Cover of an electronic device having surface ornamentation
The present application is related to co-pending U.S. patent applications Ser. No. 29/418,361, 29/418,363, 29/418,364, 29/418,365, 29/418,368, 29/418,370, 29/418,371, 29/418,373, 29/418,375, and 29/418,377, each, entitled “Cover of an Electronic Device Having Surface Ornamentation”, by Bin Li. These applications have the same assignee as the present application and have been concurrently filed herewith. The above-identified applications are incorporated herein by reference.
In
Claims
The ornamental design for a cover of an electronic device having surface ornamentation, as shown and described.
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Type: Grant
Filed: Apr 16, 2012
Date of Patent: Feb 25, 2014
Assignee: FIH (Hong Kong) Limited (Kowloon)
Inventor: Bin Li (Shenzhen)
Primary Examiner: Prabhakar Deshmukh
Assistant Examiner: Chelsea Sealey
Application Number: 29/418,372