Headphone

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Description

FIG. 1 is a perspective view of a headphone showing the new design in a first embodiment;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a side elevational view thereof;

FIG. 5 is an opposite side elevational view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is a perspective view of a headphone showing the new design in a second embodiment;

FIG. 9 is a front elevational view thereof;

FIG. 10 is a rear elevational view thereof;

FIG. 11 is a side elevational view thereof;

FIG. 12 is an opposite side elevational view thereof;

FIG. 13 is a top view thereof; and,

FIG. 14 is a bottom view thereof.

The broken lines shown in the drawings depict portions of the headphone that form no part of the claimed design.

Claims

The ornamental design for a headphone, as shown and described.

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Patent History
Patent number: D871374
Type: Grant
Filed: Dec 28, 2017
Date of Patent: Dec 31, 2019
Assignee: Harman International Industries, Incorporated (Northridge, CA)
Inventors: Effrosini A. Karayiannis (St. Louis, MO), Ryan Ott (North Hollywood, CA)
Primary Examiner: Barbara Fox
Assistant Examiner: Mary Claire Ramirez
Application Number: 29/631,217
Classifications