Heat sink for memory module
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Claims
We claim the ornamental design for a heat sink for memory module, as shown and described.
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Type: Grant
Filed: May 9, 2016
Date of Patent: Aug 1, 2017
Assignee: Kingston Digital, Inc. (Fountain Valley, CA)
Inventors: Yi-Ting Lin (Hsinchu), Yu-kuo Huang (Hsinchu), Peter Leekuo Chou (Fountain Valley, CA), Tsung Shiao Tsai (New Taipei)
Primary Examiner: Susan Moon Lee
Application Number: 29/563,885