Temperature imaging module
Description
The broken lines showing of mounting hardware in
Claims
The ornamental design for a temperature imaging module, as shown and described.
Referenced Cited
U.S. Patent Documents
| D612882 | March 30, 2010 | Kim |
| D620037 | July 20, 2010 | Kim |
| D631079 | January 18, 2011 | Tzeng |
| D632718 | February 15, 2011 | Tzeng |
| D632719 | February 15, 2011 | Tsai |
| D636006 | April 12, 2011 | Champ |
| D636007 | April 12, 2011 | Peng |
| D636422 | April 19, 2011 | Hou |
| D639839 | June 14, 2011 | Kao |
| D654442 | February 21, 2012 | Won |
| D724449 | March 17, 2015 | Chang |
| D888126 | June 23, 2020 | Lee |
| D912125 | March 2, 2021 | Gao |
| D912716 | March 9, 2021 | Sasaki |
Patent History
Patent number: D963493
Type: Grant
Filed: Oct 12, 2020
Date of Patent: Sep 13, 2022
Inventor: Paul Harris (Manalapan, NJ)
Primary Examiner: George D. Kirschbaum
Assistant Examiner: Lillian Windham
Application Number: 29/754,474
Type: Grant
Filed: Oct 12, 2020
Date of Patent: Sep 13, 2022
Inventor: Paul Harris (Manalapan, NJ)
Primary Examiner: George D. Kirschbaum
Assistant Examiner: Lillian Windham
Application Number: 29/754,474
Classifications
Current U.S. Class:
Thermometer (D10/57)