Headphone

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Description

FIG. 1 is a perspective view of a headphone showing the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a side elevational view thereof;

FIG. 5 is an opposite side elevational view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is a perspective view of another embodiment of the headphone of FIGS. 1-7.

FIG. 9 is a front elevational view thereof;

FIG. 10 is a rear elevational view thereof;

FIG. 11 is a side elevational view thereof;

FIG. 12 is an opposite side elevational view thereof;

FIG. 13 is a top view thereof; and,

FIG. 14 is a bottom view thereof.

The broken lines in the figures illustrate portions of the headphone that form no part of the claimed design.

Claims

The ornamental design for a headphone, as shown and described.

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Other references
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Patent History
Patent number: D931256
Type: Grant
Filed: Dec 31, 2019
Date of Patent: Sep 21, 2021
Assignee: Harman International Industries, Incorporated (Northridge, CA)
Inventor: Weijia Lu (Shenzhen)
Primary Examiner: Dana K Weiland
Assistant Examiner: Messina L Smith
Application Number: 29/719,091
Classifications
Current U.S. Class: Headphone (D14/223)