Abstract: A remote control includes a base and an insert that is attached in a detachable manner to the base. The base includes a remote control circuit, a button coupled to operate the remote control circuit and a fastener capable of holding the insert. The insert includes a printed publication (such as a card, a sheet of paper or a booklet) containing at least one leaf having human-understandable content (such as text and/or graphics). To assemble the remote control, a user attaches the insert to the fastener, so that the human-understandable content is laid over the button. Thereafter, when the user operates the button (e.g. by touching the leaf), the base transmits a remote control signal that causes a host device to visually display information related to the human-understandable content at the touched location. A base in the form of a three ring binder gives the user an intuitive feel of simply touching human-understandable content on a leaf in the binder to view a display of information related to the content.

Abstract: The invention relates to novel methods of detecting alterations in cell cycle regulation in a cell or a cell population and screening for agents capable of modulating cell cycle regulation through the use of multiparameter assays and a fluorescence-activated cell sorter (FACS) machine.

Abstract: The invention disclosed herein is a method and device for parallel detection and analysis of fluorescently labeled biopolymer molecules on a two-dimensional array using lasers for consecutive specific excitation to cause total internal reflection and a charge couple device for emission detection.

Abstract: Apparatus and methods for measuring light transmitted from a sample. The apparatus may include a stage, a light source, and a detector. The stage may be configured to hold a microplate having a plurality of sample wells. The apparatus may be configured to take frequency-domain time-resolved measurements of one or more of luminescence lifetimes and reorientational correlation times of a luminescent analyte in the sample.

Abstract: A chemical sensor includes an enzyme layer, a diffusion layer and an analyte barrier layer positioned over the diffusion layer. Apertures are formed by microfabrication in the analyte barrier layer to allow controlled analyte flux to the diffusion layer.

Abstract: An industrial and economical method for obtaining a (S)-3-halogeno-1,2-propanediol, which comprises cultivating a microorganism belonging to the genus Pseudomonas which has an ability to assimilate (R)-3-halogeno-1,2-propanediol and can grow by assimilating (R)-3-halogeno-1,2-propanediol as a single carbon source, in a culture medium containing a racemic 3-halogeno-1,2-propanediol as a substrate, and isolating the (S)-3-halogeno-1,2-propanediol from the culture medium.

Abstract: The solid-state image sensor comprises a semiconductor substrate, a plurality of photoelectric conversion sections formed within respective isolated active regions on the semiconductor substrate, an image area wherein unit cells comprising the plurality of photoelectric conversion sections and a signal scanning circuit are arranged in a two-dimensional array form, and signal lines for reading signals from the respective unit cells within the image pick-up area, wherein the respective photoelectric conversion sections being formed by at least twice ion implantation.

Abstract: A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bonding pads of the semiconductor chip, a solder resist formed on the main surface of the flexible wiring substrate and solder bump electrodes connected to the other ends of the wirings. The elastomer is bonded to the flexible wiring substrate on the side of the tape, the solder resist is formed on the side of the wirings, and the solder bump electrodes are connected with the wirings by way of through holes formed in the solder resist.

Abstract: A method includes a resin sealing step of placing, in a cavity 28 of a mold 20, a substrate 16 to which semiconductor elements 11 on which bumps 12 are arranged, a resin sealing step of supplying resin 35 to positions of the bumps 12 so that a resin layer 13 sealing the bumps 12 is formed, a protruding electrode exposing step of exposing at least ends of the bumps 12 sealed by the resin layer 13 so that ends of the bumps 12 are exposed from the resin layer 13, and a separating step of cutting the substrate 16 together with the resin layer 13 so that the semiconductor elements 11 are separated from each other.

Abstract: A method of fabricating a semiconductor device characterized in that the method includes the steps of forming basic structures of unit FETs on each of ‘m’ active layer regions more than the number of designed unit FETs and determining the number ‘n’ of desired basic structures on the basis of a drain current value of the semiconductor device predicted from a measured value of the drain current characteristics of one of the basic structures. The contact holes for electrical connections to electrodes of each of the unit FETs are formed for only the regions on ‘n’ basic structures in an inter-layer insulating film. In this manner, there is provided a method of fabricating a semiconductor device, the method being capable of improving degraded characteristics after the characteristics of TEG-FET have been measured.

Abstract: The invention provides a semiconductor integrated circuit of good quality, a manufacturing method for manufacturing such a semiconductor integrated circuit and a test method thereof.

Abstract: In a gate array, a gate length is measured by dividing gate electrodes into groups according to their materials to distinguish between those groups. The shape of a contact pad portion (5) of a gate electrode (4) differs according to the groups. A difference described here appears as shape such as cutouts (6a-6c) or projections (6d-6f), which is distinguishable by a scanning electron microscope, for example.

Abstract: A multilayer wiring substrate has a passive circuit element disposed on an insulating base substrate, and an insulating layer is disposed on the insulating base substrate with the passive circuit element interposed therebetween. The insulating layer is formed to have via holes for exposing specific portions of the passive circuit element, and a terminal electrodes are disposed in the via holes. Accordingly, the entire area of the multilayer wiring substrate can be reduced, and cracks caused by residual stress produced by a firing step can be prevented.

Abstract: In a method of manufacturing a semiconductor device, a first chip region and a second chip region are provided on a silicon wafer. A first resist pattern for the semiconductor device is to be formed in the first chip region, and the second chip region includes a plurality of characteristic evaluation regions for the semiconductor device, and a second resist pattern is to be formed in each of the plurality of characteristic evaluation regions for the semiconductor device. A data rate of the second chip region is determined based on a data rate of the first chip region. The data rate of the second chip region is determined such that a ratio of the data rate of the first chip region to the data rate of the second chip region is in a range of 1/4 to 4.

Abstract: After a cobalt film is deposited on a silicon-containing film formed on a semiconductor substrate, a first heat treatment at a relatively low temperature is performed with respect to the semiconductor substrate to cause a reaction between the cobalt film and the silicon layer and thereby form a Co2Si layer or CoSi layer in at least a surface portion of the silicon layer. Then, a silicon-containing film is deposited on the Co2Si layer or CoSi layer and a second heat treatment at a relatively high temperature is performed with respect to the semiconductor substrate to cause a reaction between the silicon-containing film and the Co2Si layer or CoSi layer and thereby form a CoSi2 layer in at least a surface portion of the silicon layer.

Abstract: A II-VI semiconductor device includes a stack of semiconductor layers. An ohmic contact is provided that electrically couples to the stack. The ohmic contact has an oxidation rate when exposed to an oxidizing substance. A passivation capping layer overlies the ohmic contact and has an oxidation rate that is less than the oxidation rate of the ohmic contact.

Abstract: A flip chip having solder bumps and an integrated flux and underfill, as well as methods for making such a device, is described. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes which heretofore have required separate fluxing and underfilling steps.

Abstract: A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the elastomer and formed with wirings connected at one end of the bonding pads of the semiconductor chip, a solder resist formed on the main surface of the flexible wiring substrate and solder bump electrodes connected to the other ends of the wirings. The elastomer is bonded to the flexible wiring substrate on the side of the tape, the solder resist is formed on the side of the wirings, and the solder bump electrodes are connected with the wirings by way of through holes formed in the solder resist.

Abstract: A multilevel interconnecting structure includes a plurality of interconnecting layers formed on a semiconductor substrate, a fluorine-doped oxide film for burying portions between the interconnecting layers, and an oxide film formed on the fluorine-doped oxide film, having a planarized surface, and not containing fluorine. A method of forming the multilevel interconnecting structure is also disclosed.

Abstract: Metal nitride and metal oxynitride extrusions often form on metal suicides. These extrusions can cause short circuits and degrade processing yields. The present invention discloses a method of selectively removing such extrusions. In one embodiment, a novel wet etch comprising an oxidizing agent and a chelating agent selectively removes the extrusions from a wordline in a memory array. In another embodiment, the wet etch includes a base that adjusts the pH of the etch to selectively remove certain extrusions relative to other substances in the wordline. Accordingly new metal silicide structures can be used to form novel wordlines and other types of integrated circuits.

Abstract: A method for fabricating a semiconductor structure is provided. A WSix (tungsten polycide) region is formed on an Si (silicon) region. At least a side surface of the WSix region is covered with a Si liner. The Si liner is then oxidized to form an SiO2 (silicon dioxide) liner covering the side surface of the WSix region.

Abstract: A liner material and method of use is disclosed. The method includes depositing a silicon layer into a deep void, such as a via or trench, and physical vapor depositing a cobalt seed layer onto the silicon. A supplemental cobalt layer is electroplated over the seed layer. The structure is then annealed, forming cobalt silicide (CoSix). The layer can be made very thin, facilitating further filling the via with highly conductive metals. Advantageously, the layer is devoid of oxygen and nitrogen, and thus allows low temperature metal reflows in filling the via. The liner material has particular utility in a variety of integrated circuit metallization processes, such as damascene and dual damascene processes.

Abstract: A method for fabricating a semiconductor device wherein an interconnect made of copper overlying a substrate is pretreated at a specified temperature, for example, at 300° C. or less; and a dielectric film is formed on the copper at a temperature higher than that of the pretreatment. In accordance with the present invention, the adhesion between the copper and the dielectric film is improved by conducting the pretreatment of the dielectric film for reducing an oxide layer of the copper surface, and the agglomeration of the copper can be prevented by the pretreatment.

Abstract: A method for fabricating a capacitor of a semiconductor device is provided. In the capacitor fabricating method, the step of forming a lower electrode by using gas including chlorine is included after the step of forming hemispherical grained silicon (HSG-Si) seeds. Also, after the step of selectively growing only HSG-Si seeds formed on the lower electrode, the step of removing the HSG-Si seeds formed on an insulation layer pattern through an etching process using a gas including chlorine is included. Thus, the surface area of the lower electrode is increased, so that capacitance is increased. Also, an electrical short between the lower electrodes of each adjacent capacitor can be prevented without decreasing capacitance.

Abstract: A method of planarizing an oxide layer. The method includes performing an isotropic chemical dry etching operation using a nitrogenous processing gas. Furthermore, oxygen can also be added to the nitrogenous processing gas during the isotropic chemical dry etching operation. In addition, the nitrogenous processing gas can be nitrogen or a nitrogen-oxygen compound, where the nitrogen-oxygen compound can be nitrogen monoxide, nitrogen dioxide or nitrous oxide.

Abstract: There is provided a liquid processing apparatus for carrying out a process, such as cleaning, with a chemical serving as a processing liquid, with respect to a semiconductor wafer W which serves as an object to be processed and which is housed in a processing chamber. A chemical tank 10 for storing therein the chemical has a double vessel structure which has an external tank 2 and an internal tank 1 housed in the external tank 2. Supply pipe-lines 14a, 14b and 14c are provided for supplying the chemical from the external tank 2 and the internal tank 1 to the processing chamber. A return pipe-line 56 is provided for returning the chemical from the processing chamber to the external tank 2. The outer periphery of the external tank 2 is surrounded by a heater 4.

Abstract: A method is disclosed for the formation of a planarizing coating film on the surface of a substrate having a stepped level difference under processing for the manufacture of semiconductor devices.

Abstract: An electrical connector housing includes a lower shell, a connector block and an upper shell. An upper panel of the lower shell includes a first fixing mount and a draw hole, and the upper shell includes an outer side face having a second fixing mount. The upper panel of the lower shell has an inner face including a rib which is placed near the draw hole and extends towards the side panel of the lower shell while surrounding the draw hole. Likewise, the upper face of the connector block includes a pair of partition walls at a position corresponding to that of the rib, so that, when the connector block is inserted into the lower shell, the partition walls are closely superposed on the rib, and a draining space is formed away from a space for fixture ports for electrical parts, and leads to the drain hole. Such a configuration prevents the electrical connector housing from becoming too large and too costly. Such a housing structure also provides a better waterproofing quality.

Abstract: An electrical connection box is equipped with a bus bar laminate composed of bus bars and insulation layers, and a printed circuit board electrically connected with the bus bar laminate. First ends of connecting terminals are soldered to conductors of the circuit board. Connection tabs are provided by bending up parts of the bus bar. An insertion groove is provided in the end parts of each male tab, or in the second end of each connecting terminals, with the other thereof being inserted into and held in the insertion grooves. Therefore, reliable and economic connection is obtained.

Abstract: A multifunctional electronic palmtop computer comprising, in a single box-like body, a keyboard (14), a display (15), a CPU, working storage and mass storage, a printer and a PCMCIA card interface (23), further comprising a protective cover (25) for the interface (23) which is provided with locking means adapted to prevent direct accessibility to the interface.

Abstract: A lamp holder has a contact spring which, instead of being bent into a U-shape and having its barb on the bracing shank opposite the retaining shank, has a bracing barb or lug bent out of the retaining shank itself and engageable as an indexing member behind a projection formed on the lamp housing.

Abstract: A half-fitting prevention connector (1) comprises a female connector (2) including a female housing (4), and a male connector (3) including a male housing (5) fittable to the female housing (4). A pair of lock arms (9) elastically deformable inwardly and downwardly are formed on an upper portion of the female housing (4). Lock claws (8) are respectively formed on front ends of the lock arms (9), and have pressing surfaces (15) on front ends thereof and sliding surfaces (16) on outer surfaces thereof. A pair of operating walls (11) are formed on an upper portion of the male housing (5), and have locking engagement surfaces (7) on rear ends thereof and first tapering surfaces (12) which are inclined to gradually approach each other toward the rear ends of the operating walls (11) from front ends of the operating walls (11). A resilient member (10) is attachable to the male housing (5) so as to extend between the locking engagement surfaces (7).

Abstract: A card connector having a guide portion to ease loading/unloading of a memory card. The card connector includes a substantially rectangular slot defined by a top edge, a pair of side edges, and a bottom margin. The guide portion is disposed adjacent the slot and has a bottom wall and a pair of side walls. A first tapered feature, disposed on the bottom wall, is directed from a leading edge of the bottom wall toward the bottom margin of the slot. Each of the side walls has a second tapered feature directed from a leading edge of the side wall toward one of the pair of side edges of the slot.

Abstract: A hollow tubular part (14) constituting a part of a terminal protection cap (11) has a cap part (13) and a large-diameter portion (15) located adjacent the cap part (13). A tapered portion (16) is continuous with the large-diameter portion (15); and a small-diameter portion (17) is continuous with the tapered portion (16). The thickness of the tapered portion (16) and the thickness of the end of the small-diameter portion (17) adjacent the tapered portion (16) are smaller than the thickness of the large-diameter portion (15) and the thickness of sections of the small-diameter portion (17) further from the tapered portion (16).

Abstract: In a connector unit 3 comprising a connector housing 1 which includes at least one terminal receiving chamber 8 into which a metal terminal 4 or 5 is inserted from a back side, the metal terminal being locked by a lance 10 for prevention of a backward withdrawal, and a front holder 2 coupled to the connector housing from a front side, the front holder 2 is provided with at least one terminal insertion hole 11 into which a mating terminal T is adapted to be inserted from a front side so as to be connected with the metal terminal, and at least one draw jig hole 13 through which a draw jig 7 is inserted from a front side to force the lance to be elastically deformed thereby to disengage a lock between the lance and the metal terminal. The draw jig hole 13 adjacent to the terminal insertion hole 11 is provided with a guide support section 15 which can guide the draw jig to move back and forth, and bear a reaction force from the lance acting on the draw jig when the lance is disengaged.

Abstract: A connector assembly comprises an insulating housing with interconnected front and rear housing parts, a plurality of contact elements arranged in the housing in rows and columns, each contact element being provided with a first section having a mating contact end and a second section having a connection end. The rear housing part comprises a plurality of module housings, each module housing accommodating one column of contact elements. Each module housing is provided with at least one opening exposing at least one contact element of the corresponding column of contact elements. A shielding plate is inserted between adjacent columns of contact elements, the shielding plate contacting the one contact element through the opening. The shielding plate is provided with fastening means and is attached to the one contact element by means of the fastening means only.

Abstract: The invention provides a connector wherein a terminal fitting provided with a metal lance is retained by a retainer. A cavity 21 is formed within a housing 20 and is capable of housing a terminal fitting 10 provided with a metal lance 15. A retainer attachment hole 22 opens into the cavity 21 and allows the attachment of a retainer 30 which engages with the terminal fitting 10. This retainer attachment hole 22 opens into a lower face of the housing 20. A stopping wall 24 which retains the metal lance 15 is formed at an anterior side of the cavity 21 and, to its anterior is a jig insertion hole 26 from which a jig for bending the metal lance 15 can be inserted. Another jig insertion hole 40 is formed in a posterior end of the retainer 30. Another jig 51 is inserted therein, extends along a posterior end face 23A of an opening 23 of the retainer attachment hole 22, and thereby bends the metal lance 15 which is caught against the posterior end face 23A of the opening 23.

Abstract: A simplified fitting detecting connector is provided. A female housing 20 is provided with a chamber 21 which is open to the anterior and in which coiled springs and a slider 41 are housed. The slider 41 is capable of moving in an anterior-posterior direction within the chamber 21. When the female housing 20 is fitted with a male housing 10, the slider 41 is pushed towards the posterior by the male housing 10, the coiled springs compress, and the slider 41 moves towards the posterior. If the fitting operation is halted part-way through, the spring force of the coiled springs is released, separating the two housings 10 and 20. A locking arm 46 is formed in a unified manner on an upper of the slider 41. When the two housings 10 and 20 have been correctly fitted together, they are maintained in this state by this locking arm 46.

Abstract: An outboard motor has an engine in which a crankshaft is disposed perpendicularly, a flywheel is disposed to an upper end portion of the crankshaft to be rotatable in unison with the crankshaft and the flywheel is provided with a detecting member a motion of which is detected by a sensor means for detecting a detecting number of revolution and a revolution angle of the crankshaft. The detecting member is disposed in an axial direction of the crankshaft.

Abstract: A 2-warp knit, weft inserted fabric having the face thereof calendered to produce a fabric when a PVC film is laminated thereto that has a surface roughness of 2.0 microns or below.

Abstract: A preferred filter media is provided. The media includes a fine fiber web secured to the surface of a coarse fiber support. A preferred filter media, comprising multiple layers of fine fiber media separated by coarse fiber support, is provided. Advantageous filter constructions result and are provided. Also according to the disclosure, methods for using such arrangements to filter are provided.

Abstract: A retainer for retaining an abrasive pad on a lens making machine and an abrasive pad adapted to such retention comprises a retainer nestable with a lap of a lens making machine wherein when such retainer is nested, a pad placed upon said lap before nesting will be trapped in the desired position. The pad of the invention includes radially outwardly extending members beyond the working area of the pad whose purpose is to be trapped by the retainer. The invention enables automatic loading and unloading of pads on the lens making machine.

Abstract: A method and system are presented for monitoring a process sequentially applied to a stream of substantially identical articles by a processing tool, so as to terminate the operation of the processing tool upon detecting an end-point signal corresponding to a predetermined value of a desired parameter of the article being processed. The article is processed with the processing tool. Upon completing the processing in response to the end-point signal generated by an end-point detector continuously operating during the processing of the article, integrated monitoring is applied to the processed article to measure the value of the desired parameter. The measured value of the desired parameter is analyzed to determine a correction value thereof to be used for adjusting the end-point signal corresponding to the predetermined value of the desired parameter for terminating the processing of the next article in the stream.

Abstract: A production type surface finishing apparatus for finishing the surfaces of workpieces such as cabinet doors and the like which include a plurality of relatively large, very lightweight finishing platens that are simultaneously movable in both a reciprocal and an orbital-like motion. The platen is moved in a reciprocal motion by a first motion-imparting mechanism and is simultaneously moved in a high-frequency, orbit-like motion by a second motion-imparting mechanism that includes shafts which are rotated at relatively high rates of speed. The shafts, and the motors which drive them, are mounted on platforms which are reciprocally movable relative to the main frame of the device. Connected to the rotating shafts by specially designed elastomeric sleeve-like members or yieldably deformable connector bands are specially configured, ring-like members. The rings are, in turn, connected to the platen assemblies by novel shaft and bearing assemblies.

Abstract: A retainer for retaining an abrasive pad on a lens making machine and an abrasive pad adapted to such retention comprises a retainer nestable with a lap of a lens making machine wherein when such retainer is nested, a pad placed upon said lap before nesting will be trapped in the desired position. The pad of the invention includes radially outwardly extending members beyond the working area of the pad whose purpose is to be trapped by the retainer. The invention enables automatic loading and unloading of pads on the lens making machine.

Abstract: A finishing orbital sander (1) includes a main body (2) and a base (12) provided below the main body. Provided between the main body and the base are a plurality of foot assemblies (22). Each assembly in turn includes a cylindrical or columnar foot (23) made of aluminum and a pair of rubber O-rings (25) at both ends of the cylindrical foot. Each foot additionally includes reduced diameter sections (24) at both ends, where the O-rings are disposed. The reduced diameter sections (24) are fitted in the O-rings and placed in recessed seats (26) provided in opposing surfaces of the main body (2) and the base (12), thus elastically supporting the aluminum feet (23) in the axial direction thereof. The axial dimension of each reduced diameter section (24) is made no longer than the thickness (i.e., the axial dimension) of the O-ring (25), so that the tip end of the reduced diameter section does not exceed or project from the axial outermost end of the O-ring.

Abstract: In the conventional diversity reception, information included in each non-selected signal does not contribute to an improvement in the reliability of communications, and transmitting power has been dissipated to satisfy required communication quality. Owing to the setting of encoding in respective base stations to injection, signals each including the same contents, which are received by a mobile station, are used for increasing the reliability of communications without depending on the number of the signals which were capable of being received by the mobile station, to thereby reduce transmitting power for satisfying required communication quality.

Abstract: A system (100) for mitigating intermittent interruptions in an audio radio broadcast system is provided wherein a primary radio signal and a redundant radio signal are transmitted from a transmitter subsystem (120) and received by a receiver subsystem (140). The output (112) of an audio source (110) is coupled to a modulator (160) for modulating a radio frequency signal (162) for coupling to a transmit antenna (172). A second output (114) of audio source (110) is coupled to a delay circuit (116), for adding a predetermined time delay thereto. The delayed audio source signal is coupled to modulator (164) for modulating a second radio frequency signal (166) that is also coupled to the transmit antenna (172). The receiver subsystem (140) receives both the primary radio signal and the delayed redundant radio signal and couples each to a respective demodulator (180, 182).

Abstract: The device may be formed by joining together two devices which have each a main face with a keyboard or a display, the main faces being turned away from each other. The device may also be a monoblock with two useful faces which are turned away from each other.