Bluetooth® headset assembly

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Description

FIG. 1 is a front elevational view of a Bluetooth® headset assembly shown in a first embodiment;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a right side view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a top view thereof;

FIG. 6 is a bottom view thereof;

FIG. 7 is a perspective view thereof;

FIG. 8 is a front elevational view of the Bluetooth® headset assembly shown in a second embodiment;

FIG. 9 is a rear elevational view thereof;

FIG. 10 is a right side view thereof;

FIG. 11 is a left side view thereof;

FIG. 12 is a top view thereof;

FIG. 13 is a bottom view thereof;

FIG. 14 is a perspective view thereof; and,

FIG. 15 is a perspective view of the first and second embodiments of the Bluetooth® headset assembly, shown in a state of use.

The broken lines showing of the case in FIG. 15 depicts environment and forms no part of the claimed design. All other broken lines shown in the drawings depict portions of the Bluetooth® headset assembly that form no part of the claimed design.

Claims

The ornamental design for a Bluetooth® headset assembly, as shown and described.

Referenced Cited
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Other references
  • IFory HiFi Stereo Type C Earbuds, announced Jul. 1, 2020 [online], retrieved Jun. 2, 2021, retrieved from internet, https://www.amazon.com/Earphones-iFory-Earbuds-Headphones-Compatible/dp/B08C5GL91C.
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Patent History
Patent number: D952608
Type: Grant
Filed: Jan 10, 2020
Date of Patent: May 24, 2022
Assignee: LUXSHARE PRECISION INDUSTRY CO., LTD. (Shenzhen)
Inventors: Yun Feng (Dongguan), ZhenHua Liu (Dongguan), Yong Huang (Dongguan)
Primary Examiner: Messina L Smith
Application Number: 29/720,234
Classifications
Current U.S. Class: Headphone (D14/223)