Wire lead-in device

- Yanegijutsukenkyujo
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Description

FIG. 1 is a front elevational view of a wire lead-in device showing my new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan viewt hereof;

FIG. 5 is a right side elevational view thereof, a left side elevational view being symmetrical;

FIG. 6 is a perspective view thereof;

FIG. 7 is a sectional view taken along line 7-7 in FIG. 3 thereof;

FIG. 8 is a sectional view taken along line 8-8 in FIG. 3 thereof; and,

FIG. 9 is a sectional view taken along line 9-9 in FIG. 3 thereof.

Claims

The ornamental design for a wire lead-in device, as shown and described.

Referenced Cited
U.S. Patent Documents
D538751 March 20, 2007 Kiely
D887366 June 16, 2020 Madathil Sankarankutty Nair
20170040938 February 9, 2017 Zhong
20190334333 October 31, 2019 Wade
Foreign Patent Documents
113881 December 2005 CA
304283909 September 2017 CN
Patent History
Patent number: D991187
Type: Grant
Filed: Jul 4, 2021
Date of Patent: Jul 4, 2023
Assignee: Yanegijutsukenkyujo (Takahama)
Inventor: Katsuyuki Okado (Takahama)
Primary Examiner: Rosemary K Tarcza
Assistant Examiner: Seth David Kumpf
Application Number: 29/797,949
Classifications