Core for electronic component
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Description
Claims
The ornamental design for a core for electronic component, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
3898601 | August 1975 | Meindl |
4424504 | January 3, 1984 | Mitsui et al. |
D280810 | October 1, 1985 | Mitsui |
4745388 | May 17, 1988 | Billings et al. |
D330541 | October 27, 1992 | Burrow et al. |
D384333 | September 30, 1997 | Suzuki |
D463365 | September 24, 2002 | Sakai et al. |
6696913 | February 24, 2004 | Meuche et al. |
D537778 | March 6, 2007 | Miyazaki |
D539220 | March 27, 2007 | Iwakura |
D550622 | September 11, 2007 | Shih |
S-860018 | January 1993 | JP |
Patent History
Patent number: D669854
Type: Grant
Filed: Sep 17, 2010
Date of Patent: Oct 30, 2012
Assignee: TDK Corporation (Tokyo)
Inventors: Katsumi Kobayashi (Tokyo), Masaaki Iwakura (Tokyo)
Primary Examiner: Derrick Holland
Attorney: Oliff & Berridge, PLC
Application Number: 29/375,108
Type: Grant
Filed: Sep 17, 2010
Date of Patent: Oct 30, 2012
Assignee: TDK Corporation (Tokyo)
Inventors: Katsumi Kobayashi (Tokyo), Masaaki Iwakura (Tokyo)
Primary Examiner: Derrick Holland
Attorney: Oliff & Berridge, PLC
Application Number: 29/375,108
Classifications
Current U.S. Class:
Element Or Attachment (D13/118)