Abstract: A semiconductor device includes a heat generation element; a bonding member; first and second heat radiation plates disposed on first and second sides of the heat generation element through the bonding member; a heat radiation block disposed between the first heat radiation plate and the heat generation element through the bonding member; and a resin mold. The heat radiation block has a thickness in a range between 0.5 mm and 1.5 mm. The semiconductor device has high reliability of the bonding member.

Abstract: Provided is a flexible heat sink article comprising a base comprising a polymer and a plurality of polymeric protrusions extending away from the base, each protrusion having a major dimension and a minor dimension. The base comprises thermally conductive particles, and the protrusions comprise non-spherical thermally conductive particles substantially aligned in the direction of the major dimension within the protrusions. A thermal interface material may be provided contiguous with the base. Also provided is a flexible heat sink article comprising a base comprising a polymer and having a first surface and a second surface, a plurality of polymeric protrusions extending away from the first surface of the base, each protrusion having a major and a minor dimension, and a metallic layer contiguous with the second surface of the base, wherein the base and the protrusions comprise thermally conductive particles. Also provided is a method of making a flexible heat sink.

Abstract: A microelectronic assembly is provided, having thermoelectric elements formed on a die so as to pump heat away from the die when current flows through the thermoelectric elements. In one embodiment, the thermoelectric elements are integrated between conductive interconnection elements on an active side of the die. In another embodiment, the thermoelectric elements are on a backside of the die and electrically connected to a carrier substrate on a front side of the die. In a further embodiment, the thermoelectric elements are formed on a secondary substrate and transferred to the die.

Abstract: A miniaturized small memory card includes a substrate, at least one upper memory chip, at least the lower memory chip, one upper glue layer, and one lower glue layer, the substrate is formed with an upper surface and a lower surface, the upper surface is formed with a plurality of connected points, the lower surface is formed with a frame to cause a cavity, which formed a plurality of connected points, formed between the frame and the substrate, the frame is formed with a plurality of golden fingers, the golden fingers are electrically connected to an electric device, the upper memory chip, which is mounted on the upper surface of the substrate, electrically connected to the plurality of connected points of the upper surface, the lower memory chip, which is mounted on the cavity of the lower surface of the substrate, electrically connected to a plurality of connected points of the lower surface, the upper glue layer encapsulated the upper surface of the substrate, so that at least one upper memory chip will b

Abstract: Prepackaged chips, such a memory chips, are vertically stacked and bonded together with their terminals aligned. The exterior lead frames are removed including that portion which extends into the packaging. The bonding wires are now exposed on the collective lateral surface of the stack. In those areas where no bonding wire was connected to the lead frame, a bare insulative surface is left. A contact layer is disposed on top of the stack and vertical metalizations defined on the stack to connect the ends of the wires to the contact layer and hence to contact pads on the top surface of the contact layer. The vertical metalizations are arranged and configured to connect all commonly shared terminals of the chips, while the control and data input/output signals of each chip are separately connected to metalizations, which are disposed in part on the bare insulative surface.

Abstract: An apparatus and a method for active phase cancellation for an inductor/capacitor network have been disclosed. One embodiment of the apparatus includes a package and a die mounted on the package. The die comprises circuitry to to substantially cancel resonance between an inductance of the package and a capacitance of the die.

Abstract: A semiconductor optical radiation package includes a leadframe, at least one semiconductor optical radiation emitter, and an encapsulant. The leadframe has a heat extraction member, which supports the semiconductor optical emitter and provides one or more thermal paths for removing heat generated within the emitter to the ambient environment, as well as at least two electrical leads for providing electrical coupling to the semiconductor optical radiation emitter. The encapsulant covers and protects the emitter and optional wire bonds from damage and allows radiation to be emitted from the emitter into the ambient environment. The semiconductor optical radiation package provides high emitted flux and is preferably compatible with automated processing techniques.

Abstract: A die, comprising a substrate and one or more pillar structures formed over the substrate in a pattern and the method of forming the die.

Abstract: A method and apparatus for improved contact pad arrays and land patterns for integrated circuit packages are presented. A plurality of conductive pads are arranged in an array of rows and columns. At least one edge of a perimeter of the array is not fully populated with conductive pads. Spaces created in the edge by missing conductive pads create additional routing channels for signals from conductive pads within the array to be routed external to the array through the edge. A land pattern may have routing channels on one or more layers of a printed circuit board. In such a multi-layer land pattern, spaces can be created in edges on any number of the layers. Furthermore, corner pad arrangements having known routing channel characteristics can be used in any number of corners of a land pattern that incorporates spaces in an edge.

Abstract: An integrated circuit including one or several metallization levels, metal conductive strips and metal contact pads being formed on the last metallization level, the last level being covered with a passivation layer in which are formed openings above the contact pads. The thickness of the pads, at least at the level of their portions not covered by the passivation layer, is smaller than the thickness of said conductive strips.

Abstract: Semiconductor devices and methods of forming the semiconductor devices using an HTS (High Temperature Superconductor) layer in combination with a typical diffusion layer between the dielectric material and the copper (or other metal) conductive wiring. The HTS layer includes a superconductor material comprised of barium copper oxide and a rare earth element. The rare earth element yttrium is particularly suitable. For semiconductor devices having other semiconductor circuits or elements above the wiring, a capping layer of HTS material is deposited over the wiring before a cover layer of dielectric is deposited.

Abstract: A dual damascene structure and method of fabrication thereof. An insulating layer comprises a first dielectric material and a second dielectric material, the second dielectric material being different from the first dielectric material. First conductive regions having a first pattern are formed in the first dielectric material, and second conductive regions having a second pattern are formed in the second dielectric material, the second pattern being different from the first pattern. One of the first dielectric material and the second dielectric material comprises an organic material, and the other dielectric material comprises an inorganic material. One of the first and second dielectric materials is etchable selective to the other dielectric material. A method of cleaning a semiconductor wafer processing chamber while a wafer remains residing within the chamber is also disclosed.

Abstract: Novel interconnect structures possessing an organosilicate dielectric material with unaltered physical and chemical properties post exposure to a specific resist ash chemistry for use in semiconductor devices are provided herein. The novel interconnect structure is capable of delivering improved device performance, functionality and reliability owing to the use of a chemically and physically “friendly” resist ash process. An in situ inert gas/H2 process achieves minimal chemical and physical reactivity with the organosilicate sidewalls during ashing owing to its inherent make up.

Abstract: Methods for filling high aspect ratio vias with conductive material. At least one high aspect ratio via is formed in the backside of a semiconductor substrate. The at least one via is closed at one end by a conductive element forming a conductive structure of the semiconductor substrate. The backside of the semiconductor substrate is exposed to an electroplating solution containing a conductive material in solution with the active surface semiconductor substrate isolated therefrom. An electric potential is applied across the conductive element through the electroplating solution and a conductive contact pad in direct or indirect electrical communication with the conductive element at the closed end of the at least one via (or forming such conductive element) to cause conductive material to electrochemically deposit from the electroplating solution and fill the at least one via. Semiconductor devices and in-process semiconductor devices are also disclosed.

Abstract: Leakage current generated in a PN junction diode is reduced, and charge-up current caused by plasma treatment in formation of wiring connected to the PN junction diode is controlled. An N+ region as a first conductive type impurity region provided in a Si substrate with an upper surface being exposed on one main surface of the Si substrate, a P+ polysilicon plug provided with a bottom being contacted with an upper surface of the N+ region, and wiring connected to a top of the P+ polysilicon plug are included.

Abstract: A method for producing a multi-chip module having application of at least one contact elevation onto a substrate, application and patterning of a rewiring device onto the substrate and the at least one contact elevation with provision of a contact device on the at least one contact elevation, application of a semiconductor chip onto the substrate with electrical contact-connection of the rewiring device; application of an encapsulating device that is not electrically conductive onto the semiconductor chip, the substrate, the rewiring device and the at least one contact elevation, the contact device on the at least one contact elevation at least touching a first surface of the encapsulating device; and repetition at least once of at least the first two steps, the first surface of the encapsulating device serving as a substrate and the correspondingly produced rewiring device making electrical contact with the contact device of the at least one contact elevation of the underlying plane.

Abstract: Provided are an anodic bonding structure, a fabricating method thereof, and a method of manufacturing an optical scanner using the same. Provided anodic bonding structure having a substrate and a glass substrate arranged above the substrate, includes at least one dielectric and at least one metal layer deposited between the substrate and the glass substrate, with a dielectric arranged uppermost, wherein the uppermost dielectric and the glass substrate are anodic bonded. Provided method of fabricating an anodic bonding structure having a substrate and a glass substrate arranged above the substrate, includes an act of depositing at least one dielectric and at least one metal layer between the substrate and the glass substrate, with dielectric arranged uppermost, and an act of anodic bonding the uppermost dielectric with the glass substrate.

Abstract: A method and apparatus for improved contact pad arrays and land patterns for integrated circuit packages are presented. A plurality of conductive pads are arranged in an array of rows and columns. At least one edge of a perimeter of the array is not fully populated with conductive pads. Spaces created in the edge by missing conductive pads create additional routing channels for signals from conductive pads within the array to be routed external to the array through the edge. A land pattern may have routing channels on one or more layers of a printed circuit board. In such a multi-layer land pattern, spaces can be created in edges on any number of the layers. Furthermore, corner pad arrangements having known routing channel characteristics can be used in any number of corners of a land pattern that incorporates spaces in an edge.

Abstract: The invention relates to a distribution device (1) for distributing liquid over an underlying catalyst bed comprising a horizontal collection tray (2) provided with at least one gas chimney (3) for upward or downward passage of gas and with liquid dosing nozzles (4) for downward passage of liquid, wherein the gas chimney(s) (3) and liquid doing nozzles (4) are separate from each other and do not have the same longitudinal axis, and wherein each liquid dosing nozzle (4) comprises a concentrically arranged liquid passing hole (5) and splash plate (6), wherein the splash plate (6) is located below the liquid passing hole (5) and below the collection tray (2) such that there is a free fall distance for liquid of at least 100 mm between the hole (5) and the splash plate (6). The invention further relates to a reactor for hydroprocessing comprising such distribution device (1), the use of such reactor for hydroprocessing and a process for hydrocracking or hydrotreating in such reactor.

Abstract: The method and apparatus for making a micro-dispersed gas-liquid mixture which includes a gas-liquid ejector unit, a cavitation unit and a jet dispersing unit installed in a sequence. All above referenced units are installed into a cylindrical housing which in turn includes bottom and top covers and also has a first partition having a conical orifice separating a gas-liquid ejector unit from a cavitation unit and a second partition separating a cavitation unit from a jet dispersing unit. The gas-liquid ejector unit has an inlet located at the bottom of the cylindrical housing for liquid and the inlet located on side surface of housing for gas, these being between bottom cover of the housing and the first partition. In addition, the inlet for liquid is a nozzle the top having both outside and inside parts of which are adapted to the conical orifice of first partition to provide a required flow-rate of an ejected gas through the gas inlet.

Abstract: A sheet for use in a heat exchange apparatus. The sheet includes a first vertical rib that extends in a first direction generally parallel to the vertical axis of the heat exchange apparatus, wherein said first vertical rib protrudes in a second direction out of the plane. The sheet also includes a second vertical rib that extends in the first direction along the sheet, substantially all the way between the first and second edges of the sheet generally parallel to the first vertical rib. The second vertical rib also protrudes in the second direction out of the plane. The sheet further includes a first horizontal rib that extends in a third direction along the sheet substantially all the way between the third and fourth edges of the sheet, wherein the first horizontal rib protrudes in a fourth direction opposite said second direction.

Abstract: To realize a method of manufacturing an electro-optical device, which is capable of completely dividing a plurality of substrates used for the electro-optical device along division lines, in a method of manufacturing the electro-optical device, two or more substrates used for electro-optical devices, which are adhered to each other, are divided along division lines. The method includes adhering, a first substrate and a second substrate, on whose one surface a plurality of grooves or a groove is formed in a predetermined width along a division line, to each other on the surface of the second substrate where the plurality of grooves or the one groove is formed and dividing generated cracks in the other surface of the first substrate, which is opposite to the surface adhered to the second substrate, along the division line to divide the first substrate and the second substrate that are adhered to each other.

Abstract: A high volume lens curing system is described. The high volume lens curing system is configured to cure multiple eyeglass lenses in a continuous manner.

Abstract: Process for manufacturing a mixture based on a plastic and on at least one additive, according to which: 1. the plastic in the form of powder or of pellets is dissolved in a solvent; 2. the additive(s) is/are introduced into the solution after or during the dissolution; 3. the precipitation of the plastic in solution is brought about by injecting a non-solvent.

Abstract: The manufacture of foamed polymer trim parts making use of physical blowing agents requires the diffusion and sorption of the blowing agent in the polymer melt. Said diffusion and sorption are achieved by intensive mixing. Therefore a statical mixing device is enclosed in a pressure chamber, which comprises a hollow porous cylinder, which has a surface suitable for contacting the melt with the blowing agent. The protrusions extending at least partially into the melt flow cause a multiple reorganisation of the polymer melt, which leads to thorough mixing and shortens the diffusion path. The statical mixing device, which may be of modular construction, increases mass transport and mixing by a small modification of a conventional injection molding machine.

Abstract: The method for introducing an additive into a flowing stream of media pulses discrete quantities of the additive into the stream at a pressure higher than the pressure of the stream and at set time periods to cause the pulses to penetrate into the stream. Use is made of a nozzle that can introduce the additive in flow and counterflow to the stream of media.

Abstract: A pressure container manufacturing method for manufacturing a pressure container by forming an outer shell made of a fiber reinforced composite material on a periphery of a liner, has: preparing a first fiber bundle which has a large diameter fiber bundle unimpregnated with a resin, and a second fiber bundle which has a small diameter resin bundle and a thermoplastic resin covering the small diameter resin bundle; forming a body on the periphery of the liner by braiding the first fiber bundle and the second fiber bundle with a braider; impregnating the first fiber bundle with the thermoplastic resin in the second fiber bundle which is heated and melted; and curing the thermoplastic resin to form the outer shell, wherein a tension applied to the first fiber bundle is larger than a tension applied to the second fiber bundle when forming the body and/or impregnating the thermoplastic resin.

Abstract: A system and method for pelletizing extruded materials, such as thermoplastic polymers in various pelletizing applications, including underwater, hot face, and strand pelletizing applications, utilizes a high pressure liquid delivered to one or more nozzles which direct a high pressure liquid jet cutting stream at the extruded polymer strand to cut the strand into pellets. The system and method are particularly applicable to underwater pelletizers utilizing water or water-based solutions. In a preferred underwater pelletizing embodiment, a plurality of nozzles are mounted on a rotating nozzle hub which is fed high pressure water through sealed hollow pelletizer and hollow motor shafts. The high pressure water jet cutting streams exiting the rotating nozzles are preferably in the form of a flat V-shaped spray with a spread angle of about 15° to about 45° and an approach angle between 0° and 60°, depending upon the pelletizing application.

Abstract: A blow molding system for forming a hole through a blow molded article includes a mold that houses an outer core pin and a pin support. During the blow molding process, a compression area is created in the mold. After the compression area is formed, the outer core pin and the pin support cooperatively cut out a portion of the compression area during the blow molding process. After the mold is opened, the cut-out portion of the compression area can be removed to expose the hole.

Abstract: A process for manufacturing an electret article, comprising passing melt-extruded thermoplastic resin fibers through a mist space substantially formed from droplets of a polar liquid, and then collecting the fibers, wherein the thermoplastic resin fibers contain electrical-chargeability enhancing agents, and the average diameter of the droplets is less than 20 ?m, is disclosed. Further, an apparatus for manufacturing an electric article, comprising (1) a means for melt-extruding a thermoplastic resin containing electrical-chargeability enhancing agents to form thermoplastic resin fibers; (2) a means for spraying droplets consisting essentially of a polar liquid to a space downstream of a direction of said thermoplastic resin extruded from said means for melt-extruding a thermoplastic resin, to thereby form a mist space, the average diameter of said droplets being less than 20 ?m; and (3) a means for collecting said thermoplastic resin fibers which have been passed through said mist space, is also disclosed.

Abstract: In one embodiment, an extrusion process can comprise: feeding a thermoplastic polycarbonate resin to an extruder; heating the resin in the extruder to a melt temperature that is above a glass transition temperature of the resin, thereby producing a melt of the thermoplastic polycarbonate resin; extruding the melted resin downwardly through an extrusion nozzle orifice having a slot configuration; passing the melted resin downwardly into a gap between two calendering rolls at least one of which has a highly polished surface, and wherein the calendering rolls are maintained at a roll temperature of less than the glass transition temperature; and cooling the thermoplastic polycarbonate resin film to below its glass transition temperature as the thermoplastic polycarbonate resin film advances through the gap.

Abstract: A solvent in which dichloromethane is mixed with alcohol as a poor solvent is used for preparing a dope. Alcohol is supplied to the dope in a inline pipe to mix with a static mixer, such as a casting dope in which a composition of alcohol is increased. The temperature of the rotary drum is adjusted to ?7° C. The casting dope is fed from a casting die to the rotary drum so as to form a casting film whose thickness is 40 ?m. Since the content of alcohol is high and a storage modulus of the cooled casting film is at least 150 thousands Pa, the peeling defect does not occur, and the stretch is reduced as far as possible. A gel-like film is dried by a tenter type drying device, and stretched such that the stretch ratio is at most 110%. The produced film is thin and excellent in a surface condition and optical isotropy.

Abstract: An article and a method for making the same are provided. In one aspect, the article includes a formable metal substrate, and at least one ionomer layer at least partially disposed on the formable metal substrate. In one aspect, the method includes disposing one or more pigmented ionomer layers at least partially on a first surface of a formable metal substrate, disposing one or more transparent ionomer layers at least partially on the one or more pigmented ionomer layers, and shaping the formable metal substrate having the ionomer layers disposed thereon.

Abstract: At least a winding of a stator stack 2 is molded by injecting a fused resin molding material into a space formed between a top mold and a bottom mold member. When the stator stack 2 of the resolver, which is annular and includes a coiled winding 7, is sandwiched between the top mold member 10 and bottom mold member 20, a movable disc 12 is urged by a spring device 13, into close engagement with the bottom mold member 20. While the movable disc 12 is closely engaged with the bottom mold member 20, the stack 2 of the resolver is sandwiched between the bottom mold member 20 and the top mold member 10. This method prevents the generation of gaps between the stator stack 2 and mold 10, 20 due to unevenness of the thickness in the stator stack 2.

Abstract: A method for pre-calendering a board web is provided and comprises passing the board web in a pre-calendering process through at least one hard nip, formed by a metal roll and a counter roll, and through at least one long nip, formed by a thermo roll and a long-nip roll or a long-nip belt assembly. The surface of the board web is moistened with water prior to the board web passing through the at least one hard nip.

Abstract: A method of making a plastics stretch film comprises the steps of taking a cast or blown film of LLDPE at a temperature of between 50° C. and 100° C., stretching it in two successive stretching steps, the first step having a stretch ratio higher than that of the second step, to cause both plastic and elastic deformation of the film. The film is then relaxed to substantially release all of the elastic deformation and winding the substantially relaxed film into rolls. Preferably, the first stretch ratio is in the range 1:1.70 to 1:1.80 and the second stretch ratio is in the range 1:1.85 to 1:1.95, and there is a reduction ratio of substantially 1:0.85 between the speed of the film during the second stretch rolling step and the speed of the film during wind-up.

Abstract: The present invention relates to a process for producing moldings from polyarylene sulfides, in particular polyphenylene sulfide, the result of which can be a particularly low level of flash formation.

Abstract: An injection molding machine (F) having a side-injection sub-assembly (30) and a method for readily providing access to a hot passage distributor system (40) contained therein are provided. The injection molding machine (F) includes a side-injection sub-assembly (30) having a tool injection part (B) and a hot passage distributor system (40). The hot passage distributor system (40) is sandwiched and fixedly held between the tool injection part (B) and a head plate (D). Specifically, two or more bolt members (10) attach the tool injection part (B) to the head plate (D) and are accessible from a side of the tool injection part (B). In that regard, these bolt members (10) can be detached to remove the tool injection part (B) from the hot passage distributor system (40) and provide access thereto. The injection molding machine (F) further includes a tool ejection part (A) for releasably mating to the tool injection part (B) and defining a mold cavity (28).

Abstract: The method of preventing adhesion of gypsum foreign matter comprises providing ultrasonic vibration to a member coming into contact with a gypsum slurry containing air bubbles.

Abstract: A method for manufacturing a resin mold includes the steps of: attaching a transmitting resin member capable of transmitting a laser beam and an absorbing resin member capable of absorbing the laser beam; and irradiating the laser beam on an interface between the transmitting resin member and the absorbing resin member from a surface of the transmitting resin member so that a welding spot is formed on the interface and the transmitting resin member and the absorbing resin member are welded. The laser beam is irradiated homogeneously on the interface by a homogenizer so that a center portion of the welding spot and an outer portion of the welding spot are heated homogeneously by the laser beam.

Abstract: A plate for use in mixing and testing materials in the pharmaceutical industry is formed by a method in which apertures in a set of greensheets are formed by a material removal process, at least some of the apertures being filled with a composite material combining a durable matrix material that remains in the final structure and a temporary material that is removed after the sintering step. An array of apertures is formed in a template plate by photolithographic means and transferred to an adjacent greensheet.

Abstract: A fume treatment system and method for treating a fume stream emitted from the mouth of a furnace chamber of a metal reclamation furnace system during a portion of the reclamation process includes an auxiliary hood that is smaller than the main overhead hood and is movable between an operative position over the furnace chamber mouth within the main overhead hood for collecting the fume stream emitted by the furnace chamber mouth and another position spaced from, the furnace chamber mouth. An incinerator is in fluid communication with the auxiliary hood when in the operative position. A fume stream blower causes the fume stream collected by the auxiliary hood when in the operative position to flow to the incinerator for incinerating hydrocarbons or other combustible compounds present in the fume stream during operation of the incinerator. A cyclone may be in the flow path between the auxiliary hood and the incinerator for removing particulates from the fume stream prior to entering the incinerator.

Abstract: Disclosed herein is a nano-powder extraction apparatus using the rotation of a hollow impeller, which is configured to extract nano-powder according to particle size thereof by effectively dissolving the nano-powder contained in plasma gas into a surfactant solution, and to prevent the aggregation of nano-powder as the nano-powder is absorbed in and collected by a surfactant of solution, thereby enabling the application of strongly reactive materials.

Abstract: A heat pipe assembly (10/110), under vacuum and having a working substance charged therein, comprising generally an evaporator (12/112) adapted to evaporate the working fluid and a condenser (16/116). The heat exchanging condenser is in fluid flow communication with the evaporator. The condenser is adapted to condense evaporated working substance received from the evaporator and has a reservoir (30/130), located at a higher elevation than the evaporator, for collecting liquid working fluid therein. A discrete, impermeable liquid return passage (36/136, 20/120) permitting the flow, by gravity, of the liquid working substance from the reservoir to the evaporator. The liquid return passage extends through the evaporator and terminates near the closed leading end thereof, and is fitted with a vent line (38/138) that diverts ascending vapor to the top of the condenser.

Abstract: A casting ladle has a body (2) with a base (3) and walls (4, 6, 8) made of a laminated composite ceramic material that includes multiple layers of a woven fiber reinforcing fabric embedded in a ceramic matrix. A rigid support element (20) for attaching the ladle to a handling device is embedded within the composite ceramic material. In a preferred form, the reinforcing fabric is made of woven glass and the matrix material includes calcium silicate and silica.

Abstract: An integrated plate assembly and method for forming an engine mount assembly comprises a unitary molded plate having an elongated fluid channel communicating between first and second sides of the plate. A cavity formed therein communicates with the first and second sides of the plate. The cavity receives a decoupling member having first and second surface areas facing outwardly toward the first and second sides of the plate.

Abstract: An anti-shift collar prevents lateral movement of a stabilizer bar assembly. The anti-shift collar is mounted to a fully formed stabilizer bar and then crimped to a central segment of the stabilizer bar at the desired position and is locked to the central segment thereby.

Abstract: A damper (7) includes a hollow outer elongated body (21) formed of a cylindrical member; a hollow inner elongated body (22) similarly formed of a cylindrical member; a viscous body (26) disposed in a cylindrical gap (25) between an inner surface (23) of the elongated body (21) and an outer surface (24) of the elongated body (22) in such a manner as to be in contact with the inner surface (23) and the outer surface (24) of these elongated bodies (21 and 22), respectively; rectangular attaching plate members (31 and 32) which are respectively secured to a closed-side other end portion (29), in an axial direction (X), of the elongated body (21) having one end portion (28) on an open end (27) side and to a closed-side one end portion (30) of the elongated body (22), respectively; and a holding means (33) for holding the gap (25) between the inner surface (23) of the elongated body (21) at the one end portion (28) of the elongated body (21) and the outer surface (24) of the elongated body (22).

Abstract: A suspension system includes a composite leaf spring having a mounting segment of a tapered width combined with an expanding depth. Any position along the longitudinal length of the mounting segment provides a singular cross-sectional shape taken parallel to an axle beam. An axle beam attachment system defines a cavity having a shape equivalent to the leaf spring at the predetermined location for mechanically interlocking the axle beam attachment system with the leaf spring at that predetermined location.

Abstract: A spring clamp has an elastically operable locating mechanism provided between two handles of the spring clamp, so that the two handles may instantaneously enter into a firmly braked position when the spring clamp clamps work pieces thereto, and immediately released from the braked position when a push button of the locating mechanism is pushed. The spring clamp with the elastically operable locating mechanism is more convenient for use without the risk of unexpectedly loosening from work pieces clamped thereto.