Patents Issued in June 12, 2003
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Publication number: 20030107126Abstract: A structure and method of manufacture for an improved multi-chip semiconductor package that reduces package resistance to a negligible level, and offers superior thermal performance. Housing of multiple dies is facilitated by providing electrically isolated lead frames that are separated from a common base carrier by a non-conductive layer of laminating material. A silicon die is attached inside a cavity formed in each lead frame. Direct connection of the active surface of the silicon die to the printed circuit board is then made by an array of solder bumps that is distributed across the surface of each die as well as the edges of the lead frame adjacent to each die.Type: ApplicationFiled: September 17, 2002Publication date: June 12, 2003Applicant: Fairchild Semiconductor CorporationInventor: Rajeev Joshi
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Publication number: 20030107127Abstract: To provide a semiconductor device that does not cause a defect at an intersection of wirings even when a surge voltage enters from a signal input terminal, an electro-optic device provided with the semiconductor device as a TFT array substrate, and an electronic instrument. In a TFT array substrate 10 of a liquid crystal device, a signal input terminal 670, and terminals 710, 720 are arranged along a substrate side 111, and a signal input line 67 extends from the signal input terminal 670 to a substrate side 112. Of constant potential lines that supply constant potentials to an electrostatic protection circuit 5 for the signal input line 67, a low potential line 72 does not at all intersect the signal input line 67, and a high potential line 71, though intersecting the signal input line 67, does not intersect a wiring portion 671 from the signal input terminal 670 to the electrostatic protection circuit 5.Type: ApplicationFiled: December 9, 2002Publication date: June 12, 2003Applicant: SEIKO EPSON CORPORATIONInventor: Ichiro Murai
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Publication number: 20030107128Abstract: Method for packaging a circuit including exposed components (2) placed on a printed circuit (1), the circuit comprising microwave components (3). At least the part of the circuit that contains microwave components (3) is covered with a layer of syntactic foam (7) comprising a matrix of epoxy resin or cyanate ester, filled with microballoons of glass or a ceramic material. Subsequently, the entire circuit is covered with a moisture-proof top layer (8).Type: ApplicationFiled: November 1, 2002Publication date: June 12, 2003Inventors: Jan Hendrik Mannak, Ivo Antoni Gerardus Maatman
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Publication number: 20030107129Abstract: A method for fabricating a resin-encapsulated semiconductor device includes the steps of consecutively forming a first interconnect pattern, a dielectric film and a second interconnect pattern on a metallic plate, mounting a semiconductor chip on the dielectric film, connecting chip electrodes of the semiconductor chip to the second interconnect pattern, encapsulating the semiconductor chip on the first dielectric film, removing the metallic plate selectively from the first interconnect pattern, and forming a plurality of metallic bumps on the exposed bottom surface of the first interconnect pattern.Type: ApplicationFiled: August 27, 2001Publication date: June 12, 2003Applicant: NEC CorporationInventors: Yoshihiro Ono, Takehiko Maeda
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Publication number: 20030107130Abstract: A power semiconductor package, comprising: a power MOSFET die having a bottom surface with a bottom electrode disposed for contacting a conductor on a support board, and having a top surface with a top electrode; a bump strap which bridges over the power MOSFET die, having mounting portions disposed respectively on opposite sides of the power MOSFET die and disposed for mounting on the support board, and a central portion which engages and is conductively connected to the top electrode of the power MOSFET die. The bottom electrode comprises at least one of a drain electrode and a gate electrode, and the top electrode comprises a source electrode. The bump strap extends upward from the mounting portions to define a respective pair of upper portions of the bump strap which are disposed above the power MOSFET die, the central portion of the bump strap being disposed lower than the upper portions so as to be adjacent to the top electrode of the power MOSFET die.Type: ApplicationFiled: December 10, 2002Publication date: June 12, 2003Applicant: International Rectifier CorporationInventors: Chuan Cheah, Bharat Shivkumar
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Publication number: 20030107131Abstract: A semiconductor device includes a semiconductor element having an electrode formation surface on which an electrode terminal and a re-wiring portion are formed. The re-wiring portion is electrically connected to the electrode terminal. An external terminal made of wire has a base end connected to the re-wiring portion and a distal end extending therefrom. An electrically insulating resin covers the electrode formation surface in such a manner that at least the distal end of the external terminal is exposed outside the insulating resin. During a fabricating process, the electrode formation surface is coated with an electrically insulating resin and then a part of the electrically insulating resin is removed from the distal end of the external connecting terminal to expose the same outside the insulating resin.Type: ApplicationFiled: October 29, 1999Publication date: June 12, 2003Applicant: Shinko Electric Industries Co. LtdInventors: MITSUTOSHI HIGASHI, HIDEAKI SAKAGUCHI, KAZUNARI IMAI, MASAHIRO KYOZUKA, MITSUHARU SHIMIZU
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Publication number: 20030107132Abstract: A metal bumping structure on the input/output connector of a substrate or wafer, which is a metal conductor composed of multiple metal layers overlap the connector pad, characterized in that the overlapped outer or upper metal layer is thinner than the inner or lower metal layer, and the outer or upper metal layer that form the pillar style whose conductivity, connectivity and corrosion resist are better than the inner or lower metal layer, such that the bumping connector has better conductivity, connectivity and not easy to be corroded. It combines the photoresist, exposure, development with the electroless plating method to form the patterns and shapes of the expected object; wherein, the photoresist is to limit the deposition direction of the electroless, plating. If no limit on the electroless plating, it will cause isotropic deposition, as to simultaneously strive upward and around increasing; thus the photoresist is to assist with the electroless plating to form expected patterns and shapes.Type: ApplicationFiled: October 31, 2001Publication date: June 12, 2003Applicants: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, WHA YU INDUSTRIAL CO., LTD.Inventors: Pang-Ming Chiang, Shyuan-Fang Chen, Jyh-Rong Lin, Shu-Chin Chou
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Publication number: 20030107133Abstract: A semiconductor device miniaturizing the plane sizes of memory cells and a peripheral circuit part for a logic circuit and reducing wiring resistance and ensuring the degree of freedom in layout of wires on an interlayer isolation film. The semiconductor device comprises an active region included in a transistor formed on a semiconductor substrate, a wire formed on the semiconductor substrate, an interlayer isolation film covering the active region and the wire and a plug wire having a shape overlapping with both of the wire and the active region in plane, and the plug wire electrically connects the wire and the active region with each other.Type: ApplicationFiled: August 8, 2002Publication date: June 12, 2003Applicant: Mitsubishi Denki Kabushiki KaishaInventor: Kazuo Tomita
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Publication number: 20030107134Abstract: A method of extracting the interconnection capacitance of a semiconductor integrated circuit is provided. An interconnection structure composed of a plurality of signal lines and dummy conductive patterns disposed between the signal lines is made into data. Data on interconnection structure primitives, which are made by changing portions of the dummy patterns into high-k dielectric materials is generated based on the interconnection structure data. Capacitance of the interconnection structure is then extracted by inputting data on the interconnection structure primitives to an RC extractor and operating the data. According to this method, extracting interconnection capacitance is easily applied to various types of RC extractors. Moreover, the time required to extract the interconnection capacitance is reduced.Type: ApplicationFiled: October 9, 2002Publication date: June 12, 2003Inventor: Keun-Ho Lee
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Publication number: 20030107135Abstract: A semiconductor device includes a semiconductor substrate having a main circuit part including a predetermined active element and the like on a silicon substrate, an interconnection transmitting to the active element an externally supplied input signal or transmitting an output signal to be supplied to any external unit, an opening for input/output of the externally supplied signal or the signal to be supplied to any external unit to and from the interconnection, an insulating protection film for protecting the interconnection and an underlying portion thereof, a conductive metal film arranged above the main circuit part, and an aluminum oxide film arranged to cover the conductive metal film. This structure can preclude the main circuit part from being discerned by visual observation, a visible light microscope and an IR microscope, and accordingly imitation, copy and altering of the main circuit part by other people can be prevented.Type: ApplicationFiled: December 19, 2002Publication date: June 12, 2003Applicant: Sharp Kabushiki KaishaInventor: Hironori Matsumoto
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Publication number: 20030107136Abstract: A chip structure comprises a substrate, a first built-up layer, a passivation layer and a second built-up layer. The substrate includes many electric devices placed on a surface of the substrate. The first built-up layer is located on the substrate. The first built-up layer is provided with a first dielectric body and a first interconnection scheme, wherein the first interconnection scheme interlaces inside the first dielectric body and is electrically connected to the electric devices. The first interconnection scheme is constructed from first metal layers and plugs, wherein the neighboring first metal layers are electrically connected through the plugs. The passivation layer is disposed on the first built-up layer and is provided with openings exposing the first interconnection scheme. The second built-up layer is formed on the passivation layer.Type: ApplicationFiled: January 6, 2003Publication date: June 12, 2003Inventors: Mou-Shiung Lin, Jin-Yuan Lee, Ching-Cheng Huang
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Publication number: 20030107137Abstract: A microelectronic mechanical structure (MEMS) comprising a semiconductor chip having an integrated circuit including a plurality of micromechanical components, and a plurality of conductive routing lines integral with the chip; the routing lines having contact terminals of oxide-free metal; and the terminals having a layer of barrier metal on the oxide-free metal and an outermost layer of noble metal, whereby damage-free testing of the circuit is possible using test probe needles.Type: ApplicationFiled: September 24, 2001Publication date: June 12, 2003Inventors: Roger J. Stierman, Seth Miller, Howard R. Test, Christo P. Bojkov, John P. Harris, Reynaldo M. Rincon, Scott W. Mitchell, Gonzalo Amador
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Publication number: 20030107138Abstract: Methods and structures for die packages are described. The die package includes an integrated circuit die connected to and elevated above a substrate. In an embodiment, wire bonds connects pads on the die to pads on the substrate. The substrate pads are closely adjacent the die due to the die support being positioned inwardly of the peripheral surface of the die. In an embodiment, the die support includes a paste that flows outwardly when connecting the die to the substrate. The outward paste flow extends from beneath the die support but does not extend outwardly of the die so as to not interfere or contact the substrate pads.Type: ApplicationFiled: April 8, 2002Publication date: June 12, 2003Applicant: Micron Technology, Inc.Inventors: Edmund Lua Koon Tian, Lim Thiam Chye
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Publication number: 20030107139Abstract: A scent-emitting system includes a plurality of cartridges containing scented fluids and seated within pockets formed in a system tray. A heating member is provided for heating the cartridges to encourage the formation of scented vapors and an actuation subassembly is provided for selectively actuating the scent cartridges to release the scented vapors. An internal fan generates an air flow for communicating the scented vapors through housing vent openings to an external environment.Type: ApplicationFiled: August 12, 2002Publication date: June 12, 2003Inventor: Gregory Drew Wohrle
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Publication number: 20030107140Abstract: A method of making a ceramic article includes the providing a member. The member includes a cellulose-based material. The cellulose-based material is carbonized to carbon. At least a portion of the member is covered with silica sand after carbonization. At least a portion of the carbon of said member, which has been carbonized, is converted to silicon carbide.Type: ApplicationFiled: December 10, 2001Publication date: June 12, 2003Applicant: TRW Inc.Inventor: Frank J. Savel
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Publication number: 20030107141Abstract: The invention relates to a method for the manufacture of well equipment with permanently mounted ladder steps, and wherein the method uses mould parts for forming a mould cavity, which mould parts comprise mould elements that will, following discharge of the cast well equipment, leave a number of mounting apertures in the well equipment, which mounting apertures are located in such a manner that the anchoring parts of the ladder steps can be driven thereinto. The invention also relates to an apparatus for exercising the method, wherein the apparatus comprises a frame with a first arm on which a number of ladder-step grippers are configured, each of which being configured for receiving and securing at least one ladder step.Type: ApplicationFiled: October 21, 2002Publication date: June 12, 2003Inventor: S?oslash;ren Brorsbl
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Publication number: 20030107142Abstract: A system is proposed for encapsulating in plastics material leadframe items comprising an IC wired to a leadframe. Dust of the plastics material is removed from the encapsulation system, and in particular from those items where dust principally accumulates, such as the surfaces of the moulds. To reduce the level of dust which enters the moulding region, the path along which the leadframe items are conveyed to the moulding region is closed at times when the leadframe items are not being transported there. Additionally, the leadframe items are conveyed to the moulding region under a cover including a vacuum source, so that the dust is continually sucked away from them.Type: ApplicationFiled: December 11, 2001Publication date: June 12, 2003Applicant: ASM Technology Singapore Pte Ltd.Inventors: See Yap Ong, Kock Hien Wee, Shu Chuen Ho, Teng Hock Kuah, Jian Wu
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Publication number: 20030107143Abstract: A method for relieving pressure in a vulcanized tire while still in a tire press is disclosed, wherein the bladder securement mechanism utilizes a position sensor mechanism and eliminates the need for spacers and a floating piston. A tire press comprises a lower mold, an upper mold, and a bladder securement mechanism. The bladder securement mechanism has an upper clamping mechanism for securing the upper periphery of a bladder and a lower clamping mechanism for securing the lower periphery of the bladder. A center mechanism tube has a center mechanism rod positioned therein. A piston is disposed within the center mechanism tube. The piston provides reciprocating motion to the center mechanism rod. A position sensor mechanism operatively associated with the bladder securement mechanism.Type: ApplicationFiled: December 7, 2001Publication date: June 12, 2003Applicant: ROGERS INDUSTRIAL PRODUCTS, INC.Inventor: John R. Cole
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Publication number: 20030107144Abstract: The cabinetry of the present invention facilitates lower manufacturing costs, lighter products that are easier to maneuver and less costly to transport, and simpler product assembly by reducing the number parts to be assembled, while maintaining the structural integrity of the cabinetry. The PTV cabinetry of the present invention utilizes molded plastic foam parts formed from expanded polystyrene or phenolic foam. The foam parts are preferably functionally designed to replace the equivalent parts presently being made by wood fabrication or other molded plastic techniques. In a preferred embodiment, a PTV cabinet may be assembled from thee matching molded foam parts. The foam parts in accordance with the present invention may be uniquely located with respect to one another via locating features molded into the foam parts. Once assembled, an external cabinet or cosmetic fascia part may be placed over the foam parts.Type: ApplicationFiled: January 17, 2003Publication date: June 12, 2003Inventor: Jerry Bailey Lowe
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Publication number: 20030107145Abstract: Biodegradable molded articles; a process for producing the same: and compositions for foam molding packed in a packaging film bag to be used in the production. A bowl-type container(10a), which is one of the biodegradable molded articles as described above, consists of a bowl body(11a) comprising starch as the main component and a coating film(12) having at least hydrophobic properties and comprising a biodegradable plastic as the main component which is bonded to the surface of the bowl body(11a). This bowl body(11a) is formed by steam-foaming molding a material to be molded which is in the form of a slurry or a dough containing starch and water. The coating film(12) is closely bonded to the surface of the bowl body(11a) either directly or via an adhesive layer. Compositions for foam molding packed in such packaging film bags can be easily stored and molded.Type: ApplicationFiled: May 7, 2002Publication date: June 12, 2003Inventors: Akio Ozasa, Akihisa Hashimoto, Rumi Shinohara, Shinji Tanaka
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Publication number: 20030107146Abstract: A method of producing an optical element forming die to form an optical element by pressing a glass material softened with heat, including a first process of producing a primary processed product having a volume resistance value Z (0<Z≦1 (&OHgr;·cm) by sintering ceramic powders; and a second process of forming the optical element forming die by processing the primary processed product.Type: ApplicationFiled: November 21, 2002Publication date: June 12, 2003Applicant: KONICA CORPORATIONInventors: Shigeru Hosoe, Hiroshi Nagoya
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Publication number: 20030107147Abstract: A process and apparatus for manufacturing fuel cell plates are disclosed, the apparatus including a continuous press, a sifter, a leveler and rollers for removing air from resin impregnated graphite. An electrostatically charging device and a vibratory dispensing device may also be used. The sifted material is deposited on a heated lower press belt which is the belt having an embossing pattern. The material is leveled to a predetermined height and squeezed to remove air. An upper belt, also having an embossing pattern, contacts the material and heat and pressure are applied in a reaction zone for a predetermined time period. The process may also include the making of a tool integral with one or both belts for embossing the fuel cell plates. The finished product is a relatively low cost fuel cell plate.Type: ApplicationFiled: March 19, 2002Publication date: June 12, 2003Applicant: Avery Dennison CorporationInventors: W. Scott Thielman, Robert M. Pricone
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Publication number: 20030107148Abstract: Methods of randomly dispersing chopped carbon fiber and consolidating the materials together to make a fiber reinforcement mat are disclosed. The term “Z-mat” is used to describe the claimed random fiber mat in which the chopped fibers are not preferentially oriented in either the x or y direction in the in-plane directions of the mat. The stiffness in the Z-mat is substantially independent of the test direction in the plane of the mat. The Z-mat offers the distinct advantages of higher stiffness and lighter weight.Type: ApplicationFiled: July 26, 2002Publication date: June 12, 2003Inventors: Troy A. Davis, Peter A. Kiss, Michael S. Parsons, Greg Kramer
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Publication number: 20030107149Abstract: The invention relates to the film products and methods of their preparation that demonstrate a non-self-aggregating uniform heterogeneity. Desirably the films disintegrate in water and may be formed by a controlled drying process, or other process that maintains the required uniformity of the film.Type: ApplicationFiled: February 14, 2002Publication date: June 12, 2003Applicant: INTERNATIONAL FLUIDICS.Inventors: Robert K. Yang, Richard C. Fuisz, Gary L. Myers, Joseph M. Fuisz
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Publication number: 20030107150Abstract: In a method for producing hollow fiber membranes which comprises melt kneading a mixture comprising polyvinylidene fluoride and an organic liquid or a mixture comprising polyvinylidene fluoride, an organic liquid and an inorganic fine powder, extruding the kneaded mixture to form hollow fibers, and extracting the organic liquid or the organic liquid and the inorganic fine powder from the hollow fibers, which includes the steps of drawing the hollow fibers before or after termination of the extraction and then shrinking the fibers. According to this method, it is possible to stably produce hollow fiber membranes having dense pores and having a high water permeation performance, excellent endurance and stain resistance, and which are suitable for filtration uses such as removal of turbidity of water.Type: ApplicationFiled: November 6, 2002Publication date: June 12, 2003Inventors: Katsuhiko Hamanaka, Tetsuo Shimizu
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Publication number: 20030107151Abstract: An array of dies having a closed configuration is used in a method and apparatus for making a closed composite article that comprises multilayered materials. In the method and apparatus, at least two extruders are used to extrude at least two material streams through the die array to provide an extrudate comprised of alternate layers of material from the at least two material streams. The compositions in the two material streams can be the same or different.Type: ApplicationFiled: October 23, 2002Publication date: June 12, 2003Inventors: Patrick John Reilly, Dale Roy Norton
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Publication number: 20030107152Abstract: An apparatus for making crayons is disclosed. The apparatus includes a base that houses a heating component, a melt pan disposed to absorb heat from the heating component, a mold, and a cover. The melt pan receives crayon material and contains it as the heating component increases the temperature, causing the crayon material to liquefy. The liquefied crayon material can then be drained by the user of the device, into a mold with crayon-shaped cavities. A cover prevents access to the melt pan and the mold during particular operating conditions of the apparatus.Type: ApplicationFiled: December 7, 2001Publication date: June 12, 2003Applicant: Binney & Smith Inc.Inventor: David A. Cziraky
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Publication number: 20030107153Abstract: An assembly for manufacturing carriers (4) of information or decoration, characterised by a mould unit comprising two mould means which are joinable with each other. The mould unit comprises an injection moulding station (1) for injection moulding of said carriers (4), and a printing station (2) with a stamping unit (15) for applying to said carrier (4) a covering formed in accordance with the current information or decoration. The present invention also concerns a corresponding method.Type: ApplicationFiled: December 27, 2002Publication date: June 12, 2003Inventors: Hans Brewitz, Lars Persson, Thomas Svensson
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Publication number: 20030107154Abstract: Moulding apparatus is disclosed which comprises transfer element (12) which has a holding cavity (14) therein for receiving a charge of mouldable material. Mouldable material in particulate or molten form is fed into a heated passage (30) by a feed spiral (40) in a tube (36). A plunger (42) displaces molten mouldable material along the passage (30) and into the holding cavity (14). The transfer element (12) is then displaced to a position in which the holding cavity (14) is aligned with an opening (18) in a backing plate (16). The opening (18) is in communication with a mould cavity (20) having the shape of the article to be produced. A second plunger (46) displaces the charge of molten mouldable material from the holding cavity (14) through the opening (18) and into the mould cavity.Type: ApplicationFiled: July 30, 2002Publication date: June 12, 2003Inventor: Jan Petrus Human
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Publication number: 20030107155Abstract: Post-mold cooling of injection molded plastic articles such as preforms is achieved by transferring the articles directly from the mold cavities onto cooling cores carried by a take-out plate. The molded articles are supported on the cooling cores until they become sufficiently frozen that they can be stripped from the cores.Type: ApplicationFiled: October 24, 2002Publication date: June 12, 2003Applicant: Mold-Masters LimitedInventors: George Olaru, Robert Sicillia
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Publication number: 20030107156Abstract: An injection moulding apparatus for hollow parts comprises first and second co-operating dies, each die including a first male die core and a female die recess. One of the dies is rotatable about an axis. In a first angular position of the rotatable die, the male die core of the first die co-operates with the female die recess of the second die and the male die core of the second die co-operates with the female die recess of the first die, to define first and second moulds in which half-components may be formed. In a second angular position of the rotatable die, the respective female dies recesses of the first and second dies co-operate to form a third mould in which the half-components may be joined. The apparatus makes use of a single injector differentially controlled for each stage.Type: ApplicationFiled: November 5, 2002Publication date: June 12, 2003Inventor: David Rollins
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Publication number: 20030107157Abstract: This invention provides a method of applying a coating of a resinous material to a substrate to produce a molded device. The method involves installing a layer of the resinous material over a mold die and adding a molten substrate to melt the resinous layer and filling the mold. The mold is cooled and a molded device with a surface containing the resinous layer is formed.Type: ApplicationFiled: December 11, 2001Publication date: June 12, 2003Inventor: Harry Charles Buchanan
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Publication number: 20030107158Abstract: The present invention relates to novel polymeric compositions that exhibit Reverse Thermal Gelation (RTG) properties for use as Support Materials (SM) in the manufacture of three-dimensional objects. These polymers are Temperature Sensitive Polymers that respond with a significant change of properties to a small change in temperature. Temperature Sensitive Polymers exhibit cloud point (CP) or lower critical solution temperature (LCST) in aqueous solutions. Water-soluble Temperature Sensitive Polymers are chosen to give low viscosity liquid at low temperature when dissolved in water and by that to permit easy dispensing at low temperature. Raising the temperature above their gelation temperature (Tgel) will result in solidification of the composition. At its gel position the material has favorable characteristics as a support and building material. The gel layers have the appropriate toughness and dimensional stability to support the model layers during the building process.Type: ApplicationFiled: August 15, 2002Publication date: June 12, 2003Inventor: Avraham Levy
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Publication number: 20030107159Abstract: The present invention provides a method that allows ultra-precisely bonding by which a complete sealingly bonded molded article can be produced in a simple manner. This method includes (1) fixing an injection molded article (a) at a position (predetermined bonding position) formed with a mold; (2) mounting and moving a molded article (b) to be bonded to the injection molded article (a) to the predetermined bonding position within the mold; (3) positioning the molded article (b) at the predetermined bonding position; and (4) closing the mold for bonding.Type: ApplicationFiled: January 2, 2003Publication date: June 12, 2003Inventors: Minoru Adachi, Shoji Uesugi
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Publication number: 20030107160Abstract: A torch cutter exhaust system has a torch and an exhaust shroud at least partially encircling a discharge tip of the torch and mounted to the torch for movement therewith. The shroud is a crescent-shaped enclosure having an intake port and an output port. A table is located beneath the torch to support a material while the material is being cut by the torch. A gantry, movably mounted to the table, supports the torch and exhaust shroud. A duct, mounted to the gantry, connects the exhaust shroud with a flexible exhaust hose located alongside the table. The output end of the hose connects to a vacuum source to create low pressure near the discharge tip of the torch. The input end of the exhaust hose moves in unison with the gantry. The exhaust hose is supported by a wheel assembly that moves in response to the motion of the gantry.Type: ApplicationFiled: December 6, 2001Publication date: June 12, 2003Inventors: Paul B. Bowlin, Bobby P. Bowlin
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Publication number: 20030107161Abstract: A spring suspension device is provided for rail vehicles which is arranged in the region of the wheels in the form of a primary spring suspension between the wheel axle and a frame and/or in the form of a secondary spring suspension between the frame and the vehicle box body, wherein the spring suspension device includes at least one main spring and at least one auxiliary spring device assigned to the main spring, and wherein the at least one main spring comprises a hydropneumatic spring arranged in series with the auxiliary spring device. The auxiliary spring device is, for example, realized in the form of a coil spring. In a spring suspension system for a rail vehicle in which several such spring suspension devices are used, two or more hydraulic units of the hydropneumatic springs may be connected to a common gas reservoir by means of a synchronization unit.Type: ApplicationFiled: December 11, 2002Publication date: June 12, 2003Inventors: Martin Teichmann, Gerhard Kaserer, Herwig Waltensdorfer
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Publication number: 20030107162Abstract: A damper for isolation of vibration includes: three ball bearings; a bearing support member having a sloping top side portion adapted to gently maintain the three ball bearings in spaced position when rollingly carried thereon; 5 and, an equipment support member having a sloping bottom side portion seated on, and carried by a top side portion of the three ball bearings. When vibration moves the roller support member, the ball bearings roll and the equipment support member carried thereon remains relatively stable. 10 The damper may be carried on a suspended carriage having: an upright tube having an open top portion and three spaced openings therearound; band suspension means positioned above the spaced openings; an inner suspended member having three outwardly projecting legs positioned to project through the openings in the upright tube; and, three bands each interconnecting the band suspension means and the projecting legs thereby suspending the carriage within the tube.Type: ApplicationFiled: December 11, 2001Publication date: June 12, 2003Inventor: Paul B. Van Siyke
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Publication number: 20030107163Abstract: A vibration isolating bushing including: an elastic body disposed in between and elastically connecting an inner sleeve and an outer sleeve surrounding the inner sleeve. The elastic body has two pairs of axial bores diametrically opposed to each other and axially extends therethrough between the inner and outer sleeves to be independent of each other, and is circumferentially divided in terms of stress transmission by the two pairs of axial bores into two pairs of segments diametrically opposed to each other. Two diametric lines, extending in directions in which the two pairs of axial bores are respectively opposed to each other, intersect obliquely so that the two pairs of segments are made different from each other in their circumferential lengths for differentiating spring characteristics of the bushing in two diametric directions in which said two pairs of segments are opposed to each other, respectively.Type: ApplicationFiled: December 5, 2002Publication date: June 12, 2003Inventors: Seiya Asano, Kazuhiko Kato
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Publication number: 20030107164Abstract: The present invention concerns a method for producing an image in the edge of a volume of paper sheets. The invention can be used for numerous stationary products, note pads, exercise books, and the like. In the present invention, the images are printed not on the edges but on the paper surface. The method comprises a series of steps: printing—realigning—guillotining. The invention also concerns the insertion of a segmented image, systematically in edges and added in the make-up of a volume, for use in a complex technological process.Type: ApplicationFiled: November 4, 2002Publication date: June 12, 2003Inventor: Cristian Todie
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Publication number: 20030107165Abstract: A friction wheel singler is proposed for singling sheet material, in particular bank notes, comprising sheet magazine 5 for receiving stack of sheets 1, singling cylinder 2 having one or more friction elements 4 for contacting and conveying sheet 1a to be singled out of the magazine, and retaining device 3 forming with singling cylinder 2 singling gap 7 through which sheets 1a to be singled out of the magazine are conveyed one by one, retaining device 3 having one or more friction areas 3a for contacting sheets 1a to be singled out of magazine 5.Type: ApplicationFiled: November 20, 2002Publication date: June 12, 2003Inventors: Frank Werner, Alois Wagner
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Publication number: 20030107166Abstract: A document recycler combines the function of a last-in/first-out (LIFO) recycler, a payout device, and a cashbox in one unit and facilitates manual replenishing of banknotes. Storage and extraction of the documents are controlled by coordinated motions between a drive roller, a diverter, and flaps. LIFO recycling allows the device to return the same documents as inserted in case of a transaction cancellation which eliminates the need for an intermediate escrow area.Type: ApplicationFiled: December 12, 2001Publication date: June 12, 2003Inventors: Evan J. Cost, Peter Bullard
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Publication number: 20030107167Abstract: A hollow gripper bar having a hexagonal profile which reduces the bending and torsional stresses applied thereto by the acceleration and deceleration of the bar in a die cutting machine. The gripper bar includes an upper wall, a spaced lower wall, a leading wall and a trailing wall extending between the upper and lower walls. The leading wall includes a front top portion extending transversely from the upper wall and a front bottom portion disposed at an acute angle with respect to the front top wall portion. The trailing wall is similar in design to the leading wall and includes a rear top portion extending transversely from the upper wall and a rear bottom portion disposed at an acute angle with respect to the rear top portion. Both the front top portion and rear top portion have a thickness that is greater than the thickness of the upper wall.Type: ApplicationFiled: December 6, 2001Publication date: June 12, 2003Inventor: Frank E. Oetlinger
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Publication number: 20030107168Abstract: In a method and a device for forming groups of sheets consisting of one or of a plurality of sheets, a predetermined number of sheets is first supplied to a first position in a collecting station so as to form a first group of sheets. As soon as the first group of sheets has been formed, it is moved from the first position to a second position in the collecting station, and then a predetermined number of sheets is moved to the first position in the collecting station so as to form a second group of sheets.Type: ApplicationFiled: October 17, 2002Publication date: June 12, 2003Inventor: Franz Schwab
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Publication number: 20030107169Abstract: A sheet conveying device having multiple directional outputs with multiple registration options having no fixed registration wall for sequencing single sheets or two approximately identical sheets arriving in a two-up configuration, includes a first, second, third, and fourth pairs of rolls. The first pair of rolls and the second pair of rolls rotate about a first shaft, which is rotated by a first servomotor. The third pair of rolls rotate about a second shaft, which is rotated by a second servomotor, wherein the shaft is oriented at an angle approximately 90° relative to the first shaft. The fourth pair of rolls rotate about a third shaft oriented at an angle approximately 90° relative to the first shaft and approximately parallel to the second shaft, and a third servomotor operably connected to the third shaft rotates the third shaft.Type: ApplicationFiled: December 6, 2001Publication date: June 12, 2003Applicant: Xerox CorporationInventor: Jason P. Rider
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Publication number: 20030107170Abstract: A device for feeding suction air or blowing air to a sheet-retaining device displaceable relative to a machine element in a sheet-processing machine, includes a first air-feeding element connectible in terms of flow to a suction-air or blowing-air source. A second air-feeding element cooperates telescopically with the first air-feeding element for forming an air through-passage duct connected in terms of flow to the sheet-retaining device.Type: ApplicationFiled: December 10, 2002Publication date: June 12, 2003Inventor: Willi Becker
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Publication number: 20030107171Abstract: The program, in conjunction with physical modifications to the pinball game, was developed to modify the subject machine to accept US Dollars, with coin acceptance also being possible. A series of timed dollar bill validator or coin mechanism pulses transfers inserted money amounts to a microprocessor that stores the pulses in memory. The program accesses the memory and displays the pulses as “Paid Credits”, a new category. Pulses can be configured to any monetary pulse combination desired, with the most common configuration being $1.00 equal to 20 credits, with each credit having a value of $0.05. The programming, containing two (2) options for the machine operator, permits the owner of the machine to select either (a) the separation of credits that are won from credits that are paid for or (b) the combining the credits that are won along with credits that are paid for in jurisdiction in which the same is legally permissible.Type: ApplicationFiled: December 12, 2001Publication date: June 12, 2003Inventors: John Marshall Armstrong, John Garrett Armstrong
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Publication number: 20030107172Abstract: A dice game uses six dice. Each player makes a wager on the sum total of the six dice which would result from a single roll. A plurality of sum total groups are pre-established and a player makes a wager on one more of the sum total groups that can be achieved from a single roll of the six dice.Type: ApplicationFiled: November 25, 2002Publication date: June 12, 2003Inventor: Ernest W. Moody
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Publication number: 20030107173Abstract: A system for using trading cards interactively through an electronic network, such as the Internet, combines uniquely identified trading cards with specially designed electronic services. Each trading card, which designates a game player, such as a sports talent, has associated therewith a unique identifier of alphanumeric characters. The game playing rights to a subset of these trading cards is sold to a plurality of card collectors, the game players designated by the cards of each subset forming a game playing “team” to be managed by the respective card collector. The collector registers selected ones of the cards from his/her subset of cards with a game service provider, thus placing the game players designated by the selected cards “in play”.Type: ApplicationFiled: November 20, 2001Publication date: June 12, 2003Inventors: James E. Satloff, Dustin N. Satloff
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Publication number: 20030107174Abstract: This invention is for an innovative multi-handed poker game where cards are arranged as a polygon, where each side has the same number of cards and each side has corner cards that are shared with adjacent hands. The player can exchange cards from one hand with cards in another hand to improve his odds of winning.Type: ApplicationFiled: December 11, 2001Publication date: June 12, 2003Inventor: David Allen Loewenstein
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Publication number: 20030107175Abstract: This invention is a multi-handed poker game where the cards are dealt in one or more diamond patterns. In one embodiment, each side of the diamond is a separate hand. In some embodiments, the cards can be exchanged from one hand to another. In another embodiment, there is no card exchange; the cards are dealt, the player decides which cards to hold and the non-held cards are replaced. In another embodiment, the diamond or diamonds (in multiple hands) have one card in each corner and the fifth card in the center of the diamond. In this version of the game, the diamonds can be linked and so that the corner cards are common to one or more adjacent hands.Type: ApplicationFiled: August 2, 2002Publication date: June 12, 2003Inventors: David Allen Loewenstein, Martin Joel Wolff