Headphones
Latest Harman International Industries, Incorporated Patents:
Description
The broken line showings form no part of the claimed design.
Claims
The ornamental design for headphones, as shown and described.
Referenced Cited
U.S. Patent Documents
1567105 | December 1925 | Bohlman |
D195304 | May 1963 | Little et al. |
D244300 | May 10, 1977 | Besasie |
D301145 | May 16, 1989 | Besasie et al. |
5146619 | September 8, 1992 | Brown |
D538261 | March 13, 2007 | Taylor et al. |
D576604 | September 9, 2008 | Suzuki |
D588100 | March 10, 2009 | Densho et al. |
D633895 | March 8, 2011 | Morimoto |
D666579 | September 4, 2012 | Hou |
D685771 | July 9, 2013 | Bertenthal |
D688648 | August 27, 2013 | Li et al. |
D688649 | August 27, 2013 | Combs et al. |
D691583 | October 15, 2013 | Kitayama |
D697048 | January 7, 2014 | Pavitsich |
D697495 | January 14, 2014 | Lian |
D713374 | September 16, 2014 | Farrage |
20100046781 | February 25, 2010 | Chen |
20120077556 | March 29, 2012 | McKendrick |
20140079275 | March 20, 2014 | Minarik et al. |
Patent History
Patent number: D743369
Type: Grant
Filed: Feb 14, 2014
Date of Patent: Nov 17, 2015
Assignee: Harman International Industries, Incorporated (Northridge, CA)
Inventors: Damian Mackiewicz (Shenzen), Chak Fai To, Ron (Hong Kong)
Primary Examiner: Paula Greene
Application Number: 29/482,181
Type: Grant
Filed: Feb 14, 2014
Date of Patent: Nov 17, 2015
Assignee: Harman International Industries, Incorporated (Northridge, CA)
Inventors: Damian Mackiewicz (Shenzen), Chak Fai To, Ron (Hong Kong)
Primary Examiner: Paula Greene
Application Number: 29/482,181
Classifications
Current U.S. Class:
Headphone Or Headset (D14/205)