Adhesive sheet for substrate
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Description
The broken line showing of the adhesive sheet for substrate is included for the purpose of illustrating portions of the adhesive sheet for substrate and forms no part of the claimed design.
Claims
The ornamental design for the adhesive sheet for substrate, as shown and described.
Referenced Cited
U.S. Patent Documents
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Patent History
Patent number: D805044
Type: Grant
Filed: Oct 30, 2015
Date of Patent: Dec 12, 2017
Assignee: HIRATA CORPORATION (Shinagawa-ku)
Inventors: Tetsuya Sakai (Tokyo), Hideki Sakaue (Tokyo)
Primary Examiner: Thomas Johannes
Assistant Examiner: Shawn T Gingrich
Application Number: 29/544,216
Type: Grant
Filed: Oct 30, 2015
Date of Patent: Dec 12, 2017
Assignee: HIRATA CORPORATION (Shinagawa-ku)
Inventors: Tetsuya Sakai (Tokyo), Hideki Sakaue (Tokyo)
Primary Examiner: Thomas Johannes
Assistant Examiner: Shawn T Gingrich
Application Number: 29/544,216
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)