Electrical interconnect capsule

- MODUS TEST, LLC
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Description

FIG. 1 is a top perspective view of an electrical interconnect capsule,

FIG. 2 is a bottom perspective view of an electrical interconnect capsule,

FIG. 3 is a front elevation view of an electrical interconnect capsule,

FIG. 4 is a rear elevational view of an electrical interconnect capsule,

FIG. 5 is a right elevational view of an electrical interconnect capsule,

FIG. 6 is a left elevation view of an electrical interconnect capsule,

FIG. 7 is a top elevation view of an electrical interconnect capsule,

FIG. 8 is a bottom elevation view of an electrical interconnect capsule,

FIG. 9 is a close up perspective view of a portion of the top side of an electrical interconnect capsule; and,

FIG. 10 is a close up perspective view of a portion of the bottom side of an electrical interconnect capsule.

The dashed lines shown represent the environment and represent unclaimed subject matter and form no part of the claimed design.

Claims

The ornamental design for an electrical interconnect capsule, as is shown and described.

Referenced Cited
U.S. Patent Documents
D652039 January 10, 2012 Hwang
D751433 March 15, 2016 Adams
D870678 December 24, 2019 Lin
D870679 December 24, 2019 Lin
D870681 December 24, 2019 Lin
D875686 February 18, 2020 Barany
D875687 February 18, 2020 Barany
20140167805 June 19, 2014 Dell
20160209443 July 21, 2016 Adams
Other references
  • Circuit Digest. Simple Microphone to Speaker Amplifier Circuit by Sourav Gupta. Nov. 13, 2018. https://circuitdigest.com/electronic-circuits/simple-microphone-to-speaker-circuit (Year: 2018).
Patent History
Patent number: D893433
Type: Grant
Filed: Mar 15, 2019
Date of Patent: Aug 18, 2020
Assignee: MODUS TEST, LLC (Richardson, TX)
Inventors: Lynwood Adams (Rockwall, TX), Jack Lewis (Royse City, TX)
Primary Examiner: Darcey E Gottschalk
Application Number: 29/683,835