Housing for high-fidelity earbud

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Description

FIG. 1 is a front, right side, top perspective view of the housing for high-fidelity earbud showing my new design;

FIG. 2 is a rear, left side bottom perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof with the ear bud oriented rearwardly;

FIG. 8 is a bottom plan view thereof;

FIG. 9 is a front, left side, bottom perspective view of the housing for high-fidelity earbud showing my new design;

FIG. 10 is a rear, left side, bottom perspective view thereof;

FIG. 11 is an inverted rear elevational view thereof;

FIG. 12 is a rear, inverted, elevational view thereof; and

FIG. 13 is a left side elevational view thereof;

FIG. 14 is a right side elevational view thereof;

FIG. 15 is a top plan view thereof;

FIG. 16 is a bottom plan view thereof; and,

FIG. 17 is a usage perspective view thereof.

The broken lines depict environment that forms no part of the claimed design.

Claims

The ornamental design for housing for high-fidelity earbud, as shown and described.

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Patent History
Patent number: D853359
Type: Grant
Filed: Jan 25, 2018
Date of Patent: Jul 9, 2019
Inventor: Yong Guo (Dongguan)
Primary Examiner: Paula Allen Greene
Application Number: 29/634,907
Classifications
Current U.S. Class: Headphone (D14/223)