Digital signature pad

- Uniform Industrial Corp.
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Description

FIG. 1 is a front perspective view of a digital signature pad showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left elevational view thereof;

FIG. 5 is a right elevational view thereof;

FIG. 6 is a top elevational view thereof;

FIG. 7 is a bottom elevational view thereof;

FIG. 8 is the other side of perspective view thereof; and,

FIG. 9 is a reference view of using status thereof.

The broken line showing of a pen and wire is for the purpose of illustrating environment, and forms no part of the claimed design.

Claims

The ornamental design for a digital signature pad, as shown and described.

Referenced Cited
U.S. Patent Documents
4725694 February 16, 1988 Auer et al.
D303111 August 29, 1989 Paley
D319434 August 27, 1991 Lund
D328291 July 28, 1992 Falkner
D348661 July 12, 1994 Hansen et al.
D362662 September 26, 1995 Baudot
D385857 November 4, 1997 Cohen et al.
D462679 September 10, 2002 Liu
D464345 October 15, 2002 Liu
D480725 October 14, 2003 Funato
D532009 November 14, 2006 Zank et al.
D586812 February 17, 2009 Guenther
D631880 February 1, 2011 Hirota
D673952 January 8, 2013 Toda et al.
Patent History
Patent number: D712407
Type: Grant
Filed: Dec 5, 2012
Date of Patent: Sep 2, 2014
Assignee: Uniform Industrial Corp. (New Taipei)
Inventor: Dung-An Chang (New Taipei)
Primary Examiner: Cathron Brooks
Assistant Examiner: Katie Mroczka
Application Number: 29/439,024
Classifications