Interconnecting device for thermal management system

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Description

FIG. 1 is a front view of an interconnecting device for thermal management system according to the present application;

FIG. 2 is a rear view of the interconnecting device for thermal management system according to the present application;

FIG. 3 is a left view of the interconnecting device for thermal management system according to the present application;

FIG. 4 is a right view of the interconnecting device for thermal management system according to the present application;

FIG. 5 is a top view of the interconnecting device for thermal management system according to the present application;

FIG. 6 is a bottom view of the interconnecting device for thermal management system according to the present application; and,

FIG. 7 is a perspective view of the interconnecting device for thermal management system according to the present application.

The broken lines depict portions of the interconnecting device for thermal management system that form no part of the claimed design.

Claims

The ornamental design for an interconnecting device for thermal management system, as shown and described.

Referenced Cited
U.S. Patent Documents
4172435 October 30, 1979 Schumacher
Other references
  • U.S. Appl. No. 29/631,087, filed Dec. 27, 2017, Lin et al.
  • U.S. Appl. No. 29/631,090, filed Dec. 27, 2017, Jiang et al.
  • U.S. Appl. No. 29/631,101, filed Dec. 27, 2017, Zhang et al.
Patent History
Patent number: D859470
Type: Grant
Filed: Dec 27, 2017
Date of Patent: Sep 10, 2019
Assignee: Hangzhou Sanhua Research Institute (Hangzhou, Zhejiang)
Inventors: Jianbin Shentu (Zhejiang), Zhi Wu (Zhejiang), Yaoyao Zhang (Zhejiang), Long Lin (Zhejiang)
Primary Examiner: Antoine Duval Davis
Application Number: 29/631,095
Classifications
Current U.S. Class: Element Or Attachment (D15/5)