Headphone

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Description

FIG. 1 is a first perspective view of a headphone showing the new design;

FIG. 2 is a second perspective view of the headphone;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a top view thereof;

FIG. 8 is a bottom view thereof;

FIG. 9 is an enlarged view of part I of FIG. 1; and,

FIG. 10 is an enlarged view of part II of FIG. 1.

The broken lines immediately adjacent the shaded areas represent the bounds of the claimed design while all other broken lines are directed to environment; the broken lines form no part of the claimed design.

Claims

The ornamental designs for a headphone, as shown and described.

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Patent History
Patent number: D953287
Type: Grant
Filed: Apr 28, 2020
Date of Patent: May 31, 2022
Assignee: Shenzhen Grandsun Electronic Co., Ltd. (Shenzhen)
Inventors: Haiquan Wu (Shenzhen), Yanwu Pang (Guangdong), Weili Chen (Shenzhen)
Primary Examiner: Paula Allen Greene
Application Number: 29/732,935
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)