Mobile power pack for electronic device
Latest Chi Mei Communication Systems, Inc. Patents:
Description
The broken lines of all the figures are for the purpose of illustrating environment and forms no part of the claimed design.
Claims
The ornamental design for a mobile power pack for electronic device, as shown and described.
Referenced Cited
U.S. Patent Documents
D493175 | July 20, 2004 | Schmidt et al. |
D575226 | August 19, 2008 | Bart |
D595223 | June 30, 2009 | Yamamoto et al. |
D600640 | September 22, 2009 | Stein et al. |
D610538 | February 23, 2010 | Wu et al. |
D617323 | June 8, 2010 | Willenz |
D634269 | March 15, 2011 | Griffin, Jr. |
D634704 | March 22, 2011 | Tieleman et al. |
D639731 | June 14, 2011 | Sun |
D659638 | May 15, 2012 | Wang |
D661647 | June 12, 2012 | Chen |
D684113 | June 11, 2013 | Han et al. |
20020039016 | April 4, 2002 | You et al. |
Patent History
Patent number: D725591
Type: Grant
Filed: Jun 14, 2013
Date of Patent: Mar 31, 2015
Assignee: Chi Mei Communication Systems, Inc. (New Taipei)
Inventors: Shih-Chieh Chien (New Taipei), Chia-Chia Huang (New Taipei), Ho-An Chen (New Taipei), Tzu-Cheng Yu (Santa Clara, CA)
Primary Examiner: Rosemary K Tarcza
Application Number: 29/457,928
Type: Grant
Filed: Jun 14, 2013
Date of Patent: Mar 31, 2015
Assignee: Chi Mei Communication Systems, Inc. (New Taipei)
Inventors: Shih-Chieh Chien (New Taipei), Chia-Chia Huang (New Taipei), Ho-An Chen (New Taipei), Tzu-Cheng Yu (Santa Clara, CA)
Primary Examiner: Rosemary K Tarcza
Application Number: 29/457,928
Classifications