Earphone assembly

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Description

FIG. 1 is an earphone assembly, shown in an exploded perspective view for indeterminate length, showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Separate portions of the claimed design shown respectively in FIGS. 1 and 4-7 to indicate that no particular length between the separate portions is claimed are bracketed to disclose and depict the claimed design as a whole.

Claims

The ornamental design for an earphone assembly, as shown and described.

Referenced Cited
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Patent History
Patent number: D648315
Type: Grant
Filed: May 27, 2010
Date of Patent: Nov 8, 2011
Assignee: Cheng Uei Precision Industry Co., Ltd. (Tu-Cheng, Taipei Hsiein)
Inventor: Hsing-Yi Kao (Tu-Cheng)
Primary Examiner: Paula Greene
Attorney: Cheng-Ju Chiang
Application Number: 29/362,637
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)