Method of manufacturing a sealing cap for an integrated circuit carrying substrate
A cap for sealing a substrate having integrated circuit chips thereon is manufactured by ultrasonically machining a pattern of channels in the top surface of a plate, the pattern of channels defining a plurality of pedestals at locations corresponding to integrated circuit chip locations on the substrate. The pedestal tops are then ultrasonically machined so that each top lies a predetermined distance from the top surface of the plate.Ceramic caps manufactured according to the present invention may be mass produced with precise dimensional tolerances.
Description
Patent History
Patent number: T105403
Type: Grant
Filed: Aug 2, 1984
Date of Patent: May 7, 1985
Inventor: Eric B. Hultmark (Wappingers Falls, NY)
Application Number: 6/636,877
Type: Grant
Filed: Aug 2, 1984
Date of Patent: May 7, 1985
Inventor: Eric B. Hultmark (Wappingers Falls, NY)
Application Number: 6/636,877
Classifications
Current U.S. Class:
264/23;
264/61;
Deforming The Surface Only (264/293);
357/74;
With Frame, Casing, Or Perimeter Structure (428/45)
International Classification: B29C 1708;
International Classification: B29C 1708;
