Abstract: A semiconductor device has: a semiconductor substrate; a number of semiconductor elements formed on the semiconductor substrate; a plurality of lower level wiring layers electrically connected to the semiconductor elements; a plurality of first insulating layers electrically separating the lower level wiring layers and having a first dielectric constant; a plurality of middle level wiring layers electrically connected to the lower level wiring layers; a plurality of second insulating layers electrically separating the middle level wiring layers and having a second dielectric constant larger than the first dielectric constant; a plurality of upper level wiring layers electrically connected to the middle level wiring layers; a plurality of third insulating layers electrically separating the upper level wiring layers and having a third dielectric constant larger than the second dielectric constant. A multilevel wiring structure is provided which has a high performance and a high reliability.

Abstract: The invention stably operates active elements, such as transistors, and enables the display device to have a wide screen and to be stably operated for a long period of time. The electro-optical device includes an electro-optical element interposed between a cathode and an anode and disposed on the substrate, active elements addressing the electro-optical device, and insulating layers including an insulating material interposed between at least one of the cathode and anode and substrate and having a dielectric constant smaller than a prescribed value.

Abstract: Provided is a semiconductor device comprising a first insulating film deposited over a semiconductor substrate, an interconnect opening portion formed in the first insulating film, an interconnect disposed in the interconnect opening portion, and a second insulating film formed over the first insulating film and the interconnect, said interconnect having a first conductor film, a second conductor film formed via the first conductor film by chemical vapor deposition or ALS and comprised of any one of titanium silicon nitride, tantalum silicon nitride, tantalum nitride and titanium nitride, a third conductor film formed via the first and second conductor films and comprised of a material having good adhesion with copper; and a fourth conductor film formed via the first, second and third conductor films and having copper as a main component.

Abstract: A method for forming for use within an integrated circuit a gap filling sandwich composite dielectric layer construction, and an integrated circuit having formed therein the gap filling sandwich composite dielectric layer construction. To practice the method, there is first provided a substrate having formed thereover a patterned layer. There is then formed upon the patterned layer a first conformal dielectric layer through a first plasma enhanced chemical vapor deposition (PECVD) method employing a first radio frequency power optimized primarily to limit plasma induced damage to the substrate and the patterned layer. The first radio frequency power is also optimized secondarily to limit moisture permeation through the first conformal dielectric layer. There is then formed upon the first conformal dielectric layer a gap filling dielectric layer.

Abstract: This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs, which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the contact pad materials to the spring tips upon repeated contacts without affecting the reliability of the miniaturized springs. In addition, the invention also presents a method to fabricate the springs that allow passage of relatively higher current without significantly degrading their lifetime.

Abstract: Embodiments of methods of fabricating protected contact plugs include forming an electrically insulating layer having a contact hole therein, on a semiconductor substrate and then forming an electrically conductive lower barrier layer that lines at least an upper portion of a sidewall of the contact hole. This lower barrier layer may comprise titanium nitride (TiN). A step is also performed to form an electrically conductive contact plug that extends in the contact hole, is electrically coupled to the lower barrier layer and protrudes above the electrically insulating layer. The contact plug may comprise tungsten (W). An electrically conductive upper barrier layer is then formed that extends on a protruded upper surface of the contact plug and on a surface of the lower barrier layer.

Abstract: A method for mounting a semiconductor device, which can decrease the occurrence rate of failures, a method for repairing a semiconductor device, which can easily repair defective solder joints, and a semiconductor device which makes those methods feasible.

Abstract: A QFN semiconductor package and a fabrication method thereof are proposed, wherein a lead frame having a plurality of leads is adopted, and each lead is formed at its inner end with a protruding portion. A wire bonding region and a bump attach region are respectively defined on opposite surfaces of the protruding portion, and staggered in position. This allows a force applied from a wire bonder to the wire bonding regions not to adversely affect solder bumps implanted on the bump attach regions, so that the solder bumps can be structurally assured without cracking. Moreover, the wire bonding regions spaced apart from the bump attach regions can be prevented from being contaminated by an etching solution used in solder bump implantation, so that wire bonding quality can be well maintained.

Abstract: The present invention discloses a heat dissipating flip-chip Ball Grid Array (BGA) (10). In one embodiment, the flip-chip BGA comprises a substrate (12), a die (14), a first set of solder balls (16) adapted to couple the die with the substrate, a thermal compound (20) adapted to couple to a backside of the die, a second set of solder balls (28) adapted to couple with the substrate, and a printed circuit board (22) comprising a heat dissipating metal (24), wherein the heat dissipating metal is adapted to couple with the thermal compound, and wherein the second set of solder balls is adapted to couple with the printed circuit board.

Abstract: A semiconductor device comprises a die pad having an opening, a semiconductor chip located in the opening and another semiconductor chip. The semiconductor chip has a terminal surface and a non-terminal surface positioned opposite to the terminal surface. The semiconductor chip has a non-terminal surface facing the non-terminal surface and the die pad and a terminal surface positioned opposite to the non-terminal surface. Thus provided is a semiconductor device having a high degree of freedom in design mounted with semiconductor chips in high density.

Abstract: A semiconductor package comprising a semiconductor wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and at least one cured silicone member covering at least a portion of the active surface, wherein at least a portion of each bond pad is not covered by the silicone member, the silicone member has a coefficient of linear thermal expansion of from 60 to 280 &mgr;m/m° C. between −40 and 150° C. and a modulus of from 1 to 300 MPa at 25° C., and the silicone member is prepared by the method of the invention.

Abstract: An integrated circuit packaging assembly for reducing the length of bond wires transmitting radio frequency signals is disclosed herein. The die is offset in the packaging to position a subset of its bond pads in close proximity to package bond pads to allow for shorter bond wires, which reduces the inductive reactance that is induced in longer wires by high frequency signals. The subset of the bond pads is used for RF transmissions, while the other bond pads are used for direct current and low frequency signals.

Abstract: A tape carrier package with a widow that is capable of confirming an alignment extent between the tape carrier package and a print wiring board in bonding the tape carrier package mounted with an integrated circuit on the liquid crystal panel and the print wiring board. In the package, the integrated circuit is mounted onto a base film. Input pads are connected to the integrated circuit and formed on the base film. Dummy pads are formed at the left and right side thereof not to be connected to the integrated circuit. Windows are provided by opening the base film adjacent to the dummy pads to expose at least two of said dummy pads.

Abstract: The electron device of the present invention has a carbon-based linear structural body including at least one conductive particle, a first electrode and a second electrode disposed at both end of the carbon-based liner structural body, so as to subject the carbon-based liner structural body including at least one conductive particle to connect between the first electrode and the second electrode. A process of manufacturing the electron device includes steps of: forming a carbon-based liner structural body including at least one conductive particle, using a catalyst of a first island and a second island selected from two or more of islands of the catalyst on a substrate; and forming a first electrode and a second electrode so as to connect the first electrode with the first island and one end of the carbon-based liner structural body, and the second electrode with the second island and the other end of the carbon-based liner structural body.

Abstract: A sound attenuating apparatus for mounting on a heat exchanging apparatus such as a cooling tower, this apparatus having an attenuator housing with vertically extending sides, a top cover and a bottom adapted for mounting on the tower. There is an annular air inlet in the bottom and an air outlet is formed in at least one of the sidewalls. Perforated interior walls are mounted in the housing and define an /airflow passageway that extends from the air inlet to the air outlet. These walls include a first annular wall section extending about and defining an outer circumferential portion of the airflow passageway and a second wall section with that is annular and extends about a substantially vertical central axis. The latter wall section defines an inner circumferential portion of the passageway. The second wall section extends generally upwardly and outwardly from the air inlet. Sound absorbing material is arranged behind the perforated walls.

Abstract: A bubble humidifier for adding humidity to supplied oxygen. The bubble humidifier comprising a humidifier base, for containing a quantity of liquid, and a cover for the humidifier base. The bubble humidifier has an oxygen inlet for supplying oxygen to the bubble humidifier and an moisturized oxygen outlet for connection to a moisturized oxygen supply conduit for supplying humidified oxygen to a patient, and the oxygen inlet being connected to a diffuser for diffusing the supplying oxygen within the bubble humidifier. The bubble humidifier has a pressure relieve device for relieving excess pressure generated within the bubble humidifier during operation thereof.

Abstract: Fabrication of a microstructure device includes assembling a mold component and a mold body to form a device mold for the microstructure device. The microstructure device is cast from the device mold, then the mold component is removed from the microstructure device. The microstructure device is then released from the mold body.

Abstract: A method of fitting a holding block to a semifinished ophthalmic lens blank (1) intended to have a predetermined prism, which method includes the following steps:

Abstract: A film sheet which has a polymer layer formed of a coating solution is drawn from a balk roll and transported toward a rubbing apparatus. Thereby, first and second blowers sequentially disposed respectively apply to the polymer layer an air of temperature 45±2° C. and humidity 50%-60%, and an air of temperature 25±1° C. and humidity 30%-35%. Thus, damages which occurred in transporting and rolling the film sheet are removed. Thereafter, a rubbing action is performed to the film sheet such that the polymer layer has alignment. Then a liquid crystal layer is formed on the polymer layer, to obtain an optical compensation film.

Abstract: A method and apparatus for manufacturing plastic opthomalic and intra-ocular lenses and molds. The apparatus comprises a master mold for creating disposable or re-usable molds that may be used at point of sale. The molds comprise a “moth-eye” anti-reflective surface. The anti-reflective surface may be an integral part of the lens. The anti-reflective surface can be incorporated into a hardened surface of the lens. An improved curing chamber comprising reflective inner surfaces and directionally vector-less light is used for curing lenses. A gasket-less or reduced number of gaskets molding system are provided that may be either re-useable or disposable. An improved method of providing photosensitive eyeglasses and coatings.

Abstract: A method of adjusting a forming die unit held by a die holding member, comprising steps of discharging a pressure transmitting medium from at least one of the forming die unit and the die holding member to the other one so as to apply a power in a direction that the forming die unit is spaced away from the die holding member; and displacing the forming die unit relatively to the die holding member.

Abstract: A method of manufacturing a powder, by which it is possible to adjust the strength of the obtained powder is provided. The manufacturing method of a powder involves a step of preparing a slurry containing agglomerated particles of a synthetic material which is produced by reacting a first material and a second material under agitation, and a step of drying the slurry to obtain a powder of the synthetic material. The method has a feature that the particle size of the agglomerated particles is adjusted by, in the step of preparing a slurry, controlling agitation power for agitating the slurry. In the step of preparing a slurry, it is preferable that the slurry is initially agitated at a first agitation power, and at the time when the viscosity of the slurry approaches its maximum value, or at the time when the pH value of the slurry reaches the vicinity of the isoelectric point of the synthetic material, the agitation power is lowered from the first agitation power to a second agitation power.

Abstract: The method includes the preparation of a preimpregnated product that undergoes a heat treatment between 70 and 1100 deg. C., is embedded with an inert substance that comprises a charge and a polymeric binder in a quantity greater than the volume of the voids of the single-layer yarn which is calculated by means of the formula [1], where mn is the mass of inert substance, dn is the density of the inert substance, a is the length of the preimpregnated product, b is the width of the preimpregnated product, h is the thickness of the preimpregnated product, mpr is the mass of the preimpregnated product, and dfib is the density of the fibre, and is heated between 160 deg. C. and 200 deg. C., a pressure of between 1 and 5 MPa being applied simultaneously.

Abstract: A method for manufacturing carbon-carbon composites includes steps of producing a mat using carbon fiber, carbon fabric, carbon sheet, or staple fiber; laminating at least three layers of mats; producing a preform using the laminated mats with a needle punching method; performing a first thermal treatment process on the produced preform at a predetermined temperature; densifying the first-thermal-treated preform; performing a second thermal treatment process on the densified preform; forming a predetermined shape out of the second-thermal-treated preform; and performing an oxidation resistant treatment process of the shaped preform. A brake disk manufactured by the above method has high compression and shear strength as well as low friction coefficient for use in civil aircraft requiring a low friction coefficient and high loads. A brake disk produced with a liquid impregnation method can bear thermal and mechanical loads at high temperatures.

Abstract: In an injection molding machine having upstream and downstream channels communicating with each other for delivering fluid material to one or more mold cavities, apparatus for controlling delivery of the melt material from the channels to the one or more mold cavities, each channel having an axis, the downstream channel having an axis intersecting a gate of a cavity of a mold, the upstream channel having an axis not intersecting the gate and being associated with an upstream actuator interconnected to an upstream melt flow controller disposed at a selected location within the upstream channel, the apparatus comprising a sensor for sensing a selected condition of the melt material at a position downstream of the upstream melt flow controller; an actuator controller interconnected to the upstream actuator, the actuator controller comprising a computer interconnected to a sensor for receiving a signal representative of the selected condition sensed by the sensor, the computer including an algorithm utilizing a v

Abstract: This invention provides for a method to control the pore size or bubble point of porous membranes made by phase inversion in a continuous manufacturing process by blending two or more solutions each capable of producing a porous membrane with different pore size or bubble point than the pore size or bubble point of the desired membrane, and blending these solutions by the method of this invention to produce the desired pore size or bubble point. This invention also provides for a method to monitor membrane pore size in a continuous process and adjust pore size during the continuous manufacturing process.

Abstract: The invention is extrusion equipment and a process. The extrusion equipment links two extruders (11, 15) together. The first extruder (11) is, desirably, a counter-rotating twin screw extruder. The first extruder (11) receives organic filler, preferably wood particles or fiber, having a variable moisture content. Moisture is withdrawn from the extruder barrel. A polymer is fed from a second extruder (15) into the barrel of the first extruder (11) after the polymer is heated, mixed, and melted in the second extruder (15). The second extruder (15) can be a single screw or twin screw extruder. The combined mixture of organic filler and polymer is further mixed alone or with optional additives. The mixture is vacuum vented to remove moisture and volatiles and then extruded through a die. Additional processing steps are optional depending upon the extruded product or profile being produced.

Abstract: The present invention provides a fastener strip having magnetically attractable particles which are not located across the entire volume of the strip, but rather are incorporated in a discrete, distinct area of the strip. The fastener strip has a base and many hook pieces which rise from a fastening surface of the base. One embodiment has a magnetically attractable body in a row which rises from the surface of the base and is located along a substantially center line of the fastener strip. The magnetically attractable particles are incorporated in the magnetically attractable body and a part of the base located below the magnetically attractable body, and the magnetically attractable particles are not dispersed across the whole area of the base. A method of manufacturing such a strip is also described here.

Abstract: An apparatus and a method for treating the surfaces and edges of a block to mimic the appearance of natural stone. The apparatus and method can treat up to four sides of a block, can be adjusted to provide varying degrees of surface and edge treatment, and useful in high volume block production equipment. Blocks are produced having a natural, weathered appearance without the damage, breakage, dust, or expense associated with conventional splitting and tumbling methods.

Abstract: A method for producing a thermoplastic sheet includes extruding a composition including a melt polycarbonate resin having a Fries content of about 10 ppm to about 2000 ppm. The composition enables the sheet to be extruded with excellent uniformity.

Abstract: A mold includes a body, a first movable member and a second movable member. The body defines a first cavity. The first movable member defines a second cavity. The first movable member reciprocates along a predetermined movement axis with respect to the mold. The second movable member is movable along the movement axis with respect to the first movable member in the body for selectively connecting and disconnecting the second cavity and the first cavity according to the movement of the second movable member. A first material is supplied to one of the first cavity and the second cavity with the first and second cavities disconnected from each other. Then a second material is supplied to the other one of the first and second cavities with the first and second cavities connected to each other.

Abstract: A method of molding a container by rotational molding in which molding material is introduced into a mold cavity, and the mold is rotated about at least one axis of rotation. Prior to introducing the molding material, a dividing member is located in the mold cavity to divide the mold cavity into at least two cavities. When the molding material is subsequently introduced and the mold rotated, molding material coats the member so that the member becomes an integral part of the container and provides first and second separated volumes within the container. In use, fluid contained in the first volume is maintained separate from fluid in the second volume.

Abstract: A hardener for an epoxy resin includes an accelerator having a tetraalkylphosphonium salt.

Abstract: The bottom mold portion for a transfer molding system is covered with a deformable material. During mold clamping, the deformable material contacts the bottom surface of the packaging substrate on which the integrated circuit die is mounted. Deformation of this relatively soft covering on the bottom mold portion accommodates thickness variations in the packaging substrate, as well as non-planarity of the adhesive layer between the integrated circuit die and packaging substrate in exposed active area integrated circuits.

Abstract: A mold manufacturing system includes a conveyer circuit upon which a multiple of molds transit a closed loop and repetitively pass through a central booth. The system is separated into Zones in which a particular mold operation is performed. Each of a multiple of applying operations are performed within the central booth which contains a common exhaust plenum. Application of exceedingly expensive environmental emission control devices is at least partially mitigated. Consolidation of multiple spray operations into a few spray Zones also advantageously simplifies the control of chemical and ambient variables which improves production efficiencies and reduces operator dependency.

Abstract: In an apparatus for manufacturing pressware containers from container blanks there is provided a plurality of inertial blank stop pins disposed so as to position a container blank prior to press forming. The stop pins are rotatable in order to absorb the kinetic energy of the container blanks as they are fed to the apparatus and eliminate blank bounce. In a further aspect of the invention there is provided a method of forming plates utilizing the improved apparatus including the inertial blank stop pins.

Abstract: Method and apparatus for cooling molded plastic pieces preferably includes a take out structure/step configured to hold the plurality of plastic parts oriented such that closed ends thereof are disposed toward an inside of the take out structure and open ends thereof are disposed toward an outside of the take out structure. A movement structure/step is configured to cause relative movement between the take out structure and at least one of a first cooling station and a second cooling station. The first cooling station includes a first cooling structure/step configured to provide a cooling fluid to an inside of the plurality of plastic parts through the open ends thereof. The second cooling station includes a second cooling structure/step configured to provide a cooling fluid to an inside of the plurality of plastic parts through the open ends thereof.

Abstract: A release agent composition for molding a polyurethane foam is disclosed. The agent is obtained by blending a cationic surfactant having an amino acid salt of alkyl amine, a predetermined substance having release characteristic and a film forming agent. Furthermore, it is preferable that a polyethylene glycol type non-ionic surfactant with an additional number of ethylene oxide in the range from 1 to 15 moles, preferably, in the range from 5 to 10 moles is used in combination.

Abstract: Post mold cooling apparatus and method having transverse movement preferably includes structure and/or steps for cooling a plurality of plastic articles molded on a row of mold cores. A post mold cooling device is provided having (i) a first row of cooling tubes configured to hold a first plurality of the molded plastic articles, and (ii) a second row of cooling tubes configured to hold a second plurality of the molded plastic articles. A cooling station is disposed adjacent the cooling device and is configured to provide a cooling fluid to an interior of both the first and second pluralities of molded articles inside the respective first and second rows of cooling tubes.

Abstract: A flat or curved photochromic laminate structure and a plastic photochromic lens blank can be produced in a simple and efficient manner from relatively low-cost polymeric sheet materials. These laminates can be used to provide goggles, face shields, windows, window coverings, skylights, and optical lenses having efficient, uniform and high quality photochromic properties. The use of a polyesterurethane as the binder for the photochromic material has been found to improve the performance of the photochromic material. There may be a desire to have a protective exterior layer (e.g., an abrasion resistant layer) in combination with the lens system, but that may be provided in various methods. In the case of using the laminate in a goggle application, the laminate may be hard coated on one or both outer surfaces with an abrasion resistant coating, antireflective coating, and/or an anti-fog hard coating.

Abstract: A method and apparatus for molding structural composite materials. The method applies positive pressure on a mold vent after filling the mold with resin to reduce the size of the voids by collapsing the voids.

Abstract: A valve cover suitable for attachment to an engine head is disclosed. The valve cover is molded from a plastic material to include at least one structure of a positive crankcase ventilation (PCV) system. Additionally, the design of the valve cover includes various advantages including, for example, structural integrity, ease of installation or the like.

Abstract: This invention provides a method of forming a three dimensional topographical support member for producing apertured films, to the three dimensional topographical support member formed by the method of the invention, and to the apertured film produced thereon. The topographical support member is formed by moving a laser beam across the surface of a workpiece while modulating the power of the laser beam, thereby sculpting the surface of the workpiece to form the three dimensional topographical support member.

Abstract: Disclosed is a hydraulic strut mounting assembly including a plurality of chambers formed within a strut mount, in which the chambers are communicated with each other and are filled with hydraulic fluid for supplying a hydraulic pressure, thereby reinforcing capability of a shock absorber and a coil spring and thus further improving a ride quality of a vehicle. The hydraulic strut mounting assembly comprises a strut mount coupled to a shock absorber, a decoupler provided across an interior space of the strut mount, an upper and lower chamber formed in the strut mount by the decoupler, an orifice communicating the upper chamber with the lower chamber, a fluid filled within the lower chamber, and a plunger for pressurizing the fluid in line with the shock absorber when a vibration is generated.

Abstract: Disclosed is a cylindrical mounting apparatus including: a cylindrical mount having an elastic body elastically connecting an inner and outer sleeve disposed in mutually spaced-apart relation; and a bracket independent of said cylindrical mount and having a pair of support plates opposed to each other with a spacing therebetween. The mount is interposed between the pair of support plates and fastened to the bracket by a mounting bolt extending through a bore of the inner sleeve across the support plates. Two positioning protrusions protrude from an inside surface of one support plate toward the other, and a mounting plate is disposed on one axial end of the inner sleeve extending diametrically. A recessed engaging portion of the mounting plate is brought into engagement with the positioning projections to place the mounting plate in a predetermined position about its center axis on the support plate.

Abstract: Disclosed is a fluid-filled vibration-damping device and a method of manufacturing the same, wherein an elastic body connecting a first and second mounting members partially defines a fluid-filled zone filled with non-compressible fluid, and a sealing part of the fluid-filled zone is formed by forcedly fitting an annular fixing projection formed on one of an inner circumferential surface of a first sealing member or an outer circumferential surface of a second mounting member into an annular fixing recess formed onto the other. Drain passages are formed at an interface between the annular fixing recess and projection to expose a floor of the annular fixing recess to an outside. Compressed air is blown into one of the drain passages so as to blow away or forcedly discharge the non-compressible fluid remained on the floor of the annular fixing recess to the outside through another drain passage.

Abstract: Described herein is equipment which can be used by an industrial robot for gripping workpieces or assemblies being processed or assembled and has a separable modular structure, with a definite and easily repeatable geometry.

Abstract: A foldable workbench comprises at least a foldable leg frame, two clamp assemblies, to angular control board, several angular regulators, several clamp boards and a flat workbench, in which two clamp assemblies are linked to the foldable leg frame. The adjusting holes of the angular control board are connected to one side of clamp assemblies. Several angular regulators are arranged at both ends of the clamp assemblies. In addition, several clamp boards are bolted on the angular regulators. The flat workbench is placed on the angle iron rake of the brace.

Abstract: A vise (10) having a control aperture (74) at an accessible end (54) of a screw rod (50) and extending along the rotational axis (52) thereof. The aperture (74) is sized and shaped to accept the anvil (72) of a drive mechanism (70) so that upon rotation of the anvil (72) along its torque axis (80), screw rod (50) rotates about its rotational axis (52). At least one of a pair of jaws (18, 20) is operatively associated with screw rod (50) to thereby vary the spacing (34) therebetween as screw rod (50) rotates under control of the anvil (72).

Abstract: The sheet stacking-aligning apparatus or the sheet processing apparatus includes a substantially horizontal stacking tray, a rear end aligning unit for aligning a rear end of a sheet bundle on the stacking tray, and a control unit for controlling an operation of the rear end aligning unit for aligning the sheet bundle when it is in an upstream position of the stacking tray, and the stacking tray is provided substantially horizontally. It is thus made possible to increase the stacking space, thereby increasing the number of stackable sheets and to achieve the alignment of the rear end of the sheet bundle with a simple configuration, thereby improving the stacking-aligning property of the sheet bundle on the stacking tray.