Abstract: A method for reactive ion etching of SiO2 and an etch stop barrier for use in such an etching is provided. A silicon nitride (SixNy) barrier having a Six to Ny ratio (x:y) of less than about 0.8 and preferably the stoichiometric amount of 0.75 provides excellent resilience to positive mobile ion contamination, but poor etch selectivity. However, a silicon nitride barrier having a ratio of Six to Nx (x:y) of 1.0 or greater has excellent etch selectivity with respect to SiO2 but a poor barrier to positive mobile ion contamination. A barrier of silicon nitride is formed on a doped silicon substrate which barrier has two sections. One section has a greater etch selectivity with respect to silicon dioxide than the second section and the second section has a greater resistance to transmission of positive mobile ions than the first section. One section adjacent the silicon substrate has a silicon to nitrogen ratio of less than about 0.8.

Abstract: There is provided a ball-grid-array semiconductor device. The semiconductor device has a semiconductor element sealed with a resin material. In addition, a lead frame is connected to the semiconductor element in the resin material. The lead frame is provided with terminal portions that protrude through the surface of the resin material.

Abstract: A packaged semiconductor device having high reliability which can solve the problems that many pins are to be loaded, that is, that the density of the electrical wirings becomes high, and the heat loss properties thereof decrease, and which can discharge the high pressure moisture in a gas state from the inside thereof to the exterior, comprising: a strengthening ring arranged around a semiconductor chip comprising a process type electrode on an isolated substrate; a resin to fill spaces between the semiconductor chip and the isolated substrate; and a cap on the semiconductor chip and the strengthening ring, wherein at least one vent is formed perpendicular to the direction of the thickness of the semiconductor chip.

Abstract: A mounting substrate and related mounting method for a semiconductor device. The mounting substrate includes a mounting area to which the semiconductor device is to be mounted and fixed by an adhesive, a peripheral channel formed in the mounting substrate so as to surround the mounting area, and radial channels extending radially from the center towards the periphery of the mounting area. An adhesive is applied at least to either the center of the mounting surface of the semiconductor device or the center of the mounting area of the mounting substrate. The semiconductor device is placed on the mounting area and the adhesive flows outwardly along the radial channels, with the adhesive then being cured. The peripheral channel provides control of the amount of adhesive which flows to the outside of the semiconductor device and the mounting area. The adhesive overflow can be adjusted such that adhesive climbs up the sides of the semiconductor device but not reach the upper surface of the device.

Abstract: A method for fabricating a BGA package is provided. The method includes the step of providing a substrate having a first surface with a pattern of conductors thereon, and an opposing second surface with a die attach area thereon. A first solder mask is formed on the first surface with via openings to ball bonding pads on the conductors. A second solder mask is formed on the second surface with an opening on the die attach area. The opening in the second solder mask permits a die to be placed through the opening and adhesively bonded directly to the substrate. The die can then be wire bonded to the conductors and encapsulated in an encapsulating resin. In addition solder balls can be placed in the via openings and bonded to the ball bonding pads.

Abstract: A plurality of semiconductor chips are mounted and sealed with a resin layer. Each of the semiconductor chips is secured by a surface thereof opposite to an element forming surface onto either side of a die pad, and at least a pair of the semiconductor chips are secured on at least one side of the die pad so that the element forming surfaces thereof face each other, and first electrode sections provided on the element forming surfaces are coupled together by a conductive coupling material. Therefore, a semiconductor integrated circuit device having many semiconductor chips fitted in a single package can be easily fabricated while restraining increases in the down-set value of the die pad from the reference surface and maintaining a high level of accuracy.

Abstract: A substrate that is substantially non-wettable to adhesive resin is disclosed. The substrate is coated with a fluorinated silane composition.

Abstract: A semiconductor chip package that includes discrete conductive leads in electrical contact with bond pads on a semiconductor chip. This chip/lead assembly is encapsulated within an encapsulating material and electrode bumps are formed through the encapsulating material to contact the conductive leads. The electrode bumps protrude from the encapsulating material for connection to an external circuit.

Abstract: In conventional semiconductor devices, customarily, it is sought to position the mounting region of a semiconductor element in the center of a package, and hence the dimensions of the package are increased unnecessarily, but the object of the present invention is to avoid unnecessary increasing of the package dimensions, without impairing the required functions of the semiconductor device.

Abstract: A flexible substrate based BGA package mainly comprises a semiconductor chip securely attached onto a flexible film substrate through a nonconductive adhesive. The flexible film substrate is formed from a flexible film having a chip attaching area for carrying the semiconductor chip. The upper surface of the flexible film is provided with a plurality of chip connection pads, a plurality of solder pads, and at least a dummy pad which is disposed centrally on the chip attaching area. The purpose of the dummy pad is to increase the rigidity and strength of the central part of the chip attaching area. The chip connection pads are arranged about the periphery of the chip attaching area for electrically connected to the semiconductor chip. The solder pads are disposed about the dummy pad(s) and electrically connected to the corresponding chip connection pads.

Abstract: In a semiconductor device, a ceramic package having a first surface and a second surface and having a recession section provided on the first surface side is provided. The recession section has a first opening provided at a center portion of the recession section and penetrating to the second surface, and pads provided in a peripheral portion of the second opening on the first surface side of the recession section. A semiconductor element mounted on a mount substrate is inserted in the first opening from the second surface side of the ceramic package. The semiconductor element is smaller than the mount substrate and has pads in a peripheral portion of the semiconductor element. The pads on the recession section and the pads on the semiconductor element are connected by electrically conductive wires.

Abstract: A semiconductor device includes a heat sink adjacent to a die. A dam is positioned at the peripheral edges of the heat sink. During a transfer molding process, the dam serves two purposes. First, the dam prevents damage to the mold. Second, the dam prevents encapsulant packaging compound material from flowing onto the heat sink. The dam may be a gasket. The dam may also be a burr created by, for example, stamping the bottom of the heat sink. The dam may include copper, polyamides, and leadlock tape. The dam may be permanently connected to the heat sink for removal following packaging. The dam may be removed mechanically, through the use of heat, or during an electrolytic deflash cycle.

Abstract: Provided is a mount for an integrated circuit that features a routing carrier having first and second power planes and first and second signal layers. The first and second signal layers are disposed between the first and second power planes so that the return path for current propagating along the signal layers is in one of the adjacent power planes. To that end, another embodiment of the present invention provides that the distances between the signal layers and power planes are substantially constant over the volume of the routing carrier to ensure, which provides a constant impedance between one of the first and second signal layers and the power plane adjacent thereto.

Abstract: A semiconductor device featuring high yield and high reliability is provided. The semiconductor device includes a pad member having an electrical connection region, a passivation layer formed around the electrical connection region, and a bump electrode formed on the pad member. The bump electrode includes an electroless metal plating layer formed on the electrical connection region, and an electroless gold plating layer covering the electroless metal plating layer. The electroless gold plating layer has a thickness of 0.4 &mgr;m or more.

Abstract: Bump electrodes are formed on a semiconductor pellet by tearing off conductive wires so as to expose fresh metal, and pad electrodes on a circuit board are cleared by exposing them to an ionic beam or an atomic beam; when the bump electrodes are bonded to the pad electrodes, bump electrodes are heated to a certain temperature lower than the melting point of the metal, and are pressed against the pad electrodes, thereby preventing the bump electrodes from undesirable short-circuit.

Abstract: An array of solder balls is directly covered with a reinforcing resin layer after fixing the solder balls to a conductive pattern by means of conductive paste or during reflow thereof concurrently with the thermosetting step for the reinforcing resin layer so that the manufacturer eliminates a solder resist from between the conductive pattern and the reinforcing resin layer.

Abstract: A package 300 for a flip chip integrated 331 circuit including an interposer 303 with electrical interconnecting for signal, power, and ground contacts. Routing is accomplished on only two conductor layers through the use of selective planes and buses. Multiple power planes are provided on a single conductor level to support circuits having different operating voltages. A unique cavity down BGA package for a flip chip interconnected integrated circuit is provided by adhering the interposer to a thermally conductive stiffener or base 304, and using solder balls 308 to attach the frame to the base and interposer. The assemblage forms a chip cavity with interconnecting vias to external BGA solder balls terminals located in the perimeter frame.

Abstract: A microelectronic assembly includes a first element and a second element with confronting, spaced-apart interior surfaces defining a space therebetween and contacts on the interior surfaces and masses of an electrically conductive material having a melting temperature below about 125° C. in the space so that each mass is disposed between a contact on the first element and a contact on the second element and so that the masses electrically connect the contacts to one another. A flowable liquid material is provided around the masses and between the confronting surfaces, and the liquid material is cured to form a compliant dielectric layer thereat.

Abstract: A semiconductor device includes a semiconductor element provided on a substrate, a lead-in wiring electrically provided on a substrate, a lead-in wiring electrically connected with the electrode of the semiconductor element, a barrier metal film for covering the lead-in wiring surface for protecting the lead-in wire, wherein the section of the lead-in wiring is inversely trapezoidal in shape vertial to the lengthwise direction of the lead-in wiring.

Abstract: In the present invention, the bonding pad is formed in a lattice-like shape. Directly underneath the passivation layer, the etching stopper layer is provided. An opening is made through the passivation layer and the etching stopper layer so as to expose the bonding pad. The cavity sections of the lattice-like shape of the bonding pad are filled with the insulating layer. The bonding wire is connected to the lattice-shaped bonding pad. With this structure, the bonding error of the device manufactured by the damascening process can be avoided.

Abstract: An integrated circuit has first structures that are produced in a plurality of wiring planes using exposure masks and serve for producing a functionality required by the user of the circuit. The circuit also has second structures that are produced in a plurality of the wiring planes using the exposure masks and do not serve for the particular functionality, but rather for the capability of checking if the exposure masks used belonged to a common mask set.

Abstract: Signal lines running within a sense amplifier band provided extending in a row direction in a memory array portion are formed in a hierarchical structure having an upper interconnection layer and a lower layer interconnection layer. Thus, a semiconductor memory device suitable for merging with logic and capable of effectively utilizing a multi-layer interconnection structure in the memory array portion can be provided.

Abstract: An amorphous dielectric material having a dielectric constant of 10 or greater is provided herein for use in fabricating capacitors in integrated circuit applications. The amorphous dielectric material is formed using temperatures below 450° C.; therefore the BEOL metallurgy is not adversely affected. The amorphous dielectric material of the present invention exhibits good conformality and a low leakage current. Damascene devices containing the capacitor of the present invention are also disclosed.

Abstract: A semiconductor device containing a circuit board, an anisotropic conductive film and a semiconductor element electrically connected to the circuit board via the anisotropic conductive film, wherein the anisotropic conductive film contains a film substrate made from an insulating resin and plural conductive paths insulated from each other, which paths are disposed in and through the film substrate in the thickness direction, and wherein a gap is formed between the surface on the circuit board side of the film substrate and the board surface of the circuit board. The connection part between the anisotropic conductive film and the circuit board, as well as the connection part between the anisotropic conductive film and the semiconductor element do not suffer from interface destruction even when the device is used in an environment associated with radical temperature changes. Thus, a semiconductor device having high connection reliability can be obtained.

Abstract: A semiconductor device includes a semiconductor chip and a circuit formed in the semiconductor chip. Pads are arranged in a plurality of rows on the semiconductor chip and electrically connected to the circuit. The pads on adjacent rows are offset from each other. Leads are provided on the semiconductor chip and bonding wires selectively connect the leads to the pads.

Abstract: An integrated circuit having a first plurality of wire bond pads located along a horizontal axis, a second plurality of wire bond pads located along a vertical axis, and a plurality of C4 pads arranged in a grid array wherein each grid is defined by the intersection of one of the first wire bond pads and one of the second wire bond pads.

Abstract: An engine intake control mechanism has a throttle valve that can be rotated to a cold-starting position in response to the closing movement of a choke valve and, even if the throttle valve is opened beyond the cold-starting position, the choke valve is retained at the cold-starting position. Only when the throttle valve is subsequently actuated to return to its original closed position is the choke valve automatically returned to its original opened position. The engine intake control mechanism is especially useful in top handle type portable power working machines, which are subject to undesirable movements of the throttle control lever on the top handle when the engine is being started.

Abstract: To provide an overflow device for suppressing undue emission of fuel from an overflow pipe which can be produced with a simple structure at a low cost, and can be simply applied also to any existing carburetors. An overflow device for a float type carburetor includes an overflow pipe having an upper end opening exposed to a space in a float chamber defined above a constant fuel level in the float chamber, and a shield member arranged above the constant fuel level for forming a shielded space in the vicinity of the upper end opening. The shield member has a side wall vertically extending above and below the upper end opening, a top wall positioned above the upper end opening, and a bottom wall positioned below the upper end opening. The bottom wall is formed with fuel holes for allowing the fuel to flow into and out of the shielded space. The side wall is formed with small vent holes capable of suppressing the entry of the fuel into the shielded space.

Abstract: A gas/liquid mixing device is provided in which bubbles having such a small diameter as to be invisible to the eye are produced and dissolved in water in a short time, whereby the solution of gas can be improved greatly. The gas/liquid mixing device has a mixing cylinder, a drive unit, and a gas supply means. In the mixing cylinder, a rotary vane having guide vanes is the mixing cylinder and gas supplied into the mixing cylinder so that the water flow containing the bubbles is dispersed outwardly through bubble dispersing holes formed in the wall of the mixing cylinder.

Abstract: The invention relates to a gas-liquid contacting column consisting of a number of axially spaced contacting trays, which trays consist of one or more liquid receiving areas and one or more downcomers, which liquid receiving areas and downcomers are spaced in a bubble area and which downcomer has at its upper end a liquid receiving opening and at its lower end one or more downward directed liquid discharging openings, which openings are positioned above the liquid receiving area of the consecutive lower contacting tray and positioned at more than 10% of the tray spacing above this liquid receiving area, wherein along the boundary of the liquid receiving area and the bubble area a weir is present.

Abstract: Methods and apparatuses are provided for the manufacture of coextruded polymeric multilayer optical films. The multilayer optical films have an ordered arrangement of layers of two or more materials having particular layer thicknesses and a prescribed layer thickness gradient throughout the multilayer optical stack. The methods and apparatuses described allow improved control over individual layer thicknesses, layer thickness gradients, indices of refraction, interlayer adhesion, and surface characteristics of the optical films. The methods and apparatuses described are useful for making interference polarizers, mirrors, and colored fihns that are optically effective over diverse portions of the ultraviolet, visible, and infrared spectra.

Abstract: A wind tunnel blade (30) connected to a base (32) and held in position by a two-piece cuff (34). The wind tunnel blade (30) is formed in a resin transfer molding process in which central, fore, and aft foam core sections (70, 72, 74) are placed together to form the wind tunnel blade (30). Radius fillers (120) are used to fill the gaps between the outer edge of the foam core sections. The radius fillers (120) used in the wind tunnel blade (30) are formed by a braided sleeve (122) surrounding a number of unidirectional tows (124). A tip (68) is formed separately from the rest of the wind tunnel blade (30) and is glued to the top thereof. Stacked layers of braided fibers (100) are used to reinforce the central core section (70).

Abstract: The bellows (6) of a filter cartridge is inserted into an injection-molding die (3) and provided with the plastic frame (24) by an injection-molding process. The surfaces of the die (3) that lie opposite one another are provided, at least at their edge surfaces (15), with sawtooth-like profiles (1, 2; 30, 31). The sawtooth-like profiles engage with one another and hold the individual folds (22, 23; 35, 36) of the bellows (6) in a defined position relative to one another. The bellows (6) is held by the profiles (1, 2; 30, 31) at its face edges (19) over a narrow region (18), and pressed together, forming a seal, for the injection-molding process.

Abstract: Method for decorating the top of a compression-molded cap of synthetic material intended to close a container, in which the decoration is positioned on a flat support in the form of a disc which is placed in the cavity of the cap forming mold before the constituent material of the cap is introduced, and is found to be bonded to the top of the cap after its removal from the mold.

Abstract: A molding and tentatively retaining mold 10 of the invention has a plurality of molds which are relatively movable with respect to a fixed mold, and molds a housing 31 and rear holders 32 and 33, which are respectively independent, in a plurality of cavities formed in cooperation with the fixed mold. Diameters of runners serving as channels for the charging of a resin material into cavities of a molding and tentatively retaining mold are set for the respective cavities such that the charging of the resin material into the cavities is completed substantially at the same time.

Abstract: A pipe section formed of a polymeric material which has a substantially constant thickness throughout, the terminal edge of the female connection having a reinforcement structure which rigidifies the end of the female connection and prevents deformation, the pipe section preferably having a flared end, and the reinforcement structure preferably being a semicircular channel formed at the end of the pipe section by a mandrel after initial extrusion of the pipe section; along with a method and apparatus for forming the pipe section, a pipe assembly including such pipe section, and a method of forming the pipe assembly.

Abstract: The present invention provides a resin-molding method comprising the steps of: placing a circuit base member onto a mounting face of first one of paired dies, wherein a back face of the circuit base member is in contact with the mounting face; placing the paired dies in a closing state for clamping a peripheral region of the circuit base member with the paired dies; and injecting a molten resin into a cavity of the paired dies for filling the cavity with the injected resin, wherein, in the closing state, a first pressure effected to a front face of the circuit base member is set higher in pressure level than a second pressure effected to the back face of the circuit base member, so as to secure the circuit base member to the mounting face.

Abstract: A multi-layered plastic pipe particularly suitable for use as an intake manifold of an internal combustion engine is provided. The present pipe includes a hollow plastic core, at least one spacer member provided on the hollow plastic core and an outer layer integrally provided on the outer peripheral surface of the hollow plastic core excepting the spacer member. The spacer member is preferably formed from a plastic material, and the outer layer is also formed from a plastic material. There is also provided a method for manufacturing a multi-layered plastic pipe using a spacer member to prevent a hollow plastic core placed in a mold cavity from being deformed when a molted plastic material is supplied into the mold cavity under pressure.

Abstract: The present invention discloses a method and apparatus for a Vehicle Suspension System for a vehicle. The present invention comprises a left spring coupled to the chassis of a vehicle. The leaf spring couples to a rigid arm, which in turn couples to a pivotal axis that is located at a position offset from the neutral axis of the leaf spring. The position of the pivotal axis with respect to the neutral axis of the leaf spring varies the rate of leaf spring so as to soften or stiffen the suspension system.

Abstract: A vibration absorber for absorbing a vibration between first and second members each of which is connected to the vibration absorber, includes a movable member adapted to contact with a fluid, and including a portion connected mechanically to one of the first and second members so that a movement of the fluid and a movement of the portion of the movable member correspond to each other, and a fluid moving member for flowing the fluid in either of an extension direction in which the portion of the movable member moves to increase a distance between the first and second members and a contraction direction in which the portion of the movable member moves to decrease the distance between the first and second members in such a manner that the vibration is restrained by a change of the distance between the first and second members from being transmitted between the first and second member.

Abstract: A fluid isolator apparatus (20) for isolating vibration between a vibrating member, such as a helicopter transmission or pylon and another structure, such as a helicopter fuselage. In one aspect, the fluid and elastomer apparatus (20) includes an inner member (24), an outer member (22), and an elastomer element (26) flexibly interconnecting them. First (30) and second (34) operating chambers are interconnected by a passageway (36). Fluid (37) oscillates between the operating chambers (32, 34) through passageway (36). A spring (42) flexibly suspends the piston (40) such that dynamic motion between said inner and outer member (24, 22) displaces piston (40) and spring (42). Preferably the a hollow cavity (28) houses both the piston (40) and a metal coil spring (42). The stiffness of the coil spring (42) may be interchanged to adjust a resonant parameter. Optionally, the piston mass itself or an additional tuning mass (58) mounted on the piston (40) may be used to accomplish tuning.

Abstract: A sheet conveying device of the present invention includes a roll-up guide rotatable about a shaft. When the roll-up guide is shifted to a roll-up position where it intersects a first tray, it rolls up a sheet discharged and stores the sheet in the form of a roll. The roll-up guide allows, when shifted to a pick-up position above the body of the device, the operator of the device to pick up the rolled sheet from the roll-up guide at the operating position in front of the device. The device is easy to operate and is capable of storing a sheet in the form of a roll and allowing the roll to be safely picked up without any damage.

Abstract: An amusement article utilizing multiple balls comprising: an upper chamber with multiple spherical members of varying sizes colors, all spherical members of the same size bearing the same color, a second chamber located below the upper chamber, and receiving the spherical members from the upper chamber through opening of a valve. A ball distribution device is located within the second chamber and functions to sort all spherical members according to their size and color. Vertical cylindrical chambers are located below the second chamber function to receive the spherical members from the ball distribution device. Each cylindrical chamber receives spherical members of one size and color only. A lower chamber is located below the cylindrical chambers and functions to receive all spherical members through opening of a release member located at a bottom portion of the cylindrical chambers. A bottom reservoir is located below the lower chamber and functions to receive spherical members from the lower chamber.

Abstract: A gaming machine is disclosed, the machine having a plurality of spinning reels viewed through a flat transparent panel. Touch screen circuitry is bonded with said panel and forms an array of “touch points” or data inputs by which game operation can be effected.

Abstract: The machine tool, especially a hammer drill or chisel, has a rotatable and/or axially movable tool holder (10,12) for a tool (16) having a grooved shaft. The tool holder (10,12) includes a base body (22); two radially movable locking bodies (18,20) held in the base body and movable into respective locking positions engaged in two closed grooves (26,28) in the tool shaft; a bearing member (32) movable between a bearing position for holding the locking bodies (18,20) in the locking position and a releasing position in which the locking bodies are movable out of the grooves; an operating member (36,38) connected with the bearing member (32) for moving the bearing member (32) and a resilient plastic guiding member (42,44) arranged to guide the locking bodies (18,20) radially outward during motion from the locking to unlocking position and to act on the locking bodies (18,20) with a radially inwardly directed spring force.

Abstract: A tool-bit holding device in a percussion tool includes a rotatable and axially-movable retainer sleeve for accommodating a shank of a tool bit. A lock member supported by the retainer sleeve is movable radially with respect to the retainer sleeve. The lock member can engage the shank of the tool bit to limit axial movement of the tool bit. A small-diameter surface portion formed by an inner surface of a fixed front cover contacts the rock member and projects at least part of the lock member inward of the retainer sleeve to engage the lock member with the shank of the tool bit when the retainer sleeve is placed at an active position. A conic surface portion formed by the inner surface of the front cover is engageable with the lock member, and is able to variably limit radial movement of the lock member as the retainer sleeve moves axially.

Abstract: An edge handling chuck which operates to maintain a semiconductor wafer at a desirable orientation while rotating the wafer at high speeds is disclosed. The edge handling chuck consists of a cylindrical plate which holds a silicon wafer using multiple spring loaded edge wafer clamps. Gas passes through a center hole in the cylindrical plate and is dispersed to the atmosphere using multiple pressure relief openings in the cylindrical plate. The purpose of this gas arrangement is to stabilize the wafer due to spinning vortex effects. The cylindrical plate has mounted therein an ertalyte ring which provides an area of angled contact for the wafer. The gas arrangement operates to pass gas to the slight space between the semiconductor wafer and the cylindrical plate, thereby contacting a lower surface of the wafer, and subsequently out of the arrangement using the pressure relief holes.

Abstract: A skate frame (20) for an in-line skate (18) having a shoe portion (22) and a plurality of longitudinally aligned wheels (24) capable of traversing a surface. The skate frame including an elongate carrier frame (70) having first and second sidewalls (52a and 52b) held in space parallel disposition by a first upper wall. The carrier frame having an open lower end spaced to receive the wheels therebetween. The skate frame also including an elongate outer shell (66) having first and second sidewalls and an open lower end. The sidewalls of the outer shell are spaced to receive the carrier frame therein, such that the sidewalls of the outer shell overlap at least a portion of the sidewalls of the carrier frame. A shear layer (68) is disposed between the carrier frame and the outer shell to absorb at least a portion of the vibrational energy transmitted from the surface to the shoe portion when the skate traverses the surface.

Abstract: Snowboard binding comprising a base (1) intended to be fixed to a snowboard and having side walls (2, 3) connected at the rear by a bow shaped structure (4), a curved support plate (5) articulated relative to the base between the side walls at two opposed points. This support plate (5) is articulated to an auxiliary support (6) secured to the base (1) either by being fixed directly to the base or by being fixed to the base via an intermediate component. The auxiliary support is preferably between the side walls (2, 3). Greater versatility in the mounting of the support plate on the base is achieved, and the mounting enables the fore-aft adjustments to be dissociated from the other adjustments.

Abstract: A flexible ski which is molded in one piece entirely of UHMW plastic. The adjustable flex ski is made up of a ski body which forms the majority of the invention and provides the base from which the other components are formed. This ski body is molded in a flat configuration. The front portion of this ski is given a pre-load function by bending the forward most portion of the ski body in an upward fashion. It is then held in this position by the use of pre-load bar which extends pivotally rearward from the tip of the ski to a ski saddle located on the upper center surface of the ski body. This saddle provides various attachment points for the pre-load bar and can thus, vary the amount of pre-load on ski. The saddle is also supplied with an attachment point for mounting the ski on the vehicle. This configuration allows the tip of the adjustable flex ski to flex in an upwardly fashion when confronting obstacles which provides the operator with a greater degree of control in rough terrain.