Thermal pad
Latest Hisamitsu Pharmaceutical Co., Inc. Patents:
The broken lines in the drawings represent claimed perforations on the thermal pad.
Claims
The ornamental design for a thermal pad, as shown and described.
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- Brookstone. Body Bean Cordless Heating Pad. 2014 [online], [site visited Oct. 29, 2014]. Available from Internet, <URL:http://www.brookstone.com/body-bean-cordless-heating-pad?bkiid=SearchResults%7CCategoryProductList%7C734863p>.
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Type: Grant
Filed: Mar 18, 2014
Date of Patent: Jun 30, 2015
Assignee: Hisamitsu Pharmaceutical Co., Inc. (Tosu-Shi, Saga)
Inventors: Yui Takanishi (Tokyo), Sayaka Mochizuki (Tokyo)
Primary Examiner: Robert M Spear
Assistant Examiner: Darcey E Heflin
Application Number: 29/485,330