Micro LED display module frame
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Description
Claims
The ornamental design for a mirco LED display module frame, as shown and described.
Referenced Cited
U.S. Patent Documents
Other references
7746381 | June 29, 2010 | Ye |
D684146 | June 11, 2013 | Stifal |
9279573 | March 8, 2016 | Perez-Bravo |
9477438 | October 25, 2016 | Hochman |
D776095 | January 10, 2017 | Brown |
D819613 | June 5, 2018 | Trachtenberg |
D835082 | December 4, 2018 | So |
20040255496 | December 23, 2004 | Youn |
20110019348 | January 27, 2011 | Kludt |
20130269882 | October 17, 2013 | Bauman |
20160210886 | July 21, 2016 | Brashnyk |
20160348854 | December 1, 2016 | Wu |
20170127539 | May 4, 2017 | Drabant |
20170186345 | June 29, 2017 | Hemphill |
20190179592 | June 13, 2019 | Hyeon |
20190191574 | June 20, 2019 | Kim |
- See-through LED Transparent Display; 1 pg; search done on Oct. 17, 2019; https://www.elecosn.com/ShowProducts.asp?ID=62&ClassID=1.
Patent History
Patent number: D876405
Type: Grant
Filed: Jul 13, 2018
Date of Patent: Feb 25, 2020
Assignee: LUMENS CO., LTD. (Yongin-si)
Inventor: Junsuk Yang (Yongin-si)
Primary Examiner: Selina Sikder
Application Number: 29/656,564
Type: Grant
Filed: Jul 13, 2018
Date of Patent: Feb 25, 2020
Assignee: LUMENS CO., LTD. (Yongin-si)
Inventor: Junsuk Yang (Yongin-si)
Primary Examiner: Selina Sikder
Application Number: 29/656,564
Classifications
Current U.S. Class:
Video (13) (D14/239)