Heat sink
Latest VEEA INC. Patents:
- Systems and methods for collaborative edge computing
- Method and procedure for miniaturing a multi-layer PCB
- Method and system for secure container application framework
- Edge node, mesh network and method to deliver content at an edge of a mesh network
- Method and system for secure container application framework
The broken lines shown in
Claims
The ornamental design for a heat sink, as shown and described.
D442565 | May 22, 2001 | Chou |
D442566 | May 22, 2001 | Chou |
D464939 | October 29, 2002 | Chuang |
7430122 | September 30, 2008 | Li |
D593512 | June 2, 2009 | Lin |
7567438 | July 28, 2009 | Barsun |
7576989 | August 18, 2009 | Li |
D603810 | November 10, 2009 | Yang |
8348570 | January 8, 2013 | Ye |
D706973 | June 10, 2014 | Shih |
9543226 | January 10, 2017 | Nuttall |
D786202 | May 9, 2017 | Hodrinsky |
20050088823 | April 28, 2005 | Kabadi |
20090067133 | March 12, 2009 | Li |
20140345844 | November 27, 2014 | Chou |
Type: Grant
Filed: Jan 29, 2020
Date of Patent: Feb 16, 2021
Assignee: VEEA INC. (New York, NY)
Inventors: Bob Migliorino (Iselin, NJ), Michael Liccone (Iselin, NJ), Shaun Greaney (Iselin, NJ), Dave Doyle (Iselin, NJ), Michael Mirabella (Iselin, NJ), Perry Wintner (Iselin, NJ), Theodore Lubbe (Iselin, NJ)
Primary Examiner: Keli L Hill
Assistant Examiner: Harold E Blackwell, II
Application Number: 29/722,411