Chip assembly
Description
Claims
The ornamental design for a chip assembly, as shown.
Patent History
Patent number: D675582
Type: Grant
Filed: Jun 27, 2011
Date of Patent: Feb 5, 2013
Assignee: Uninet Imaging, Inc. (Hawthorne, CA)
Inventors: Ken Segler (North Las Vegas, NV), Joseph Cachia (Las Vegas, NV)
Primary Examiner: Thomas Johannes
Application Number: 29/396,216
Type: Grant
Filed: Jun 27, 2011
Date of Patent: Feb 5, 2013
Assignee: Uninet Imaging, Inc. (Hawthorne, CA)
Inventors: Ken Segler (North Las Vegas, NV), Joseph Cachia (Las Vegas, NV)
Primary Examiner: Thomas Johannes
Application Number: 29/396,216
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)