Headphone

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Description

FIG. 1 is a front elevational view of a headphone;

FIG. 2 is a rear elevational view of the headphone;

FIG. 3 is a top plan view of the headphone;

FIG. 4 is a bottom plan view of the headphone;

FIG. 5 is a left side elevational view of the headphone;

FIG. 6 is a right side elevational view of the headphone;

FIG. 7 is a top side perspective view of the headphone;

FIG. 8 is a bottom side perspective view of the headphone; and,

FIG. 9 is a reference view showing a state of use of the headphone.

Portions of the drawings shown in broken lines form no part of the claimed design.

Claims

The ornamental design for a headphone, as shown and described.

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Patent History
Patent number: D872706
Type: Grant
Filed: Jul 18, 2018
Date of Patent: Jan 14, 2020
Assignee: AUDIO-TECHNICA CORPORATION (Tokyo)
Inventors: Yosuke Takubo (Kanagawa), Shohei Araki (Kanagawa)
Primary Examiner: Paula Allen Greene
Application Number: 29/657,002
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)