Abstract: A magnetoresistive element includes a first magnetic layer a magnetization direction of which is substantially pinned, a second magnetic layer a magnetization direction of which varies depending on an external field, a magnetic spacer layer provided between the first magnetic layer and the second magnetic layer, and electrodes which supply a current perpendicularly to a plane of a stacked film including the first magnetic layer, the magnetic spacer layer and the second magnetic layer. In this element, the magnetization directions of the first and the second magnetic layers are substantially orthogonal at zero external field.

Abstract: An MR element comprises: a tunnel barrier layer having two surfaces facing toward opposite directions; a free layer disposed adjacent to one of the surfaces of the tunnel barrier layer and having a direction of magnetization that changes in response to a signal magnetic field; and a pinned layer disposed adjacent to the other of the surfaces of the tunnel barrier layer and having a fixed direction of magnetization. The tunnel barrier layer is made of a material containing an oxide semiconductor such as ZnO. The MR element has a resistance-area product that falls within a range of 0.3 to 2.0 ?-?m2 inclusive.

Abstract: An alignment control film is formed on an alumina film by sputtering. A Ti film, a Ta film, a Ru film, a MgO film or the like is formed as the alignment control film. A lower shield layer is formed on the alignment control film. Crystal grains composing the lower shield layer will be of a columnar crystal grains. The lower shield layer will have the (111) surface exposed to the surface thereof when a Ti film, a Ta film or a Ru film is formed as the alignment control film, whereas the lower shield layer will have the (100) surface exposed to the surface thereof when a MgO film is formed as the alignment control film. A GMR film is then formed on the lower shield layer. The GMR film is formed by first allowing an anti-ferromagnetic film to epitaxially grow on the lower shield layer. The anti-ferromagnetic film will have also the (111) surface or the (100) surface reflecting the crystal structure of the lower shield layer.

Abstract: A magnetoresistive element has a ferromagnetic double tunnel junction having a stacked structure of a first antiferromagnetic layer/a first ferromagnetic layer/a first dielectric layer/a second ferromagnetic layer/a second dielectric layer/a third ferromagnetic layer/a second antiferromagnetic layer. The second ferromagnetic layer that is a free layer consists of a Co-based alloy or a three-layered film of a Co-based alloy/a Ni—Fe alloy/a Co-based alloy. A tunnel current is flowed between the first ferromagnetic layer and the third ferromagnetic layer.

Abstract: A method for providing a self-pinned differential GMR sensor and self-pinned differential GMR sensor. The differential GMR head includes two self-pinned GMR sensors separated by a gap layer. The gap layer may act as a bias structure to provide antiparallel magnetizations for the first and second free layers without using an antiferromagnetic layer. The gap layer may include four NiFe ferromagnetic layers separated with three interlayers. The gap may also be formed to include a structure defined by Ta/Al2O3/NiFeCr/CuOx. One of the pinned layer may include three ferromagnetic layers so that the top ferromagnetic layer of the bottom pinned layer and the bottom ferromagnetic layer of the bottom pinned layer have a magnetization 180° out of phase. The self-pinned GMR sensors may include synthetic free layers that includes a first free sublayer, an interlayer and a second free sublayer that are biased 180° out of phase.

Abstract: A spin valve structure is disclosed in which an AP1 layer and/or free layer are made of a laminated Heusler alloy having Al or FeCo insertion layers. The ordering temperature of a Heusler alloy such as Co2MnSi is thereby lowered from about 350° C. to 280° C. which becomes practical for spintronics device applications. The insertion layer is 0.5 to 5 Angstroms thick and may also be Sn, Ge, Ga, Sb, or Cr. The AP1 layer or free layer can contain one or two additional FeCo layers to give a configuration represented by FeCo/[HA/IL]nHA, [HA/IL]nHA/FeCo, or FeCo/[HA/IL]nHA/FeCo where n is an integer?1, HA is a Heusler alloy layer, and IL is an insertion layer. Optionally, a Heusler alloy insertion scheme is possible by doping Al or FeCo in the HA layer. For example, Co2MnSi may be co-sputtered with an Al or FeCo target or with a Co2MnAl or Co2FeSi target.

Abstract: A method for manufacturing a magnetic field detecting element having a free layer whose magnetization direction is variable depending on an external magnetic field and a pinned layer whose magnetization direction is fixed with respect to the external magnetic field, said free layer and said pinned layer being stacked with an electrically conductive, nonmagnetic spacer layer sandwiched therebetween, wherein sense current is configured to flow in a direction that is perpendicular to film planes of the magnetic field detecting element is provided. The method has the steps of: forming a spacer adjoining layer that is adjacent to said spacer layer, Heusler alloy layer, and a metal layer successively in this order; and forming either at least a part of said pinned layer or said free layer by heating said spacer adjoining layer, said Heusler alloy layer, and said metal layer. The spacer adjoining layer has a layer that is chiefly made of cobalt and iron.

Abstract: A system and method of electrostatic discharge (ESD) protection in a logic circuit using either state manipulation or current injection. A first system is disclosed that includes an ESD detection circuit for detecting an ESD event; and an ESD control circuit that can change a state of the logic circuit from a normal mode to an ESD mode in response to a signal received from the ESD detection circuit. A second system is disclosed that includes an attenuator circuit coupled to a chip pad; and a switch for diverting current from the attenuator circuit to an internal node of the logic circuit during an ESD event to reduce a voltage at the chip pad.

Abstract: A circuit and process is provided for protecting a device from the detrimental effects of electro-static discharge (ESD). The circuit includes an ESD breakdown device that is used to activate a current drawdown device. When a voltage exceeding the ESD breakdown device's breakdown voltage is applied, a signal is generated that causes the current drawdown device to pump current to ground. In this way, the effects of the ESD charge are substantially reduced. In one example, the ESD breakdown device is a reverse biased diode, and the current drawdown circuit includes a Darlington circuit. When an ESD surge causes the diode to breakdown, a signal is applied to the Darlington circuit, which pumps the ESD current safely to ground.

Abstract: An ESD bypass device for an emitter follower circuit includes a discharge device in parallel with the emitter follower circuit and control circuitry associated with the discharge device. The control circuitry is configured to prevent bypass current conduction through the discharge device in a normal mode of operation, and is configured to cause the discharge device to conduct bypass current during an ESD event. The control circuitry further includes a first transistor configured to pass input current to the discharge device for activating the discharge device during the ESD event, the first transistor further configured to prevent input current passing therethrough during the normal mode. A second transistor is configured to shunt leakage current, associated with the first transistor, from the input of the discharge device. The second transistor is further configured to prevent shunting of input current from the first transistor to the discharge device during the ESD event.

Abstract: A metal oxide varistor comprising one or more zinc oxide layers is formed integral to a ceramic substrate to provide ESD protection of a semiconductor device mounted to the substrate. The portion of the ceramic substrate not forming the varistor may be aluminum oxide, aluminum nitride, silicon carbide, or boron nitride. The varistor portion may form any part of the ceramic substrate, including all of the ceramic substrate.

Abstract: A protection system and method against short-circuits in electric power distribution architectures at two voltage levels, with a battery B1 and a second battery B2 at a higher voltage level, provided with automatic disconnection means SDB, and for differentiated supply of electric power to network sectors provided with power distribution units (10), (20), (30) to loads (12), (22), (23), (32), (33), said units (10), (20), (30) including a microcontroller (10a), (20a), (30a), said first battery B1 and sector or sectors it feeds being susceptible of being fed from the second battery B2, connected to a voltage generator by a converter DC/DC, comprising monitoring the voltage and current at the posts of said battery B1 and the state of the converter DC/DC, and if said state goes on to become a predetermined one and, then, said voltage and current levels exceed a threshold, microcontrollers (10a, 20a, 30a) are informed by a communications network N to carry out a short-circuit protection process.

Abstract: An electrical distribution system includes a distribution board having input connectors for live and neutral lines from an electricity supply and an earth line; and a plurality of circuit breakers connected to the live line, characterized in that the distribution board has a plurality of three-terminal output connectors, each output connector being wired to the neutral and earth lines and to a power output line of a respective circuit breaker, the output connectors being engageable with complimentary connectors for the distribution of electrical energy from the distribution board.

Abstract: When a generator shuts down intentionally or un-intentionally the low frequency switch disconnects a load from a generator before the output frequency of the generator drops below a preset frequency. Without the low frequency switch on some loads, such as a motor, the current will rise to several times the running current of the motor before the generator coasts to a stop. If this load is switched over to a source with insufficient capability to handle the high current, caused by low frequency operation of the load, serious damage can take place to the new source.

Abstract: A universal device for saving the standby power consumption of a functional group of appliances that can be constituted equally well by a set of items of computer equipment or a set of items of audiovisual equipment. The device includes at least one control device for switching on the functional group that is exclusively dedicated to the device, parts for connection to the electricity network and parts for connection to at least one main controlled appliance.

Abstract: A circuit breaker includes separable contacts, an operating mechanism structured to open and close the separable contacts, and a trip mechanism. The trip mechanism includes a sensor structured to sense current flowing through the separable contacts, a processor cooperating with the sensor to determine a plurality of different trip conditions responsive to the sensed current, a nonvolatile memory operatively associated with the processor, and a trip actuator cooperating with the processor and the operating mechanism to trip open the separable contacts responsive to one of the different trip conditions from the processor. The processor is structured to save in and retrieve from the nonvolatile memory cause-of-trip information for the different trip conditions including the one of the different trip conditions.

Abstract: Retainers for movable surge arrester disconnectors to prevent relative displacement of the disconnectors with respect to the arrester within predetermined limits.

Abstract: In a machine tool with at least two axes of movement (2, 7) defining, respectively, the mobility of a first function-supporting unit (1) and of a second function-supporting unit (5), only the first function-supporting unit (1) is provided with its own servo drive, while the second function-supporting unit (5) is driven by the movement of the first function-supporting unit (1) through a coupler unit (13) that can be switched between an engaged and a disengaged state.

Abstract: An electronic weapon impedes locomotion by a target by conducting a current through an electrode and through the target to produce contractions in skeletal muscles of the target that impede locomotion by the target. The weapon may include a deployment unit to deploy one or more electrodes in trajectories away from the apparatus toward the target. The deployment unit may include covered tubes for the electrodes. Removing the cover may be accomplished with a ram urged against the interior of the cover by an electrode so that the electrode does not touch the cover. The cover may include frangible material with grooves for repeatable material separation. The cover may include fasteners that simplify assembly of the cover onto the body of the deployment unit. The fasteners may include hooks with grooves that disjoin from the cover enabling a more repeatable removal of the cover. Electrode trajectories are more accurate as a result of operation of the rams and the structures of the frangible cover.

Abstract: The Laser Engagement Stun System, which is a man Worn Apparatus is designed for Training exercises in Force-on Force or One-on-One training. The L.E.S.S. system receives and analyzes incoming laser light signals while disregarding ambient light signals from the environment. It then generates a High Voltage low amperage pulsed shock or stun that is delivered to the person wearing the LESS. Each person in the exercises will be equipped with the Laser Engagement Stun System. A component and vital part of the system is the weapons mounted Visible Laser Light device attached to each persons weapon. The attached laser light device will be activated when the individual person pulls the trigger on their weapon and cause a Blank Round to be discharged or from a Dry Fire.

Abstract: The object of this invention is to provide that an electrostatic chuck device which can properly and promptly diselectrify a substrate to be processed. In an electrostatic chuck device (11) attracting a substrate (W) to be processed on the surface of a susceptor (12) electrically, a diselectrifying circuit is provided which includes diselectrifying electrode means (16) facing the surface of the susceptor (12), a diselectrifying potential (19), and a diselectrifying resistance (17) connected between the diselectrifying electrode means (16) and the diselectrifying potential (19).

Abstract: A monolithic ceramic electronic component includes a ceramic laminate provided with ceramic layers and internal electrode layers disposed between the ceramic layers such that a portion of each internal electrode is led to an end surface of the ceramic laminate and the external electrode disposed on the end surface of the ceramic laminate to which the internal electrode layers are led, so as to connect to the internal electrode layers. At least one end portion in a longitudinal direction of an exposed portion of the internal electrode layer led to and exposed at the end surface of the ceramic laminate is covered with a glass film, and the internal electrodes and the external electrode are electrically connected to each other at a portion not covered with the glass film in the exposed portion of the internal electrode layer.

Abstract: An integrated shunt capacitor comprises a bottom plate (62), a capacitor dielectric (92) overlying a portion of the bottom plate, a top plate (64) overlying the capacitor dielectric, a shield (74) overlying a portion of the top plate; and a metallization feature (70) disposed about and isolated from at least two sides of the top plate, the metallization feature for coupling the bottom plate to the shield. In one embodiment, an RF power transistor has an impedance matching network including an integrated shunt capacitor as described herein.

Abstract: In a method of manufacturing a solid electrolytic capacitor, at first, an anodic oxide film is formed on the surface of an aluminum base. Then, a solid electrolyte layer is formed of a conductive polymer or the like on the anodic oxide film. Then, a cathode electrode portion including a silver paste layer is formed on the solid electrolyte layer. Then, a conductive paste is coated on the anodic oxide film on one side of the aluminum base and cured, thereby forming a metal silver layer. Then, a laser beam is irradiated from the opposite side of the aluminum base to weld together the aluminum base and the metal silver layer, thereby forming an anode electrode portion.

Abstract: A mounting arrangement for the starting system of a compressor of the type which comprises a shell carrying, externally: energization pins; and a starting module having an electrically non-conductive basic body fitted to said energization pins, said arrangement comprising a lock means carried by one of the parts of shell and basic body and which is elastically deformable between a locking position and a releasing position; and a lock receiving means carried by the other of said parts, said lock means being removably engaged to the lock receiving means upon the mounting of the basic body to said energization pins, in order to lock said parts against displacements that might provoke disconnection of the basic body in relation to energization pins.

Abstract: A processing apparatus that processes a wooden piece into a predetermined shape by compression, includes a pair of metal molds that serve to hold and to apply compressing force onto a wooden piece cut out from uncompressed raw wood. At least one of the metal molds has a portion containing iron.

Abstract: An information processing device may include a device main body including a keyboard, and a display slidably supported by the device main body, wherein the device main body may include a support section for slidably supporting the display, and a pair of grip sections positioned on both sides of the display continuously to the support section and to be grasped by the user, the pair of grip sections may be formed so as to protrude in a display arrangement direction in which the display may be arranged with respect to the support section, and an operation section to be operated by the user may be disposed on a surface of the pair of grip sections in the direction of protrusion.

Abstract: A slim profile foldable device has a body and a cover configured for articulated movement about a pivot axis between a closed position and an open position. A frame member is configured for co-operative connection with the body and with the cover and bendable about a folding axis and is non-accessible in the device's closed position and is accessible in the device's open position. The frame member may comprise two sections joined by a compliant hinge configured to bend about the folding axis when the device moves between the open and closed positions and comprises a substantially smooth outward facing surface in the device open position.

Abstract: A computer enclosure includes a chassis (10), a front panel (20), and a bezel (30). The chassis has a positioning tab (123) with a pivot hole (125) defined therein. The front panel is fixed on the chassis, and defines an opening (22) adjacent the positioning tab of the chassis. The bezel has a bent portion (32). The bent portion is inserted through the opening of the front panel and pivotably engaged into the pivot hole of the positioning tab of the chassis.

Abstract: An exemplary fixing mechanism for a data storage device includes a case, and a latch member. The data storage device includes two pairs of guiding pins attached to sidewalls thereof. The case includes a first panel, and a second panel. The first panel includes an opening defined therein, and a first plate perpendicularly extending from an edge of the opening. The second panel includes a bracket to hold a component other than the data storage device therein. The bracket includes a wall parallel to the first plate. A pair of first sliding channels is defined in the wall and a second sliding channel is defined in the first plate, for slidably receiving the guiding pins therein. The latch member is attached to the first plate and includes a resilient arm. A positioning space is defined in the resilient member to hold the corresponding guiding pin therein.

Abstract: A mounting apparatus for retaining a data storage device (60) in a computer includes a bracket (10) and a driving member (30). The data storage device defines a locking hole (63) therein. The bracket includes a first side panel (12) and a second side panel (11) for mounting the data storage device therebetween. A resilient retaining member (126) is formed at the first side panel (12). A retaining tab (1264) is formed on a free end of the retaining member corresponding to the locking hole of the data storage device. The driving member is pivotably attached on the first side panel. An actuating portion (373) is formed on the driving member for urging movement of the retaining member.

Abstract: A disk device with a dual vibration-proof structure comprises a body, a loader, a plurality of springs, a plurality of crash pads, and a hard disk. Two ends of the body are formed with a plurality of first fixed parts and two sides upwards extend respectively to be first sidewalls. Two sides of the loader upwards extend respectively to be second sidewalls, each of which is provided with a plurality of second parts and a plurality of holding rods. One end of the spring is connected to the corresponding first fixed part and the other end is connected to the corresponding second fixed part. One end of the crash pad is set at the first sidewall and the other end is connected to the corresponding supporting rod. The hard disk is set in the loader. Thus, the disk device with the dual vibration-proof structure is implemented.

Abstract: A locking device includes a case defining at least one slot therein, a hook module including at least one hook for passing through the at least one slot, a linkage module includes at least one first lever configured for shifting the at least one hook to move between a locking position and a releasing position, and a positioning module for releasably engaging with the first lever. When the at least one hook is shifted to the releasing position, the first lever is blocked by the positioning module, when the at least one hook is shifted to the locking position, the first lever is released by the positioning module.

Abstract: An apparatus for attaching a processor and corresponding heat sink to a circuit board includes a board member, a frame member mounted on the board member, a plurality of connector portions on the frame member, and a resilient load member. The resilient load member has a first end moveably connected to one of the connector portions and a second end forcibly connected to another one of the connector portions. A processor socket is mounted on the board member and a processor is seated in the processor socket. Forcible connection of the second end to its connector portion deforms the load member into engagement with the processor and urges the processor into the processor socket. A heat sink is mounted to the frame member and in thermal contact with the processor.

Abstract: A heat dissipating system includes a chassis (10), and a fan (50). The chassis includes a rear plate (14). The rear plate has an inner surface. The fan is secured to the rear plate inside the chassis. A distance is formed between the fan and the inner surface of the rear plate.

Abstract: An external heat dissipator for a heat generating source having a heat dissipating vent includes a casing adapted to connect to the heat dissipating vent and having an outlet adapted to correspond to and align with the heat generating vent and an inlet communicating with the outlet for allowing air inside the heat generating source to escape therefrom. A fan assembly is securely received in the casing to generate air flow inside the heat generating source for dissipating heat inside the heat generating source. A connection device is provided to engage the casing with the heat dissipating vent of the heat generating source.

Abstract: A power converter with a fan assembly cools down a temperature of the power converter. The power converter with a fan assembly includes a housing, a plate, and a second plate. The housing includes a fan assembly (which is integral to the housing) to draw in air. The plate is coupled to the housing to create an air channel between the plate and the housing and the second plated is coupled to the housing to create a second air channel between the second plate and the housing. The fan assembly draws in air through one of the air channel or the second air channel and moves air out through the other of the air channel and the second air channel to cool down the temperature of the power adapter.

Abstract: An external heat dissipator for a heat generating source having a heat dissipating vent includes a casing adapted to connect to the heat dissipating vent and having an outlet adapted to correspond to and align with the heat generating vent and an inlet communicating with the outlet for allowing air inside the heat generating source to escape therefrom. A fan assembly is securely received in the casing to generate air flow inside the heat generating source for dissipating heat inside the heat generating source. A connection device is provided to engage the casing with the heat dissipating vent of the heat generating source.

Abstract: The integrity of the data center cooling system is maintained by using separate and independent cooling loops to collect heat from electronic components housed in modular units. According to one embodiment of the present invention, a first cooling loop is associated with each modular unit. The first cooling loop comprises a coolant that accepts heat from electronic components housed within the modular unit and transports the heat to a heat exchanging system. The heat exchanging system conducts heat from the coolant of the first loop to coolant associated with the data center cooling system. Coolant from the data center cooling system accepts heat from the coolant associated with the first loop and conveys it away from the data center.

Abstract: A cooling module includes a thermally conductive plate, a bladder disposed on at least one side of the plate, the bladder have a chamber, and fluid disposed in the chamber of the bladder wherein the bladder in an inflated state impresses the cooling module against an adjacent electronic circuit card. where the cooling module is forcibly pressed against adjacent electronic circuit card providing increased physical stability to the electronic circuit card as well as provide a cooling technique for the circuit card.

Abstract: A liquid-cooling heat dissipating device for dissipating heat by a casing includes a casing having a liquid flow channel and a heat dissipating fin, both integrally formed on a wall of the casing. The casing includes a panel having a cold connector and a hot connector. The cold connector is connected to a water tank and the hot connector is connected to the liquid flow channel. Another end of the connectors are connected to a water-cooling connector through a pipeline, and the water-cooling connector is installed at a heat source, such that the pipeline sends heated liquid to the liquid flow channel on the wall of the casing, and the heat dissipating fin on the casing dissipates the heat to the outside, and the cooled liquid is returned to the water tank and sent to the water-cooling connector on the heat source by the pipeline for repeated cycles.

Abstract: An apparatus may include a thermally-conductive heat sink core having at least one surface, a solid-state heat pump including a first surface and a second surface, the first surface in contact with the at least one surface of the core, and a thermally-conductive unit in contact with the second surface of the solid-state heat pump. Also included may be a stop in contact with the thermally-conductive unit, disposed at least partially over the first end of a cavity defined by the thermally-conductive unit, and defining an opening, and a fastener passing through the cavity, in contact with the core, and to bias the core toward the stop.

Abstract: A modular heat sink and semiconductor chip assembly includes a semiconductor chip, a base plate disposed in a heat conducting relationship with the semiconductor chip and containing a plurality of slots extending through the base plate, a plurality of fins individually passed through a number of the plurality of slots and containing voltage less input/output connections to facilitate grounding with the chip, and at least one electrical component passed through one of the plurality of slots and containing a high-density input/output structure on one edge and is electrically connected to the semiconductor chip.

Abstract: Fiber optic phototherapy devices include fiber optic light emitters having fiber optic end portions at one or both ends that may be separated into a plurality of groups of end portions that receive light from one or more light emitting diodes (LEDs). Lenses may be used to focus the light from one or more LEDs onto the end portions. The LEDs may be mounted to a heat sink to dissipate any excess heat generated by the LEDs.

Abstract: A power supply apparatus includes an insulating housing, a printed circuit board and at least an electronic component. The insulating housing has a substantially closed receptacle and made of a material having a thermal conductivity in a range of from 2.0 to 10.0 W/mK. The printed circuit board is accommodated within the receptacle of the insulating housing. The electronic component is mounted on the printed circuit board.

Abstract: Embodiments of the invention provide single loading mechanism that both pushes a semiconductor package against a socket and pushes a cooling solution against the semiconductor package. This loading mechanism may take up less motherboard real estate than if two different attachment and loading mechanisms were used.

Abstract: The present invention relates to a shelf for holding printed circuit boards; the shelf comprises a first frame and a second frame, adapted to hold printed circuit boards, and a panel provided with two opposite sides, wherein the first frame is mounted on a first of the two sides and the second frame is mounted on a second of the two sides; the shelf comprises further cooling means adapted to generate an airflow for cooling the printed circuit boards held by the first frame and deflecting means adapted to deflect at least part of said airflow for cooling the printed circuit boards held by the second frame.

Abstract: In order to improve the heat dissipation capacity in an electronic circuit configuration with one or more printed circuit boards thermally coupled by one flat side to a heat sink having at least one coolant duct, the flat side immediately adjoins the coolant duct.

Abstract: Systems are disclosed in which a first receiver circuit of an integrated circuit die, the die having conductive die pads for electrical signal transfer between conductive pathways inside the die and conductive pathways outside the die, the first receiver circuit having an input connected to a first die pad and an output connected to a first logic circuit of the die and a second receiver circuit of the integrated circuit die, the second receiver circuit having an input connected to a second die pad and an output connected to a second logic circuit of the integrated circuit die, where both receiver circuits are configured to receive the same signals.

Abstract: A power module includes a power switching device and a flexible circuit with first and second traces electrically connected to the switching device, the first and second traces serving as an input signal carrier and an output signal carrier for the switching device.