Module for field termination assembly
Latest Honeywell International Inc. Patents:
- Turbine blade tip geometry system and method for gas turbine engine
- ECAE processing for high strength and high hardness aluminum alloys
- BUTTON ASSEMBLY
- Systems and methods for simulating worst-case contention to determine worst-case execution time of applications executed on a processor
- One step process for manufacturing trifluoroiodomethane from trifluoroacetyl halide, hydrogen, and iodine
The broken lines in the drawings depict portions of module for field termination assembly that form no part the claimed design. The broken lines immediately adjacent to shaded surfaces form a boundary of the claim. The broken lines in
Claims
The ornamental design of a module for a field termination assembly, as shown and described.
| D281493 | November 26, 1985 | Prager |
| 5253140 | October 12, 1993 | Inoue |
| 6425770 | July 30, 2002 | Lostoski |
| 7230833 | June 12, 2007 | Sickels |
| D659650 | May 15, 2012 | Kang |
| 8986033 | March 24, 2015 | Berger |
| D748096 | January 26, 2016 | Laessle |
| 9620912 | April 11, 2017 | Wu |
| 9979106 | May 22, 2018 | Eriksson |
| 10314194 | June 4, 2019 | Chiang |
| 10365696 | July 30, 2019 | Huang |
| 20020072256 | June 13, 2002 | Lostoski |
| 20100202116 | August 12, 2010 | Sofker |
| 20120043378 | February 23, 2012 | Vazach |
| 20140156029 | June 5, 2014 | Godau |
| 20170346205 | November 30, 2017 | Eriksson |
| 20180069359 | March 8, 2018 | Muller |
| 20180115107 | April 26, 2018 | Correll |
| 20180131131 | May 10, 2018 | Pathmanathan |
- GE Intelligent Platforms, “PAC8000 Modular I/O”, General Electric Company, 2014, 66 pages (see esp. pp. 3 and 5-7).
- Installation Instructions, “Point I/O 4 Channel High Density Current Input Module”, Rockwell Automation, Inc., 2016, 24 pages (see esp. pp. 6-11).
- “S800 I/O Modules and Termination Units”, ABB, 2010, 590 pages (see esp. pp. 15, 18-21, 36, 60, 66, 79, 91, 100, 107, 118, 129, 139, 152, 165, 171, 180, 189, 198, 208, 213, 219, 225, 237, 248, 258, 267, 276, 286, 298, 309, 321, 333, 343, 348, 354, 363, 373, 383, 392, 401, 411, 423, 443, 458, 461, 466, 471, 476, 483, 490, 498, 503, 509, 514, 520, 526, 532, 538, 544, 549, 554, 559, and 564).
Type: Grant
Filed: Jan 31, 2019
Date of Patent: Oct 27, 2020
Assignee: Honeywell International Inc. (Morris Plains, NJ)
Inventors: Dawa Pakimo (Bangalore), Dinesh Kumar KN (Bangalore), Chandrashekar Thayumanavan (Bangalore), Jaison Cherian (Bangalore), Shripurnabodh Deshpande (Bangalore), Karma Bhutia (Bengaluru), Hemanth Vijaykumar (Bangalore), Vishwanath Balakrishna (Bengaluru)
Primary Examiner: Selina Sikder
Application Number: 29/678,888