Cover of an electronic device having surface ornamentation
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The present application is related to copending U.S. patent application Ser. Nos. 29/425,170, 29/425,172, 29/425,438, and 29/425,440, each, entitled “Cover of an Electronic Device Having Surface Ornamentation”, by Bin Li. These applications have the same assignee as the present application and have been concurrently filed herewith. The above-identified applications are incorporated herein by reference.
In
Claims
The ornamental design for a cover of an electronic device having surface ornamentation, as shown and described.
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Type: Grant
Filed: Jun 22, 2012
Date of Patent: Nov 13, 2012
Assignee: FIH (Hong Kong) Limited (Kowloon)
Inventor: Bin Li (Shenzhen)
Primary Examiner: Carla Jobe Wright
Attorney: Altis Law Group, Inc.
Application Number: 29/425,437