and respectively connected to the plurality of exterior electrodes.

Abstract: The invention provides light-emitting diode illuminating equipment with high power and high heat-dissipation efficiency. The light-emitting diode illuminating equipment comprises a casing and N first packaged systems. Each of the first packaged systems comprises a first heat pipe, at least one first heat-dissipating fin, and a first diode light-emitting apparatus. Wherein a heat generated during the operation of the first diode light-emitting apparatus is conducted by the first heat pipe from the flat portion of the first heat pipe to the at least one first heat-dissipating fin, and then is dissipated by the at least one first heat-dissipating fin. In particular, the light-emitting diode illuminating equipment, according to the invention, is very suitable to be used as a street lamp.