Main housing for optical sub-assembly for transceivers
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Description
The broken line showing of the main housing for the optical sub-assembly for transceivers is for the purpose of illustrating environmental structure and forms no part of the claimed design.
Claims
The ornamental design for a main housing for optical sub-assembly for transceivers, as shown and described.
Referenced Cited
U.S. Patent Documents
D304904 | December 5, 1989 | Kercher |
D343889 | February 1, 1994 | Stonecypher |
D389802 | January 27, 1998 | Vernon |
D418109 | December 28, 1999 | Lok |
D475014 | May 27, 2003 | Kano |
D534492 | January 2, 2007 | Oohira |
D536302 | February 6, 2007 | Hayashi et al. |
D594415 | June 16, 2009 | Shitakata |
20070230878 | October 4, 2007 | Nakazawa et al. |
Patent History
Patent number: D686573
Type: Grant
Filed: May 12, 2011
Date of Patent: Jul 23, 2013
Assignee: Ezconn Corporation (Taipei)
Inventor: Chin-Tsung Wu (Taipei)
Primary Examiner: Derrick Holland
Application Number: 29/391,700
Type: Grant
Filed: May 12, 2011
Date of Patent: Jul 23, 2013
Assignee: Ezconn Corporation (Taipei)
Inventor: Chin-Tsung Wu (Taipei)
Primary Examiner: Derrick Holland
Application Number: 29/391,700
Classifications