Cover of an electronic device having surface ornamentation

- FIH (Hong Kong) Limited
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Description

The present application is related to co-pending U.S. patent application Ser. Nos. 29/418,363, 29/418,364, 29/418,365, 29/418,368, 29/418,370, 29/418,371, 29/418,372, 29/418,373, 29/418,375, and 29/418,377, each, entitled “Cover of an Electronic Device Having Surface Ornamentation”, by Bin Li. These applications have the same assignee as the present application and have been concurrently filed herewith. The above-identified applications are incorporated herein by reference.

FIG. 1 is a perspective view of a cover of an electronic device having surface ornamentation showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a side elevational view thereof; and,

FIG. 4 is an enlarged fragmentary view thereof showing circled portion 4 in FIG. 2.

In FIG. 1-3, the evenly segmented broken lines indicate portions of the cover of an electronic device having surface ornamentation that form no part of the claimed design. In FIGS. 2 and 4, the unevenly segmented broken lines indicate the portion of the design that is shown on an enlarged scale in FIG. 4. The broken lines form no part of the claimed design.

Claims

The ornamental design for a cover of an electronic device having surface ornamentation, as shown and described.

Referenced Cited
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Other references
  • Zazzle, Pink and Blue Plaid Geometric Pattern iPhone 5 Cover, made on Jul. 15, 2013 <http://www.zazzle.com/pink—and—blue—plaid—geometric—pattern—case-179245478317548474>, retrieved on Dec. 12, 2013.
Patent History
Patent number: D700171
Type: Grant
Filed: Apr 16, 2012
Date of Patent: Feb 25, 2014
Assignee: FIH (Hong Kong) Limited (Kowloon)
Inventor: Bin Li (Shenzhen)
Primary Examiner: Prabhakar Deshmukh
Assistant Examiner: Chelsea Sealey
Application Number: 29/418,361
Classifications
Current U.S. Class: Handset (23) (D14/248)