Package shell for implanted device
Description
Claims
The ornamental design for a package shell for implanted device, as shown and described.
Referenced Cited
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Patent History
Patent number: D962759
Type: Grant
Filed: Nov 25, 2020
Date of Patent: Sep 6, 2022
Assignee: IntelliMicro Medical Co., Ltd. (Hunan)
Inventors: Yu-Chong Tai (Hunan), Changlin Pang (Hunan)
Primary Examiner: Rhea Shields
Application Number: 29/759,744
Type: Grant
Filed: Nov 25, 2020
Date of Patent: Sep 6, 2022
Assignee: IntelliMicro Medical Co., Ltd. (Hunan)
Inventors: Yu-Chong Tai (Hunan), Changlin Pang (Hunan)
Primary Examiner: Rhea Shields
Application Number: 29/759,744
Classifications
Current U.S. Class:
D9/414