Cover of an electronic device having surface ornamentation
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The present application is related to copending U.S. patent application Ser. Nos. 29/425,174, 29/425,175, 29/425,441, 29/425,177, 29/425,179, 29/425,182, 29/425,183, and 29/425,186, each entitled “Cover of an Electronic Device Having Surface Ornamentation”, by Bin Li. These applications have the same assignee as the present application and have been concurrently filed herewith. The above-identified applications are incorporated herein by reference.
In
Claims
The ornamental design for a cover of an electronic device having surface ornamentation, as shown and described.
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- Electroplating Hollow Pattern PC Case, Gold Hard Back Cover for iPhone 4S/4, <URL:http://www.amazon.com/gp/product/images/B0088LT7IE/ref=dp—image—0?ie=UTF8&n=2335752011&s=wireless>, retrieved from internet on Sep. 10, 2012.
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Type: Grant
Filed: Jun 20, 2012
Date of Patent: Dec 4, 2012
Assignee: FIH (Hong Kong) Limited (Kowloon)
Inventor: Bin Li (Shenzhen)
Primary Examiner: Carla Jobe Wright
Attorney: Altis Law Group, Inc.
Application Number: 29/425,180