Headphones
Latest Harman International Industries, Incorporated Patents:
Description
The broken line showings form no part of the claimed design.
Claims
The ornamental design for headphones, as shown and described.
Referenced Cited
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Patent History
Patent number: D743369
Type: Grant
Filed: Feb 14, 2014
Date of Patent: Nov 17, 2015
Assignee: Harman International Industries, Incorporated (Northridge, CA)
Inventors: Damian Mackiewicz (Shenzen), Chak Fai To, Ron (Hong Kong)
Primary Examiner: Paula Greene
Application Number: 29/482,181
Type: Grant
Filed: Feb 14, 2014
Date of Patent: Nov 17, 2015
Assignee: Harman International Industries, Incorporated (Northridge, CA)
Inventors: Damian Mackiewicz (Shenzen), Chak Fai To, Ron (Hong Kong)
Primary Examiner: Paula Greene
Application Number: 29/482,181
Classifications
Current U.S. Class:
Headphone Or Headset (D14/205)