Module for use in a test instrument

- EXFO Inc.
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Description

FIG. 1 is a first oblique view of the module for use in a test instrument, taken from the front and left side, showing our new design;

FIG. 2 is another oblique view thereof, taken from the back and right side;

FIG. 3 is a top plan view thereof,

FIG. 4 is a front elevation view thereof

FIG. 5 is a left side elevation view thereof,

FIG. 6 is a right side elevation view thereof,

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a rear elevation view thereof.

The dashed line showing of structural lines is included for the purpose of illustrating non-claimed subject matter and forms no part of the claimed design.

Claims

The ornamental design for a module for use in a test instrument, as shown and described.

Referenced Cited
U.S. Patent Documents
D281401 November 19, 1985 Perrins
D343799 February 1, 1994 Spinks
D365291 December 19, 1995 Chitty
D377319 January 14, 1997 Amano
D573495 July 22, 2008 Chen
D608959 January 26, 2010 Kim
20130004131 January 3, 2013 Skepnek
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Patent History
Patent number: D842144
Type: Grant
Filed: Aug 16, 2017
Date of Patent: Mar 5, 2019
Assignee: EXFO Inc. (Quebec)
Inventors: Michel Blier (Montreal), Patrice Gonay (St-Gabriel de Valcartier), Sebastien Nadeau (Saint-Augustin-de-Desmaures), Pascal Recoura-Massaquant (Quebec)
Primary Examiner: Antoine D Davis
Application Number: 29/614,126
Classifications
Current U.S. Class: Electrical Property (D10/75)