Abstract: The semiconductor package according to the present invention includes an insulating substrate, a reinforcing plate formed in an annular form in the periphery on the surface of the insulating substrate, a semiconductor chip installed face down on the insulating substrate, a reinforcing plate, and a heat radiating plate formed over the semiconductor chip, wherein the height of the back face of the semiconductor chip as measured from the surface of the insulating substrate is larger than the height of the surface of the reinforcing plate, which is brought into contact with the radiating plate, as measured from the surface of the insulating substrate.

Abstract: There is provided a means for selectively coating a coating liquid on a desired coating position when the coating liquid for forming an EL layer is coated. When the coating liquid is coated, a mask is provided between a coating liquid chamber and a substrate, and a voltage is applied to the mask, so that the coating liquid can be selectively coated on the desired coating position.

Abstract: A semiconductor device includes multiple dies, in which a first die and a second die are mounted on a leadframe. The bond pads on the first and second dies are wirebonded to the leadframe. The first die, second die, and leadframe are encapsulated in a package.

Abstract: A semiconductor chip includes a main surface having a plurality of sides, a plurality of signal electrodes formed on the main surface along the sides, the signal electrodes along one of the sides being disposed in a first area having a first length. The chip further includes a power supply electrode formed on the main surface along the sides, the power supply electrode along the one of the sides being disposed in a second area having the second length, which is longer than the first length, between the one of sides and the signal electrodes.

Abstract: Formed on the semiconductor chip surface are electrode pads, on which electroless Ni plated bumps are formed. The electroless Ni plated bumps are arranged in at least two rows in parallel with the two sides of the semiconductor chip, opposing each other. Each electroless Ni bump is 5 &mgr;m or more in height and the surface is coated with Au plating as a metal film. The surface of the conductor leads is coated with Sn plating. The conductor leads and bumps are heated and pressed by a bonding tool to crate Au/Sn eutectic alloy junctions.

Abstract: A method of forming high definition elements for electrical and electronic devices, substrates, and other components from or including viscous material. The method includes inverting the electrical components after the viscous material is applied and maintaining the inverted orientation until the viscous material dries or cures enough to maintain definition of its perimeter and edge characteristics.

Abstract: A flip chip having solder bumps, an integrated underfill, and a separate flux coating, as well as methods for making such a device, is described. The device is characterized in that the underfill material is provided on the chip surface prior to the application of solder bumps, and then treated to form apertures therein which act as a mask for solder bump application. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes which heretofore have required a separate underfilling step.

Abstract: A semiconductor device with high reliability is provided in which an insulating property of an insulating layer is high and connection failure is prevented.

Abstract: A semiconductor device having metal interconnects provides for a reduction of the recessing of metal in vias, particularly when the metal in the vias is aluminum or an aluminum alloy. The device includes a via in a device layer of the semiconductor device, a barrier layer formed over the device layer, and a metal layer formed over the barrier layer. The metal layer also fills the via to form a via structure. A portion of the metal layer is then removed and a remaining portion of the metal layer forms a conductive structure having a sidewall extending from a surface of the barrier layer. A spacer is formed along the sidewall of the conductive structure and a portion of the barrier layer is removed using the spacer to protect the via structure adjacent the surface of the device layer. In particular, the spacer protects a portion of the via structure that does not overlap with the conductive structure.

Abstract: A semiconductor device includes a transistor element having a gate electrode, a source•drain region and a channel region, a first interlayer insulator formed on the transistor element, a second interlayer insulator formed on the first interlayer insulator, an interconnecting line formed on the second interlayer insulator, a conductive material filling layer formed by burying a conductive material in a first hole which is formed in the first interlayer insulator on the source•drain region, and a contact plug formed in a second hole which is formed in the second interlayer insulator. This semiconductor device has a low sheet resistance, can perform high-speed operation and increase the degree of integration, has high reliability, and does not largely increase the number of fabrication steps. A method of fabricating the semiconductor device is also provided.

Abstract: An electrical wiring structure capable of improving a wiring delay to thereby achieve both low power consumption and high-speed performances without accompanying any significant changes in circuit layout and wiring structure of prior known CMOS logic circuitry and also alterations of the multilayer configuration of wiring layers is provided.

Abstract: The present invention discloses a method for forming a bit line of a semiconductor device which can easily perform a contact process of the semiconductor device, by forming parallel rows of I-shaped active regions, a plug poly and a ladder-type bit line. The spacing between adjacent active regions is maintained at the minimum line width. Two word lines of minimum line width and separated by the minimum line width are formed on the active region. The word lines are perpendicular to the active regions. A plug poly is formed on the active region between the word lines. A bit line contact plug is formed over the plug poly and a device isolation region. A bit line of minimum line width contacts the bit line contact plug and aligned generally parallel to the word lines is formed in a ladder-type configuration. That is, one side the lower portion of the contact plug contacts the plug poly, and the upper portion of the other side of the contact plug contacts the bit line.

Abstract: In an electronic component including: a sintered body with an internal electrode embedded; and an external electrode formed on the outer surface of this sintered body that is connected to the above internal electrode, a porous external electrode having numbers of pores is formed in the sintered body and thereafter the resin is impregnated through the pores. Thereby the pores of the external electrode are impregnated with a substance of the same sort as that of the buffer material as well as the buffer material interposes between the sintered body and the internal electrode.

Abstract: The invention relates to a semiconductor element which comprises a metal layer with gold and germanium. A thin covering layer of germanium oxide lies on the metal layer, protecting the subjacent metal layer from undesirable oxidation of the germanium. The invention also relates to a method of manufacturing such a semiconductor element.

Abstract: A method of fabricating a semiconductor device is provided, which decreases the parasitic wiring capacitance among adjoining Cu-based wiring lines is provided and which prevents the oxidation of Cu-based wiring lines and the diffusion of the Cu atoms existing in the wiring lines.

Abstract: A semiconductor device and a method for manufacturing the same that forms a self-aligned contact hole between two gate lines. A substrate is provided that has a first gate line formed thereon. An insulator is formed on the first gate line and substrate. Then a portion of the insulator and a portion of the first gate line is selectively removed to split the first gate line into a second gate line and a third gate line and to concurrently expose the substrate. Thus, producing a self-aligned contact hole between the second and third gate lines.

Abstract: A typical integrated-circuit fabrication requires interconnecting millions of microscopic transistors and resistors with aluminum wires. Yet, aluminum wires have greater electrical resistance and are less reliable than copper wires. Unfortunately, current techniques for making copper wires are time-consuming and inefficient. Accordingly, the invention provides a method of making wires or interconnects from copper or other metals. One embodiment entails forming a first diffusion barrier inside a trench using ionized-magnetron sputtering for better conformal coating of the trench, and a second diffusion barrier outside the trench using jet-vapor deposition. The jet-vapor deposition has an acute angle of incidence which prevents deposition within the trench and thus eliminates conventional etching steps that would otherwise be required to leave the trench free of this material. After formation of the two diffusion barriers, the trench is filled with metal and annealed.

Abstract: An insulating sheet which connects a semiconductor chip and a wiring substrate is provided between the semiconductor chip and the wiring substrate. The insulating sheet has windows therethrough at positions corresponding to those of connection pads of the wiring substrate and has leads, one end of each of the leads being fixed on the sheet and the other end of each of the leads protruding from the opposite surface of the sheet through a window. Each of solder balls of the semiconductor chip is connected to the fixed one end of one of the leads, and each of the connection pads is connected to the other end of each of the leads to electrically connect the semiconductor chip and the wiring substrate.

Abstract: A semiconductor integrated circuit device in accordance with the present invention is provided with first electrode pads, a first insulation layer and a second insulation layer. The first electrode pad are formed on the circuit formation face side of an IC chip. The first insulation layer is placed on areas other than the upper portions of the first electrode pads. The second insulation layer, which is made from a photosensitive material, is formed on the first insulation layer with an opening section for allowing at least one portion of the first electrode, the wire and at least one portion of the second electrode to be exposed. Here, the wire and the second electrode are formed by filling the opening section of the second insulation layer with particles of a conductive material.

Abstract: This invention relates to a process for the production of composite wood products. This process comprises a) applying a binder composition to wood particles, and b) molding or compressing the wood particles treated with the binder to form a composite wood product. Suitable binder compositions comprise a polymethylene poly(phenyl isocyanate) and a solid resole resin.

Abstract: An apparatus is described for scattering particles, in particular particles admixed with at least one binder, such as, for example, fibers, chips or like particles containing ligno-cellulose and/or cellulose, to form a mat, in particular for manufacturing shaped articles, primarily in the form of boards. On the one hand, chipboards, fiberboards and chip/fiber combination boards can be manufactured in an economically favorable manner with the apparatus and method described. Furthermore, boards of variable width can be produced without a time-consuming conversion of the apparatus being necessary.

Abstract: Disclosed are polyester pellets made of a polyester which comprises dicarboxylic acid constituent units derived from dicarboxylic acids containing terephthalic acid and isophthalic acid and diol constituent units derived from diols containing ethylene glycol and 1,3-bis(2-hydroxyethoxy)benzene, and which has the properties: constituent units derived from terephthalic acid are 15 to 99.5 % by mol and constituent units derived from isophthalic acid are 0.5 to 85 % by mol, both based on the total amount of dicarboxylic acid isophthalic acid constituent units (i); constituent units derived from ethylene glycol are 25 to 99.5 % by mol and constituent units derived from 1,3-bis(2-hydroxyethoxy)benzene are 0.5 to 75 % by mol, both based on the total amount of the diol constituent units (ii); the intrinsic viscosity is in the range of 0.5 to 1.5 dl/g; and the melting point (Tm (° C.)), as measured by a differential scanning calorimeter, satisfies the formula [1/527-0.

Abstract: An apparatus and method for molding and curing silicone includes a press, one nozzles operatively engaged to the press, a liquid cooled manifold plate disposed to cool the nozzles, a heatable top platen having nozzle receptacles therein to receive the nozzles therein and a mold plate having a mold cavity therein. The mold plate and top platen are oriented for placement in the injecting position to allow the top platen to contact the mold plate while the nozzles are inserted into the nozzle receptacles of the top platen so that silicone is injected into the mold plate and into the mold cavity. The apparatus may be placed in the curing position when the top platen is heated and contacts the mold plate to allow silicone injected in mold plate to cure. The apparatus may be placed in a home position where the mold plate is uncontacted by the heated top platen which is uncooled by the manifold plate in the home position.

Abstract: Methods of producing polyethylene films having a desired water vapor transmission rate (WVTR) are provided. The methods include casting a polyethylene sheet which has a base layer of a polyethylene and a cavitating agent, and at least one layer of a WVTR-controlling material, and subsequently biaxially orienting the sheet to yield a film having the desired WVTR. The base layer has a porous microstructure and a WVTR substantially higher than the desired WVTR.

Abstract: A waved disk for use in a friction engaging apparatus has toothed portions along an outer or inner edge thereof, and is bent or undulated in a direction of the plate thickness with the circumferential direction as the direction of a wave length. In manufacturing the waved disk, there is used a press with a stationary die and a movable die. The stationary die has a plurality of radially elongated pressing portions raised from the surface of the stationary die so as to correspond to highest portions of mountains of the wave. The movable die has a plurality of radially elongated pressing portions raised from the surface of the movable die so as to correspond to lowest portions of valleys of the wave. A disk blank made up of an annular flat plate having a toothed portion along an outer or inner edge thereof is pressed between the stationary and movable dies For being pressed in the direction of the plate thickness.

Abstract: The invention relates to a method and an apparatus for injection molding thermoplastic molded parts, having at least one cavity. The method comprises the following steps: a) injecting thermoplastic melt from an injection unit along a melt flow path into the cavity of an injection molding tool; b) injecting a fluid into the still liquid plastic material, so that the plastic material is pressed against the walls of the cavity; c) allowing the plastic material to cool until it forms the self-supporting molded part; and d) removing the molded part from the cavity of the injection molding tool.

Abstract: A device in connection with a rotor (9) for the treatment of a liquid such as molten metal in a reactor (20) or similar. Gas and/or particulate material is supplied to the liquid, preferably via the rotor shaft (8) and through openings (18) from a cavity (16) in the rotor. The rotor shaft (8) extends up through the base of the reactor (20) and is arranged so that it may rotate inside a stator pipe (3) which extends up from the base of the reactor. The rotor shaft and the stator pipe extend through an opening (21) in the lower side of the rotor (9) and into the cavity (16) in the rotor. Expediently, the rotor shaft (8) is connected to the rotor (9) via a fixing device (13) inside the rotor cavity, while the stator pipe (3) ends in the cavity (16).

Abstract: A motor mounting structure having a motor and a mounting portion to which the motor is mounted. When an external force resulting from a load acting in a direction orthogonal to a motor shaft is applied to the shaft, a hardness or configuration of an elastic member disposed between the motor and the mounting portion to which the motor is mounted changes. Alternatively, a configuration of the mounting portion may be changed and the motor mounted such that the motor shaft is parallel to a set target mounting direction. Accordingly, an unbalanced load is not partially applied to a driving force transmission mechanism at the time the motor is rotated, and an excessive load is not placed on the motor.

Abstract: A fluid-filled cylindrical elastic mount having an inner sleeve and an outer sleeve, and an elastic body interposed therebetween. The elastic mount also has a intermediate sleeve having a plurality of windows through which a plurality of pockets formed at respective circumferential positions of the elastic body are open in the outer circumferential surface of the intermediate sleeve, respectively. The plurality of windows are fluid-tightly closed by the outer sleeve, thereby defining a plurality of fluid chambers filled with a non-compressible fluid. The elastic mount further includes an orifice member for defining an orifice passage for fluid communication between the plurality of fluid chambers.

Abstract: An element forming a suspension joint and torsion spring, characterized in that it comprises an outer tubular sub-frame, an inner tubular sub-frame and an intermediate connecting sleeve made from an elastomer material which is joined without any possible slippage of the outer and inner sub-frames; said elastomer sleeve comprises at least two cell structures extending along the circumference thereof, whereby the radial rigidity of the joint is reduced in a significant manner in at least a number of directions without significantly reducing the torsional rigidity thereof.

Abstract: An automatic document feeder (ADF) used in a facsimile machine, photocopier or the like. A sheet path from a sheet inlet to outlet is defined by lower, intermediate and upper frames of the ADF. The sheet path is generally shaped like “C” when viewed laterally. The intermediate frame has a pivotable member that can be opened and closed, and a guide member for guiding a sheet passing over a platen glass. An elastic member is provided for biasing the guide member on the platen surface from a turning portion of the C-shaped sheet path. Therefore, it is possible to maintain a clearance between the platen surface and guide member and prevent the sheet from flapping. A retard roller is removably supported by the pivotable member so that replacing and maintenance of the retard roller is simplified. Further, the pivotable member is a one-piece element and made from resin.

Abstract: The present invention relates to a sheet material conveying apparatus comprising first conveying means for conveying a sheet, material second conveying means for conveying, on a downstream side in a sheet material conveyance direction of the first conveying means, the sheet material and a plurality of guide members for forming a curving conveyance route located between the first conveying means and the second conveying means. The guide member forms the curving conveyance route located on an inner side among the guide members is a rotary body rotatably, which is arranged with no pressing member for pressing the sheet material to the rotary body.

Abstract: An object of the paper sheet feed mechanism of the present invention is to provide a paper sheet feed mechanism in which delivery of paper sheets is stable. The paper sheet feed mechanism comprises a feed roller conveying paper money to the right direction of the drawing, a spring pressing the feed roller against the paper money, a sensor detecting the press force that the paper money receives by being pressed by the feed roller, a push-up board pushing up the paper money, and a control section regulating the height of the push-up board based on the detection result by the sensor, and also comprises a pick roller conveying the paper sheet at a conveyance speed faster than a conveyance speed by the feed roller.

Abstract: A paper feeder is able to properly separate and convey the uppermost sheet of paper from sheets stacked beneath it in a paper bin while effectively preventing multiple paper sheet feeds and other paper feed problems. The paper feeder includes a paper separator for lifting upper sheets, and separating the uppermost sheet from the sheet immediately beneath it by blowing air against an upper-forward end of a stack of paper loaded in a paper bin, and a vacuum paper carrier for holding the uppermost sheet by suction and carrying it. The paper separator has lifting nozzles for lifting side ends of the upper sheets, by blowing air toward side portions, excluding a central portion, of the stack of paper loaded in the paper bin.

Abstract: A sheet discharging apparatus including a sheet discharging device which discharges a sheet on a sheet discharging tray. A sheet tip portion guide device holds thereupon a tip portion of the sheet discharged from the sheet discharging device, guides the sheet in a sheet discharging direction while holding the tip portion of the sheet thereupon, and releases the sheet by releasing the tip portion of the sheet held thereupon.

Abstract: A method of aligning sheets prior to transferring them to a sheet-processing machine includes feeding a respective sheet, by a first sheet edge thereof, against a stop; gripping the sheet by at least one sheet holder, and displacing the sheet holder at least approximately transversely to the stop in a direction towards a first control region; and onwardly moving the sheet holder, while the sheet is held thereby, over a given first distance, after a second sheet edge has reached the first control region; and a device for performing the method.

Abstract: A perfected game is formed by a quadrilateral prismatic receptacle that has on one of its smaller sides an upper end projection and a cut-out in the central part of that face. One of the prismatic pieces positioned inside the receptacle, is removed through the cut-out more specifically the largest size piece located in the farthest area facing the cut-out. The receptacle has a continuous interior recess around its perimeter to which is slidingly coupled a flat cover that has at one end a prismatic projection that closes the cut-out.

Abstract: A seal assembly (22) for sealing a pressurized gaseous product includes, a pair of seals (24,26) spaced axially to provide a chamber (28) therebetween, a gas seal (24) being disposed on the inboard side of the seal assembly (22) between the sealed gaseous product and the chamber (28), an inlet (38) opening to the side of the gas seal (24) exposed to the gaseous product, the inlet (38) being connected to a supply of clean gas, the chamber (38) defined between the seals (24,26) being connected to a reservoir (50), the reservoir (50) being connected back to inlet (38) via a pressure intensifier (70) and the reservoir (50) being connected to the supply of clean gas, so that additional clean gas may be supplied thereto, when pressure in the reservoir (50) falls below a predetermined minimum value.

Abstract: A cylinder head gasket comprises a plate, an annular groove formed to surround a combustion chamber opening formed in the plate, a metallic shim fitted into the annular groove, and a full bead located outward of the shim and projecting in the same direction as the shim. The shim is mounted on the plate by an intermittent welding.

Abstract: A hand power tool has a tool holder with a base body; a drive part; at least one locking body for connecting the base body of the tool holder with the drive part; a securing body which radially fixes the at least one locking body in an engaging position; an actuating element operative for unlocking the tool holder and guiding the securing body to a position which radially releases the locking body, the base body in a locking position surrounding at least a part of the drive part.

Abstract: In a cutting tool attaching and detaching apparatus of an ultrasonic vibration machining device, there are provided a collet attaching device and a collet removing device which can be separated from a shank and a collet.

Abstract: The invention is directed to a method of filling a pressurized medium chamber of a level control system which includes a pressurized medium store and a compressor. The pressurized medium chamber is filled from the pressurized medium store over a time span during which the pressurized medium difference between the pressurized medium store and the pressurized medium chamber exceeds a threshold value. When the pressurized medium difference between the pressurized medium store and the pressurized medium chamber reaches the threshold value, a further filling of the pressurized medium chamber is necessary and takes place by means of the compressor of the level control system.

Abstract: A scooter includes a handlebar having a lower portion slidably and pivotally secured to a board with a shaft. A rod is secured to the handlebar and biased to engage with either of two depressions of the board for securing the handlebar to the board at either an upright working position or a downward folding position. A lock device may selectively engage with the board and the handlebar to for lock the handlebar to the board at either the upright working position or the downward folding position, for preventing the handlebar from being folded relative to the board inadvertently.

Abstract: A vehicle axle has mounted thereto a vehicle component, such as a brake actuator, a radius rod or track bar tower or a suspension for mounting the axle to the vehicle frame through an axle wrapper band which uniformly compresses the axle to provide a substantial frictional force between the axle and the wrapper band of a magnitude to prevent any appreciable translation or rotational movement of the axle with respect to the wrapper band in normal service on a vehicle. The axle can be round or multi-sided and the wrapper band has a corresponding shape. The wrapper band can be formed in parts, for example, U-shaped or L-shaped halves, and compressed towards each other before joining the halves either by welding or by a mechanical attachment. Alternatively, the wrapper band can be unitary in nature, heated and press-fit onto the axle. The wrapper band applies compressive pressure uniformly to the axle along multiple angularly spaced axes and minimizes or eliminates the need for welding the components to the axle.

Abstract: An improved vehicle running board construction and method of making same comprising a hollow metal support pipe with an elongated mid-section step portion adapted in vehicle-mounted orientation to extend generally parallel to and adjacent a sill of a vehicle door that provides access to a passenger or freight compartment of the vehicle. An elongate mounting opening is formed in an upwardly facing exterior surface area of the pipe mid-section. A support plate has a plurality of transverse trusses arranged in spaced apart relation in a longitudinally extending row and straddling the opening side edges and resting thereon for support. A plurality of spacer webs are individually interposed between and joined to longitudinally adjacent pairs of the trusses and support at each of their longitudinally opposite ends, a resilient spring finger catch oriented to underlie an associated one of the pipe opening side edges.

Abstract: An apparatus comprising a snowboard boot and a binding interface including an interface feature that is adapted to releasably engage with a snowboard binding. The binding interface is movably mounted to the boot so that the boot can flex in a side-to-side direction through an angle relative to the binding interface to provide side-to-side flexibility. In one embodiment, the binding interface is mounted to the boot at a pair of laterally spaced attachment points with a pair of strapless fasteners. In another embodiment, the binding interface is mounted to at least one attachment point and a portion of the boot is flexible between the attachment point and a side. In other embodiments, at least a portion of the interface feature does not protrude below the bottom surface of the boot, and the interface feature does not protrude beyond the sides of the boot.

Abstract: An apparatus (12) for helping to protect an occupant of a vehicle (10) comprises an inflatable device (40) having a stored deflated position in which the inflatable device is located adjacent an instrument panel (14) in the vehicle. An inflator (70) provides inflation fluid for inflating the inflatable device (40). The inflatable device (40), when inflated, engages a lower extremity (18) of the occupant. An actuator (80) moves the inflatable device (40) rearwardly in the vehicle (10) to move a foot (20) associated with the lower extremity (18) of the occupant rearwardly in the vehicle.

Abstract: A retainer case (4) has a lower portion (4a) defining a gas diffusion chamber (5), and an upper portion (4c) cooperating with an intermediate portion (4b) to define an accommodation chamber (6), a diffuser member (15) separates the gas diffusion chamber (5) from the air bag accommodation chamber (6), with gas communication allowed therebetween through a gas inlet (16) of the diffuser member (15), an infaltor (11) is disposed in the gas diffusion chamber (5), an airbag (8) is accommodated in the accommodation chamber (6), having a retained part (8b) in a space (S1) between the intermediate portion (4b) and the diffuser member (15), and an inward projection (18) of the intermediate portion (4b) and an inward projection (17) of the diffuser member (15) constitute a gas invasion restricting structure (17+18) for restricting a gas invasion from the gas diffusion chamber (5) into the space (S1).

Abstract: A method for transferring a gas bag for a vehicle occupant restraint system into a mounting provided for the gas bag comprises the following steps: First, the gas bag is folded. Then, the gas bag is heated. Subsequently, the folded gas bag is pressed and simultaneously pressed. Finally, the gas bag is fastened in the mounting.

Abstract: The invention relates to a covering cap for a gas bag module of a vehicle occupant restraint device. The covering cap comprises at least one plastic layer and is provided at least in places with a heating means.