Device packaging assembly
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The broken lines are included for the purpose of illustrating a portion of the device packaging assembly that forms no part of the claimed design.
Claims
The ornamental design for a device packaging assembly, as shown and described.
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Type: Grant
Filed: Nov 13, 2009
Date of Patent: Mar 1, 2011
Assignee: RadioShack Corporation (Fort Worth, TX)
Inventor: Louie Reynolds (Fort Worth, TX)
Primary Examiner: Catherine Tuttle
Application Number: 29/350,293