Fill pouch assembly for encapsulation device

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Description

FIG. 1 is a perspective view of the DFPA from above the DFPA looking down;

FIG. 2 is a perspective view of the DFPA illustrated in FIG. 1 from below the DFPA, looking up;

FIG. 3 is a top plan view of the DFPA illustrated in FIG. 1;

FIG. 4 is a bottom plan view of the DFPA illustrated in FIG. 1;

FIG. 5 is a left side elevation of the DFPA illustrated in FIG. 1;

FIG. 6 is a right side elevation of the DFPA illustrated in FIG. 1;

FIG. 7 is a back view of the DFPA illustrated in FIG. 1; and,

FIG. 8 is a front view of the DFPA illustrated in FIG. 1.

Claims

The ornamental design for fill pouch assembly for encapsulation device, as shown and described.

Referenced Cited
U.S. Patent Documents
D336034 June 1, 1993 Rebilas
D400253 October 27, 1998 Niedospial et al.
D439328 March 20, 2001 Nielsen
D552235 October 2, 2007 Inoue et al.
D555787 November 20, 2007 Inoue et al.
D567940 April 29, 2008 Inoue et al.
D598784 August 25, 2009 Anderson et al.
D603957 November 10, 2009 Sato et al.
D610918 March 2, 2010 Ueda
D619907 July 20, 2010 Ueda
D662833 July 3, 2012 Sanfilippo et al.
D700066 February 25, 2014 Berman
Patent History
Patent number: D734166
Type: Grant
Filed: Apr 16, 2014
Date of Patent: Jul 14, 2015
Assignee: VIACYTE, INC. (San Diego, CA)
Inventors: Erik Olson (San Diego, CA), Michael Scott (San Diego, CA), Donald Koenig (San Diego, CA)
Primary Examiner: Caron D Veynar
Assistant Examiner: Abraham Bahta
Application Number: 29/488,217
Classifications
Current U.S. Class: D9/707