Earphone
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Description
The broken lines shown in the drawings illustrate portions of the earphone that form no part of the claimed design.
Claims
The ornamental design for an earphone, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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- JVC Compact True Wireless Headphones, date first available: Jun. 9, 2022, [retrieved Apr. 18, 2023], Retrieved from Internet, URL: <https://www.amazon.com/JVC-Headphones-Cancelling-Low-Latency-Bluetooth/dp/B0B3HNB1M4> (Year: 2022).
- HA-A6T-W Gumy Mini True Wireless Earphones, date not available, [retrieved Apr. 18, 2023], Retrieved from Internet, URL: <https://jvckenwoodstore.ca/products/haa6tw?pr_prod_strat=use_description&pr_rec_id=660ae9daa&pr_rec_pid=7066407010490&pr_ref_pid=676921%E2%80%A6> (Year: 2023).
- HA-A11T-B True Wireless Memory Foam Earphones, date not available, [retrieved Apr. 18, 2023], Retrieved from Internet, URL: <https://jvckenwoodstore.ca/products/haa11tb> (Year: 2023).
Patent History
Patent number: D995487
Type: Grant
Filed: Oct 27, 2021
Date of Patent: Aug 15, 2023
Assignee: JVCKENWOOD Corporation (Yokohama)
Inventor: Yuzuko Sasaki (Yokohama)
Primary Examiner: Messina L Smith
Assistant Examiner: Aram Kwon
Application Number: 29/813,132
Type: Grant
Filed: Oct 27, 2021
Date of Patent: Aug 15, 2023
Assignee: JVCKENWOOD Corporation (Yokohama)
Inventor: Yuzuko Sasaki (Yokohama)
Primary Examiner: Messina L Smith
Assistant Examiner: Aram Kwon
Application Number: 29/813,132
Classifications
Current U.S. Class:
Headphone (D14/223)