Assembled floor module
Description
The assembled floor modules shown by broken lines are for the purpose of illustrating that form no part of the claimed design.
Claims
The ornamental design for an assembled floor module, as shown and described.
Referenced Cited
Patent History
Patent number: D633219
Type: Grant
Filed: Jan 16, 2009
Date of Patent: Feb 22, 2011
Inventor: Ying-Kuang Lai (Dongguan, Guangdong)
Primary Examiner: Doris Clark
Attorney: Global IP Services
Application Number: 29/330,948
Type: Grant
Filed: Jan 16, 2009
Date of Patent: Feb 22, 2011
Inventor: Ying-Kuang Lai (Dongguan, Guangdong)
Primary Examiner: Doris Clark
Attorney: Global IP Services
Application Number: 29/330,948
Classifications
Current U.S. Class:
Panel, Tile Or Applique Of Floor, Wall, Roof, Etc. (21) (D25/138)