Thermal pad

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Description

FIG. 1 is a front view of a thermal pad of the present invention.

FIG. 2 is a rear view of the thermal pad of FIG. 1.

FIG. 3 is a top plan view of the thermal pad of FIG. 1.

FIG. 4 is a bottom view of the thermal pad of FIG. 1.

FIG. 5 is a right side view of the thermal pad of FIG. 1.

FIG. 6 is a left side view of the thermal pad of FIG. 1.

FIG. 7 is an end view taken along the line 7-7 of the thermal pad of FIG. 1.

FIG. 8 is an enlarged view taken along the line 8-8 of the thermal pad of FIG. 7.

FIG. 9 is an enlarged view taken along the line 9-9 of the thermal pad of FIG. 7; and,

FIG. 10 is a rear view of the thermal pad of FIG. 1 from which the release sheet has been removed for clarity of disclosure, it being understood that the stippled areas indicate adhesive surfaces.

The broken lines in the drawings represent claimed perforations on the thermal pad.

Claims

The ornamental design for a thermal pad, as shown and described.

Referenced Cited
U.S. Patent Documents
6477861 November 12, 2002 Pottick
D526720 August 15, 2006 Dodo et al.
D575934 September 2, 2008 Killinger
D583958 December 30, 2008 Usui et al.
D583959 December 30, 2008 Yim
D587811 March 3, 2009 Uchiyama et al.
D587812 March 3, 2009 Uchiyama et al.
D596305 July 14, 2009 Usui et al.
D602598 October 20, 2009 Yim
D607112 December 29, 2009 Rogers et al.
D609358 February 2, 2010 Yim
D609360 February 2, 2010 Yim
D612060 March 16, 2010 Smith
D628705 December 7, 2010 Usui et al.
D628706 December 7, 2010 Usui et al.
D683040 May 21, 2013 Arsenault et al.
D685489 July 2, 2013 Nishioka et al.
D706944 June 10, 2014 Igaue et al.
D712548 September 2, 2014 Igwebuike et al.
D712552 September 2, 2014 Igwebuike et al.
Foreign Patent Documents
1235923 April 2005 JP
1393385 July 2010 JP
101068 October 2004 TW
106192 August 2005 TW
106336 September 2005 TW
Other references
  • Brookstone. Body Bean Cordless Heating Pad. 2014 [online], [site visited Oct. 29, 2014]. Available from Internet, <URL:http://www.brookstone.com/body-bean-cordless-heating-pad?bkiid=SearchResults%7CCategoryProductList%7C734863p>.
  • Salonsip® Heat Pad, printed from Internet, www.hisamitsu.co.jp/, 2 pages, Dec. 30, 2014.
Patent History
Patent number: D733311
Type: Grant
Filed: Mar 18, 2014
Date of Patent: Jun 30, 2015
Assignee: Hisamitsu Pharmaceutical Co., Inc. (Tosu-Shi, Saga)
Inventors: Yui Takanishi (Tokyo), Sayaka Mochizuki (Tokyo)
Primary Examiner: Robert M Spear
Assistant Examiner: Darcey E Heflin
Application Number: 29/485,330
Classifications
Current U.S. Class: Thermal (D24/206)