Cover of an electronic device having surface ornamentation
Latest FIH (Hong Kong) Limited Patents:
The present application is related to co-pending U.S. patent applications Ser. No. 29/418,361, 29/418,363, 29/418,364, 29/418,365, 29/418,368, 29/418,370, 29/418,371, 29/418,373, 29/418,375, and 29/418,377, each, entitled “Cover of an Electronic Device Having Surface Ornamentation”, by Bin Li. These applications have the same assignee as the present application and have been concurrently filed herewith. The above-identified applications are incorporated herein by reference.
In
Claims
The ornamental design for a cover of an electronic device having surface ornamentation, as shown and described.
586211 | July 1897 | Basquin |
D46761 | December 1914 | Tyrrell |
D108262 | February 1938 | Harvey |
3922065 | November 1975 | Schultz |
3924929 | December 1975 | Holmen et al. |
4511144 | April 16, 1985 | Roberts |
D313319 | January 1, 1991 | Legare |
D418308 | January 4, 2000 | Lu |
D436139 | January 9, 2001 | Cummings |
D478218 | August 12, 2003 | Liang |
D489905 | May 18, 2004 | Hynnek et al. |
D493622 | August 3, 2004 | Hynnek et al. |
7562991 | July 21, 2009 | Benson et al. |
7712904 | May 11, 2010 | Benson et al. |
D618368 | June 22, 2010 | Jenkins et al. |
D666837 | September 11, 2012 | Elser |
D671231 | November 20, 2012 | Reid |
8394485 | March 12, 2013 | Benson et al. |
8485672 | July 16, 2013 | Benson et al. |
20100028709 | February 4, 2010 | Li et al. |
20110234063 | September 29, 2011 | Li et al. |
20130215509 | August 22, 2013 | Mimura |
- Signicase, Diamond and Cubes Case for iPhone,< http://www.signicase.com/collections/iphone-5-5s/products/wood-case-iphone5-bamboo-diamonds-and-cubes>, retrieved from internet on Dec. 12, 2013, 2013 copyright catalog.
Type: Grant
Filed: Apr 16, 2012
Date of Patent: Feb 25, 2014
Assignee: FIH (Hong Kong) Limited (Kowloon)
Inventor: Bin Li (Shenzhen)
Primary Examiner: Prabhakar Deshmukh
Assistant Examiner: Chelsea Sealey
Application Number: 29/418,372