Main housing for optical sub-assembly for transceivers

- Ezconn Corporation
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Description

FIG. 1 is a top, front and left perspective view of a main housing for optical sub-assembly for transceivers showing my design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a rear elevation view thereof;

FIG. 4 is a left side elevation view thereof;

FIG. 5 is a right side elevation view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a bottom, rear and right perspective view thereof.

The broken line showing of the main housing for the optical sub-assembly for transceivers is for the purpose of illustrating environmental structure and forms no part of the claimed design.

Claims

The ornamental design for a main housing for optical sub-assembly for transceivers, as shown and described.

Referenced Cited
U.S. Patent Documents
D304904 December 5, 1989 Kercher
D343889 February 1, 1994 Stonecypher
D389802 January 27, 1998 Vernon
D418109 December 28, 1999 Lok
D475014 May 27, 2003 Kano
D534492 January 2, 2007 Oohira
D536302 February 6, 2007 Hayashi et al.
D594415 June 16, 2009 Shitakata
20070230878 October 4, 2007 Nakazawa et al.
Patent History
Patent number: D686573
Type: Grant
Filed: May 12, 2011
Date of Patent: Jul 23, 2013
Assignee: Ezconn Corporation (Taipei)
Inventor: Chin-Tsung Wu (Taipei)
Primary Examiner: Derrick Holland
Application Number: 29/391,700