Cover of an electronic device having surface ornamentation

- FIH (Hong Kong) Limited
Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

The present application is related to co-pending U.S. patent applications Ser. No. 29/418,361, 29/418,363, 29/418,364, 29/418,365, 29/418,368, 29/418,370, 29/418,371, 29/418,373, 29/418,375, and 29/418,377, each, entitled “Cover of an Electronic Device Having Surface Ornamentation”, by Bin Li. These applications have the same assignee as the present application and have been concurrently filed herewith. The above-identified applications are incorporated herein by reference.

FIG. 1 is a perspective view of a cover of an electronic device having surface ornamentation showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a side elevational view thereof; and,

FIG. 4 is an enlarged fragmentary view thereof showing circled portion 4 in FIG. 2.

In FIG. 1-3, the evenly segmented broken lines indicate portions of the cover of an electronic device having surface ornamentation that form no part of the claimed design. In FIGS. 2 and 4, the unevenly segmented broken lines indicate the portion of the design that is shown on an enlarged scale in FIG. 4. The broken lines form no part of the claimed design.

Claims

The ornamental design for a cover of an electronic device having surface ornamentation, as shown and described.

Referenced Cited
U.S. Patent Documents
586211 July 1897 Basquin
D46761 December 1914 Tyrrell
D108262 February 1938 Harvey
3922065 November 1975 Schultz
3924929 December 1975 Holmen et al.
4511144 April 16, 1985 Roberts
D313319 January 1, 1991 Legare
D418308 January 4, 2000 Lu
D436139 January 9, 2001 Cummings
D478218 August 12, 2003 Liang
D489905 May 18, 2004 Hynnek et al.
D493622 August 3, 2004 Hynnek et al.
7562991 July 21, 2009 Benson et al.
7712904 May 11, 2010 Benson et al.
D618368 June 22, 2010 Jenkins et al.
D666837 September 11, 2012 Elser
D671231 November 20, 2012 Reid
8394485 March 12, 2013 Benson et al.
8485672 July 16, 2013 Benson et al.
20100028709 February 4, 2010 Li et al.
20110234063 September 29, 2011 Li et al.
20130215509 August 22, 2013 Mimura
Other references
  • Signicase, Diamond and Cubes Case for iPhone,< http://www.signicase.com/collections/iphone-5-5s/products/wood-case-iphone5-bamboo-diamonds-and-cubes>, retrieved from internet on Dec. 12, 2013, 2013 copyright catalog.
Patent History
Patent number: D700174
Type: Grant
Filed: Apr 16, 2012
Date of Patent: Feb 25, 2014
Assignee: FIH (Hong Kong) Limited (Kowloon)
Inventor: Bin Li (Shenzhen)
Primary Examiner: Prabhakar Deshmukh
Assistant Examiner: Chelsea Sealey
Application Number: 29/418,372
Classifications
Current U.S. Class: Handset (23) (D14/248)