Headphone assembly

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Description

FIG. 1 is a front perspective view of a headphone assembly according our design;

FIG. 2 is a front elevation view thereof;

FIG. 3 is a back elevation view thereof;

FIG. 4 is a right side elevation view thereof;

FIG. 5 is a left side elevation view thereof;

FIG. 6 is a top elevation view thereof;

FIG. 7 is a bottom elevation view thereof;

FIG. 8 is a rear perspective view thereof; and,

FIG. 9 is a front perspective view of the headphone assembly of FIG. 1 in a configuration where the headphone assembly is attached with additional environmental features, as shown in the figure.

Broken lines are environmental only and form no part of the claimed design.

Claims

The ornamental design for a headphone assembly, as shown and described.

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Patent History
Patent number: D719131
Type: Grant
Filed: Jun 25, 2013
Date of Patent: Dec 9, 2014
Assignee: Google Inc. (Mountain View, CA)
Inventors: Haley Toelle (San Francisco, CA), Jianchun Dong (Palo Alto, CA), Michael Kai Morishita (Belmont, CA), Eliot Kim (Cupertino, CA)
Primary Examiner: Paula Greene
Application Number: 29/459,019
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)