Cover of an electronic device having surface ornamentation
The present application is related to copending U.S. patent applications Ser. No. 29/415,338, 29/415,537, 29/415,534, 29/415,340, 29/415,530, 29/415,529, 29/415,528, 29/415,526, 29/415,524, 29/415,523, 29/415,521, 29/415,634, 29/415,633, 29/415,520, 29/415,632, 29/415,631, 29/415,629, 29/415,628, 29/415,635, 29/415,630, 29/415,636, each entitled “Cover of an Electronic Device Having Surface Ornamentation”, by Bin Li. These applications have the same assignee as the present application and have been concurrently filed herewith. The above-identified applications are incorporated herein by reference.
In
Claims
The ornamental design for a cover of an electronic device having surface ornamentation, as shown and described.
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Type: Grant
Filed: Mar 12, 2012
Date of Patent: Sep 25, 2012
Assignee: FIH (Hong Kong) Limited (Kowloon)
Inventor: Bin Li (Shenzhen)
Primary Examiner: Carla Jobe Wright
Attorney: Altis Law Group, Inc.
Application Number: 29/415,532