Abstract: An apparatus and method are provided for applying adhesive to an outer circumference of a section of tubing. The apparatus includes opposed grippers with concave adhesive transfer areas that can be moved into surrounding relationship with the tubing. Adhesive dispensing passages communicate with the adhesive transfer areas for delivering adhesive to the tubing. Counterbores are at opposed ends of the adhesive transfer areas and communicate with a vacuum source for removing excess adhesive.

Abstract: A device for the two-dimensional application of free-flowing adhesive to strip material, especially to furniture edge banding. An adhesive channel is contained in an applicator head and an applicator valve selectively blocks or releases the flow of adhesive in the adhesive channel. A slot nozzle communicates with the adhesive channel, which nozzle has a slot-shaped exit opening for dispensing adhesive onto the strip material. A guide device for guiding the strip material past the exit opening of the slot nozzle along a defined path is removably attached to the applicator head. The guide device includes a first guide element which comes in contact during operation with the surface of the strip material opposite the surface to be glued, and at least one additional guide element which comes in contact during operation with an edge of the strip material.

Abstract: Disclosed is a manufacturing apparatus for a plasma display panel (PDP) to form a fluorescent material film in the PDP, the apparatus comprising a lower table; a lower rail formed on the lower table; a panel mounting portion operated on the lower rail for mounting a panel detachably; an upper fixation plate installed above the lower table; and a plurality of fluorescent material ink spread units fixed to the upper fixation plate and having a plurality of nozzle holes corresponding to non-applied rows for forming fluorescent material on the fluorescent material film of the panel, wherein a sophisticated spread of the fluorescent material is performed more efficiently.

Abstract: An apparatus that includes a pumping plate having a skirt, where the skirt contains a number of holes and a wafer access slot, and where the number of holes are sized and positioned to provide uniform heating of a susceptor.

Abstract: Process for removing microwave energy absorbing material disposed on a substrate without thermally and/or mechanically damaging the substrate and with reduced production of volatile matter comprising the steps of directing microwave energy at the coating of sufficient power to damage the coating and removing the damaged coating from the substrate.

Abstract: In a procedure for cleaning floors by hand with the help of flat cleaning mops, mops provided with a certain quantity of cleaning solution are used. In this case, at least one mop is removed from a storage container (1), and saturated with solution before or during removal; the solution is applied onto the surface of the mop; the mops are stored as is after use in a holding container (2) up to their disposal for purposes of regeneration. A device for fitting and preparing a larger number of flat cleaning mops consists of a storage container, which has a removal opening (5) for removing mops, and is provided inside with a feeding device (11) for prior saturating the removed mops with cleaning solution.

Abstract: A method of improving the operation of a gas pipeline having at least some water therein including the steps of introducing into the interior of the pipeline a soluble soap pig that is dimensioned to move through the pipeline by gas flow, the composition of the soap pig being selected such that at least some soap is applied as a film to the interior wall as the soap pig moves through the pipeline and in which the soap pig slowly dissolves within the pipeline. The soap film preferably has anti-corrosive and/or antibacterial properties.

Abstract: A cleaning method for cleaning a developer container includes a step of blowing air through an opening formed in the developer container at a first flow rate; a step of sucking air through the opening at a second flow rate which is larger than the first flow rate; wherein while the blowing and suction steps are being simultaneously carried out, ambient air is permitted to enter the developer container through an ambient air inlet.

Abstract: A method of cleaning damaged layers and polymer residue on semiconductor devices includes mixing HF and ozone water in a vessel to form a solution of HF and ozone water, and dipping a semiconductor device in the vessel containing the solution of HF and ozone water. Preferably, ozone water is subsequently introduced into the vessel to replace the solution of HF and ozone water in the vessel.

Abstract: The invention relates to a flux salt composition for flux baths which is available for particularly simple regeneration and deferrizing. The deferrizing flux salt composition for flux baths, containing zinc chloride and alkali metal chloride, contains at least one or more alkalizing constituents and one or more constituents which, in aqueous solution, oxidize iron(II) to form iron(III).

Abstract: A multipurpose treatment composition for metal surfaces comprises phosphate ions, fluorometallate ions, water soluble polymers containing substituted aminomethylene moieties bonded to benzene rings which also have an oxygen atom bonded to another carbon atom in the same ring, and a distinct kind of film-forming polymer. The compositions are free from chromium and other heavy metals that cause serious pollution problems in some prior art treatment compositions.

Abstract: A grinding ball having a 55 to 65 Rockwell C hardened outer shell of tempered martensite is adapted for use in heavy duty grinding environments. The ball is stress relieved to stabilize the ball against break up and/or spalling.

Abstract: A pushing block for the CVT belt has a hyper-eutectoid structure overall and exhibiting a structure in which spheroidal cementite having an area percentage of 0.4% or more are dispersed in a matrix of a martensite.

Abstract: A method of manufacturing a wear resistant shoe (26) includes upsetting (46) one end portion (38) of cylindrical member to work harden that portion to a substantial depth, machining (48) the cylindrical member portion to finished dimensions and surface hardening (56) a face (28 or 34) of the machined cylindrical member portion. The cylindrical member may comprise rod stock of a diameter less than the greatest diameter of the finished shoe and be upset or swaged to axially reduce and radially increase the dimensions of the one end portion. A hollow region (30) is formed in an opposite rod stock end portion and the periphery (50) of the hollow region is crimped about a rounded end (18) of the piston (20). The cold work done during the swaging or forming process provides a foundation for hardened faces comprising balance (28) and auxiliary balance (34) lands, forms a crude shape of the shoe, and imparts work hardening and wear property improvements.

Abstract: A process for enhancing chemical stability and corrosion resistance is described for perforated current collectors made by continuous production processes for use in electrochemical cells, including storage batteries such as lead-acid batteries. The process relies on utilizing a strip processing method, selected from the group of reciprocating expansion, rotary expansion and punching, to perforate the solid metal strip to form a grid or mesh, as a deformation treatment. The perforation-deformation treatment is followed in rapid succession by a heat-treatment to obtain a recrystallized microstructure in the current collector and optionally by quenching to rapidly reduce the temperature to below approximately 80° C. The process yields an improved microstructure consisting of a high frequency of special low &Sgr; CSL grain boundaries (>50%), exhibiting significantly improved resistance to intergranular corrosion and cracking.

Abstract: Two components are bonded together in a bonding apparatus using a bonding medium of malleable metallic spheres and a curable adhesive. The two components are bonded by positioning the components in a facing-but-spaced-apart relation in the bonding apparatus with the spheres and the adhesive between the first component and the second component. The bonding apparatus forces the first component toward the second component with sufficient force to bond the spheres to the first component and to the second component, while monitoring at least one measured bonding reaction of the first component and the second component, and controlling the bonding apparatus responsive to the step of monitoring. The adhesive is thereafter cured, optionally with the bonding pressure released and the assembly removed from the bonding apparatus.

Abstract: A method for sealing a container comprising a cup and lid is disclosed. The cup has a lip with a raised sealing bead along its length. During sealing, the raised sealing bead compresses, thereby stretching the adhesive layer on the lower portion of the lid out of the way and forming a direct welded seal with the heat-resistant layer of the lid. The adhesive to either side of the sealing bead forms an adhesive seal between the lid and the remaining portion of the lip. This type of double seal is particularly effective in forming a durable, consistent seal when product is present on the lip of the container. The welded seal is also well suited to situations when the cup may be warped or the sealing bead is otherwise caused to be higher along some portion of its length than along other portions.

Abstract: An ultrasonic container sealing method of sealing a closure 12 to a container main body 11 with use of an ultrasonic horn 54 having a sealing action face 53 comprises applying pressure to a lap of an outer peripheral portion of the closure 12 and a flange 24 of the container main body 11 as lapped over each other by the sealing action face 53, and causing ultrasonic rotational vibration in a rotating direction about an axis parallel to the direction of application of the pressure to act on the sealing action face 53.

Abstract: A novel process for manufacturing fully vitrified flat extruded ceramic glazed, unglazed tiles and profiles includes the following steps: mixing of raw materials in predetermined ratios; wet milling in ball mills; mechanical filter pressing to get cakes; shredding of cake to obtain noodles like structure; using a de-airing pug mill machine to produce proper mixing by removing of air the body; drawing a column of clay body through a die for required shapes; drying in three layer horizontal drier and chamber drier; coloring in a appropriate glazing line; firing in a appropriate roller kiln; sorting line; packing and palletizing machine; and using a sawing and glueing machine for smaller size tiles to make patterns and for border tiles. The invention also includes a system for carrying out the invented process so as to achieve high quality fully vitrified ceramic tiles and profiles.

Abstract: A method and an apparatus of simple construction for manufacturing a pneumatic tire are provided. Belt wave and unevenness of belt gauge are restrained at a minimum, joining of joint parts is ensured, installation space can be smallest within the limit of necessity and equipment cost is low. In a method for manufacturing a pneumatic tire by charging a green tire having tire components assembled in a mold for vulcanization-molding and forming lug grooves on a tire tread surface, carved grooves are previously formed at positions on a surface of the green tire corresponding to the lug grooves extending in substantially the same direction as the lug grooves.

Abstract: A process for manufacturing, in one stage, a tire comprising a carcass reinforcement (1) which is radial in the sidewalls and oblique radially beneath a crown reinforcement (3), composed of at least two layers (31) and (32) of reinforcement elements (310) and (320) which are crossed from one layer to the next, wherein there is pre-shaped to a diameter D1 and by means of a sleeve of at least one shaping ply N, vulcanized and formed of reinforcement elements forming with the circumferential direction an angle &agr;1, laid on the building drum T of diameter D, at least the central part of a carcass reinforcement ply (1) formed of radial reinforcement elements (10) forming with the circumferential direction an angle ∓&bgr;1. There is laid on the central part at least one crown ply (31, 32) formed of reinforcement elements (310, 320) oriented relative to the circumferential direction at angles ±&ggr;1 (&mgr;&ggr;1), &ggr;1 being little different from &bgr;1.

Abstract: The present invention is generally directed to base webs that are creped after a bonding material has been applied to at least one side of the web according to a predetermined pattern. According to the present invention, the bonding material contains a creping adhesive mixed with composite particles. The composite particles generally have a median particle size of less than about 5 microns and a particle size distribution of less than about 10 microns.

Abstract: The present invention provides a laminating film which has a thin base material processable with a low energy and a protection layer capable of giving a high optical density and a high glossiness to a printed image by lamination, and to provide a process for lamination with the laminating film. The laminating film of the present invention comprises a base material, and an image protection layer formed on the base material and having at least an adhesion layer capable of adhering to an image surface, wherein the base material has a thickness ranging from 1.5 to 6.0 &mgr;m and has an arithmetic average roughness (Ra) of not more than 50 nm and a ten point height of roughness profile (Rz) ranging from 1200 nm to 2000 nm according to JIS B0601.

Abstract: A method of producing a semiconductor thin film is provided. While a semiconductor thin film formed on a substrate is supported on a curved surface of a support member having the curved surface, the support member is rotated, thereby peeling the semiconductor thin film away from the substrate. Also provided is a method of producing a semiconductor thin film having the step of peeling a semiconductor thin film formed on a substrate away from the substrate, wherein the peeling step is carried out after the substrate is secured on a substrate support member without an adhesive. According to these methods, it is possible to peel the semiconductor thin film away from the substrate without damage and to hold the substrate without contamination.

Abstract: A method and apparatus for improved cutting of an object is provided. The object can take the form of many different structures including thin formations that require cutting precision, support, and dimensional control. In accordance with one example embodiment of the present invention, the method of cutting a member uses a laser and begins with the step of providing a template removably adhered to the member. The laser then projects through the template, without intersecting with the template, to cut the member and manufacture the desired formation. The laser does not intersect with, and therefore does not cut, the template structure and cause excess laser cutting dust.

Abstract: It is an object of the present invention to provide a method for slicing a hard and brittle material having a crystal structure, such as a silicon ingot, and more particularly a hard and brittle material cutting method which solves the problem of worsening variance in thickness, nanotopography, and wafer warpage. The inventors perfected the present invention upon discovering that when retainer plates are bonded to or pressed against the ends of an ingot, and simultaneous slicing with a wire saw is performed along with the retainer plates, a portion of increasing variance in the warpage, nanotopography, and thickness will appear in the portions corresponding to the retainer plates, resulting in a decrease in variance in wafer warpage, nanotopography, and thickness at the ends of the targeted ingot.

Abstract: A process for transmission laser welding of a first plastic part and a second plastic part that can be at least partially received in the first plastic part is proposed. The second plastic part is introduced into the first plastic part, to which it is connected by means of an interference fit connection, whereby at least one contact zone between the second plastic part and the first plastic part is formed as a result of this interference fit. A laser beam is directed to impinge on the second plastic part, through the first plastic part, along the at least one contact zone to form a weld.

Abstract: A first substrate, a second substrate, an intermediate and a plurality of particles form a laminated structure. The first substrate has a first conjunction portion and a second conjunction portion, and the second substrate has a third conjunction portion and a fourth conjunction portion which are characterized by a first hardness. The intermediate is disposed between the first substrate and the second substrate. The particles provided with a second hardness greater than the first hardness are coated on the third conjunction portion to contact the first conjunction portion and coated on the fourth conjunction portion to contact the second conjunction portion. A height difference with reference to the base surface of the second substrate exists between the end surface of the third conjunction portion and the end surface of the fourth conjunction portion.

Abstract: A method for producing a composite structure having a three-dimensionally curved portion and a cylindrical portion, comprising the steps of: (a) placing an outer skin made of a composite prepreg on a forming die; (b) mounting a honeycomb core on a portion of the outer skin that forms the three-dimensionally curved portion; (c) superimposing an inner skin made of a composite prepreg thereon; (d) arranging a preformed frame member and a preformed stringer member each made of a composite prepreg on a portion of the inner skin that forms the cylindrical portion to prepare an assembly; and (e) forming the assembly by heating under a pressure. A composite structure of the present invention can be produced by the method.

Abstract: A method for manufacturing an absorbent article including: a topsheet formed from a nonwoven fabric; a backsheet; and a cushion layer disposed between the topsheet and the backsheet is achieved by applying heat to a cushion layer unwound from a material roll to restore the bulkiness of the tissue layer, blowing air into the cushion layer for rapid cooling after the application of heat to maintain the restored bulkiness of the cushion layer, and laminating the topsheet, cushion layer, and the backsheet onto each other.

Abstract: This invention is directed to a method for etching films on semiconductor substrates and cleaning etch chambers. The method includes an improved processing sequence and cleaning method where residue formed from processing a previous substrate are cleaned by the etching process used to remove an exposed layer of material from the present substrate. The process provides improved substrate throughput by combining the step to clean residue from a previous substrate with an etch step conducted on the present substrate. Applicants have found the method particularly useful in processing structures such as DRAM stacks, especially where the residue is formed by a trench etched in the previous silicon substrate and the exposed layer etched from the present substrate is silicon nitride.

Abstract: Two load lock chambers 130 and 132 are arranged between a first transfer chamber 122 and a second transfer chamber 133. Each of the load lock chambers is capable of accommodating a single wafer W. The first transfer chamber 122 is provided with a first transfer unit 124 having two substrate holders 124a, 124b each capable of holding a single object to be processed, in order to transport the wafer W among a load port site 120, the first load lock chamber 130, the second load lock chamber 132 and a positioning unit 150. The second transfer chamber 133 is provided with a second transfer unit 156 having two substrate holders 156a, 156b each capable of holding the single object to be processed, in order to transport the wafer between the first load lock chamber 130, the second load lock chamber 132 and respective vacuum processing chambers 158 to 164. Since the volume of each load lock chamber can be minimized, it is possible to perform the prompt control of atmospheres in the load lock chambers.

Abstract: A semiconductor processing apparatus and method are disclosed herein, including a plurality of process chambers, wherein at least one semiconductor processing operation occurs within each process chamber among the plurality of process chambers. Additionally, the apparatus and method disclosed herein include a robot mechanism for rotating each process chamber among the plurality of process chambers upon completion of an associated semiconductor processing operation. Such a robot mechanism may comprise a plurality of robots. Specifically, such a plurality of robots may include six robots configured on an associated carousel.

Abstract: Uncreped throughdried tissue sheets are mechanically treated by calendering and embossing to provide a unique combination of desirable properties to the resulting sheet, which exhibits more surface uniformity, improved softness, high bulk and absorbency.

Abstract: The invention provides a low density paperboard material and associated method for use in producing an insulated container, and is especially well-suited for making cups. The paperboard material comprises a paperboard web including wood fibers and expanded microspheres, and has a relatively low density ranging from about 6 to about 10 lb/3MSF/mil, a relatively high caliper ranging from about 24 to about 35 mil, and an internal bond strength of at least about 80×10−3 ft-lbf., preferably at least 100×10−3 lft-lbf. For applications such as cups the material is also coated on one or both sides with a barrier coating, preferably low density polyethylene, to limit liquid penetration into the web. The low density paperboard material of the invention is convertible for manufacture of containers, particularly cups, and exhibits insulative properties comparable to higher cost materials conventionally used to make cups.

Abstract: A method of sizing paper by applying a composition comprising an aqueous dispersion of polymeric particles of particle size up to 1 micron, preferably 80-200 nm, wherein the polymeric particles comprise a water insoluble polymer matrix, preferably formed from styrene and 2-ethylhexyl acrylate, characterized in that an oligomer formed from a monomer blend comprising, (a) (meth)acrylamide, and (b) organic mercaptan or an organic sulphone, preferably dodecyl mercaptan or dodecyl sulphone is located at the surface of the particles. Compositions where the oligomer further comprises an ethylenically unsaturated monomer comprising either a tertiary amine group or a quaternary ammonium group, preferably dimethylaminoethylmethacrylate are novel. Advantages of the composition when applied to the surface of paper, include improved water resistance, brightness and printability properties of the treated paper.

Abstract: A variable frequency foil (VFF) box assembly and mechanisms for moving individual foils/foil beams and individual foil beam sets relative to each other to adjust the frequency of a paper making machine, and method of use are provided. The VFF box assembly allows for continuously and uniformly adjusting the pitch distances of individual foils within foil sets over a finite range, and also adjusting the distance between foil sets during the continuous operation of a paper making machine. Also provided is a variable frequency assembly comprising a combination of dewatering elements such as one or more foil elements and table rolls, a multi-surfaced foil element, and/or an adjustable angle foil element.

Abstract: A distillation unit (10) employs a rotary heat exchanger (32) forming a multiplicity of evaporation chambers (56) into which a liquid to be purified is sprayed for evaporation. Spray arms (58) spray at a steady rate into all of the evaporation chambers (56) simultaneously but not at a rate that is adequate to maintain the wetting required for efficient transfer of heat to the liquid. A scanning sprayer (140) supplements this steady spray with spray from nozzles (142 and 144) into only a few of the evaporation chambers at a time, visiting all of them cyclically. The overall rate of spray from the two sources thus combined to spray the chamber cyclically maintains proper wetting even though on average it is lower than the rate that would be required of a constant-rate spray into all of the evaporation chambers.

Abstract: To generate an especially good heat transfer between a seating face of a storage plate support and a storage plate, during coating with a sputter source in a vacuum installation, the seating face of the storage plate support is slightly annularly convexly arched and the storage plate is clamped in the center as well as on its outer margin by a center mask and an outer mask against the arched seating face. Hereby an especially good heat transfer is attained with very low arching d, whereby the storage plate is treated gently and simultaneously, during the coating process, no layer thickness distribution problems occur through arching that is too large.

Abstract: A coated article, and a corresponding method of making the same are provided. The coated article includes a coating supported by a substrate, the coating including a thin metal or metal nitride contact layer (e.g., NiCr, Ni, Cr, CrNx or NiCrNx) located directly between and contacting an infrared (IR) reflecting layer (e.g., Ag) and an oxide barrier layer (e.g., NiCrOx).

Abstract: A method of depositing a film on a substrate. In one embodiment, the method includes depositing a first portion of the film using a high density plasma to partially fill a gap formed between adjacent features formed on the substrate. The film deposition process is then stopped before or shortly after the entry of the gap pinches off and the film is etched to widen entry to the gap using a two step etching process that includes a first physical etch step that forms a plasma from a sputtering agent introduced into the processing chamber and biases the plasma towards the substrate and a subsequent chemical etch step that forms a plasma from a reactive etchant gas introduced into the processing chamber. After the etching sequence is complete, a second portion of the film is deposited over the first portion using a high density plasma to further fill the gap.

Abstract: A method of forming a device, comprising the following steps. A wafer holder and inner walls of a chamber are coated with a seasoning layer The wafer is placed upon the wafer holder and is cleaned wherein a portion of the seasoning layer is re-deposited upon the wafer over and between adjacent wafer conductive structures. The wafer is removed from the chamber and at least two adjacent upper metal structures are formed over at least one portion of a metal barrier layer. The exposed portions of the metal barrier layer are etched and removed, exposing portions of the re-deposited seasoning layer portions using the metal barrier layer etch process which also removes any exposed portions of the re-deposited seasoning layer portions that are comprised of a material etchable in the metal barrier layer etch process.

Abstract: An apparatus which can control thickness uniformity during deposition of conductive material from an electrolyte onto a surface of a semiconductor substrate is provided. The apparatus has an anode which can be contacted by the electrolyte during deposition of the conductive material, a cathode assembly including a carrier adapted to carry the substrate for movement during deposition, and a conductive element permitting electrolyte flow therethrough. A mask lies over the conductive element and has openings permitting electrolyte flow. The openings define active regions of the conductive element by which a rate of conductive material deposition onto the surface can be varied. A power source can provide a potential between the anode and the cathode assembly so as to produce the deposition. A deposition process is also disclosed, and uniform electroetching of conductive material on the semiconductor substrate surface can additionally be performed.

Abstract: An apparatus and method for securing and electrically contacting a substrate on a non-production surface of the substrate. The apparatus includes a substrate holder assembly having a substrate engaging surface formed thereon, the substrate engaging surface being configured to engage a substrate on the non-production surface. The apparatus further includes an electrical contact device positioned on the substrate engaging surface, the electrical contact device including a plurality of radially spaced electrically conductive members configured to electrically communicate with the non-production surface of the substrate positioned on the substrate engaging surface. The method includes depositing a conductive seed layer on a production surface of the substrate, and depositing a backside conductive layer on a portion of the non-production side of the substrate, the backside conductive layer extending around a bevel of the substrate to electrically communicate with the seed layer.

Abstract: There is disclosed a method for cooper electrowinning and a modified lead electrode for use in such method. The modified electrode is suitable for use as an oxygen anode in low current density, oxygen-evolving applications.

Abstract: Disclosed are a method for manufacturing a half-metallic magnetic oxide and a plasma sputtering apparatus used in the method. A conductor provided with at least one hole is disposed between a metal target and a substrate holder in the plasma sputtering apparatus, thereby improving the bonding of metal ions discharged from the metal target to oxygen ions, and a magnetic field with a coercive force larger than that of a thin film to be formed on the substrate, thereby obtaining a magnetic oxide film with excellent properties. In a preferred embodiment of the present invention, a conductor-side power supply unit is connected to the conductor, thereby additionally supplying power to the conductor and generating second plasma. The plasma sputtering apparatus supplies high power so as to decompose oxygen, and discharges metal ions with different electrovalences at a precise ratio by the additional power supply, thereby being effectively used in manufacturing a half-metallic oxide at low temperatures.

Abstract: The use of an insulating shield for improving the current distribution in an electrochemical plating bath is disclosed. Numerical analysis is used to evaluate the influence of shield shape and position on plating uniformity. Simulation results are compared to experimental data for nickel deposition from a nickel—sulfamate bath. The shield is shown to improve the average current density at a plating surface.

Abstract: Methods for anodizing sintered valve metal anodes for use in wet electrolytic capacitors implemented in implantable medical devices (IMDs). The methods generally include immersing a pressed valve metal anode in an anodizing electrolyte and developing an anode-electrolyte system. Subsequently, subjecting the anode-electrolyte system to a potential that is ramped up to a target voltage in a pulsed fashion and delivering voltage potential pulses to the anode. The pulses are preferably decreased in pulse width as the potential increases. The pulse width of the applied pulses is preferably defined by means of a duty, such that the applied pulse duty cycle is substantially 100% initially and declines over the formation time as the formation voltage increases to the target potential to substantially 1.0% or less. The pulses are preferably applied for a hold time following achievement of the target formation potential, as the pulse current declines toward zero current flow.

Abstract: A method for surface treatment of a metal base includes the steps of: (a) anodizing the base to obtain a first layer of oxidation film on a surface of the base; (b) removing or covering a first area of the oxidation film; and (c) anodizing the base to obtain a second layer of oxidation film. A second area of the oxidation film is thus formed on the base which is different from the first area of the oxidation film. The second area is either higher or lower than the first area, therefore an anaglyphic decorative effect is obtained on the surface of the base.

Abstract: The present invention provides a method of producing a zinc oxide thin film in which a current is passed between a conductive substrate immersed in an aqueous solution containing at least zinc ions, ammonium ions and zinc ammonia complex ions, and an electrode as an anode immersed in the aqueous solution to form a zinc oxide thin film on the conductive substrate. This method stabilizes formation of the zinc oxide thin film and improves adhesion between the thin film and the substrate.