Sensor mount assembly
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Description
Claims
The ornamental design for a sensor mount assembly, as shown and described.
Referenced Cited
U.S. Patent Documents
9512714 | December 6, 2016 | Sobolewski |
Patent History
Patent number: D782928
Type: Grant
Filed: Mar 30, 2016
Date of Patent: Apr 4, 2017
Assignee: SMC Corporation (Chiyoda-ku, Tokyo)
Inventors: Youji Takakuwa (Tsukubamirai), Mitsuru Machijima (Tsukubamirai), Kengo Monden (Tsukubamirai), Seiichi Nagura (Tsukubamirai), Kenta Onuki (Tsukubamirai)
Primary Examiner: Antoine D Davis
Application Number: 29/559,569
Type: Grant
Filed: Mar 30, 2016
Date of Patent: Apr 4, 2017
Assignee: SMC Corporation (Chiyoda-ku, Tokyo)
Inventors: Youji Takakuwa (Tsukubamirai), Mitsuru Machijima (Tsukubamirai), Kengo Monden (Tsukubamirai), Seiichi Nagura (Tsukubamirai), Kenta Onuki (Tsukubamirai)
Primary Examiner: Antoine D Davis
Application Number: 29/559,569
Classifications
Current U.S. Class:
Element Or Attachment (4) (D10/103);
D8/394