Headphone assembly

- The Ketchum Group, Inc.
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Description

FIG. 1 is a top view of a headphone assembly in accordance with the new design, depicting two earpieces connected by a flexible cord.

FIG. 2 is a bottom view thereof, depicting two earpieces connected by a flexible cord.

FIG. 3 is a left side elevational view thereof, the cord is drawn broken away for purposes of illustration;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left back elevational view thereof;

FIG. 6 is a right back elevational view thereof;

FIG. 7 is an opposite side left elevational view thereof;

FIG. 8 is an opposite right side elevational view thereof;

FIG. 9 is a left front elevational view thereof; and,

FIG. 10 is a right front elevational view thereof.

The dashed lines depict environmental aspects and form no part of the claimed design.

Claims

I claim the ornamental design for a headphone assembly, as shown and described.

Referenced Cited
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Patent History
Patent number: D704676
Type: Grant
Filed: Jan 7, 2013
Date of Patent: May 13, 2014
Assignee: The Ketchum Group, Inc. (Los Angeles, CA)
Inventor: Michael Craig Krisztal (Los Angeles, CA)
Primary Examiner: Paula Greene
Application Number: 29/441,581
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)