Housing for packaging semiconductor light emitting device

- SEMICON LIGHT CO., LTD.
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Description

FIG. 1 is a perspective view of a housing for packaging semiconductor light emitting device, showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

Claims

The ornamental design for a housing for packaging semiconductor light emitting device, as shown and described.

Referenced Cited
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Patent History
Patent number: D830200
Type: Grant
Filed: Oct 25, 2016
Date of Patent: Oct 9, 2018
Assignee: SEMICON LIGHT CO., LTD. (Gyeonggi-Do)
Inventors: Kyoung Min Kim (Gyeonggi-do), Gye Oul Jeong (Gyeonggi-do)
Primary Examiner: Cathron C Brooks
Assistant Examiner: W. A. Teddy Falloway
Application Number: 29/582,157
Classifications
Current U.S. Class: D9/744; Support Or Trim (26) (D26/138)