Component of a liquid discharge nozzle for semiconductor substrate processing apparatus

- TOKYO ELECTRON LIMITED
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Description

FIG. 1 is a front, bottom and left-side perspective view of a component of a liquid discharge nozzle for semiconductor substrate processing apparatus;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left-side elevational view thereof;

FIG. 5 is a right-side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

The broken lines shown represent portions of a component of a liquid discharge nozzle for semiconductor substrate processing apparatus and form no part of the claimed design.

Claims

The ornamental design for a component of a liquid discharge nozzle for semiconductor substrate processing apparatus, as shown and described herein.

Referenced Cited
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D872828 January 14, 2020 Bloom
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D877777 March 10, 2020 Pickard
D904562 December 8, 2020 Stewart
D904565 December 8, 2020 Ross
10967343 April 6, 2021 Devitt
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Other references
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Patent History
Patent number: D934991
Type: Grant
Filed: Oct 23, 2019
Date of Patent: Nov 2, 2021
Assignee: TOKYO ELECTRON LIMITED (Tokyo)
Inventors: Yoshifumi Amano (Kumamoto), Kazuhiro Aiura (Kumamoto)
Primary Examiner: Jack Reickel
Assistant Examiner: Keith J Wilson
Application Number: 29/710,399