Headphone

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Description

FIG. 1 is a perspective view of a headphone showing the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a side elevational view thereof;

FIG. 5 is an opposite side elevational view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is a perspective view of another embodiment of the headphone, illustrating a mirror image of the headphone of FIGS. 1-7;

FIG. 9 is a front elevational view thereof;

FIG. 10 is a rear elevational view thereof;

FIG. 11 is a side elevational view thereof;

FIG. 12 is an opposite side elevational view thereof;

FIG. 13 is a top view thereof; and,

FIG. 14 is a bottom view thereof.

The broken lines illustrate portions of the headphone that form no part of the claimed design.

The shading is provided merely to represent contours of the design and does not connote the character of the surfaces such as any specific texture, material, gloss, translucence, transparency, surface treatment, or surface decoration.

Claims

The ornamental design for a headphone, as shown and described.

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Patent History
Patent number: D976870
Type: Grant
Filed: Oct 13, 2020
Date of Patent: Jan 31, 2023
Assignee: Harman International Industries, Incorporated (Northridge, CA)
Inventor: Hawa Laila Souchaud (Shenzhen)
Primary Examiner: Dana K Weiland
Assistant Examiner: Russell Carnell Smith, Jr.
Application Number: 29/754,657
Classifications
Current U.S. Class: Headphone (D14/223)